公开(公告)号：US11681336B2

公开(公告)日：2023-06-20

申请号：US17375380

申请日：2021-07-14

Applicant: INTERFACE TECHNOLOGY (CHENGDU) CO., LTD. ,  INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD. ,  INTERFACE OPTOELECTRONICS (WUXI) CO., LTD. ,  GENERAL INTERFACE SOLUTION LIMITED

Inventor： Chun Ting Pan ,  Feng Chun Hsieh ,  Yi Hsin Lin

IPC: G06F1/18 ,  B32B37/12 ,  B32B38/10

CPC classification number: G06F1/181 ,  B32B37/1284 ,  B32B38/10 ,  B32B2457/202 ,  B32B2457/208

Abstract: A removable adhesive member and a display device using the same is provided. The removable adhesive member includes a first adhesive section, a first connecting section, and a tearing portion. The two opposite surfaces of the first adhesive section respectively adhere to the two objects. The first connecting section is connected to the first adhesive section. The first connecting section includes a first adhesive layer and two first protective layers. One side of the first adhesive section extends to form the first adhesive layer. The first protective layers are respectively laminated to two opposite surfaces of the first adhesive layer. The tearing portion is connected to the first adhesive section through the first connecting section, thereby avoiding rupture in pulling the tearing portion. The tearing portion is conveniently pulled up by a user, such that the first adhesive section removes from the objects to disassemble the objects.

公开(公告)号：US20230178521A1

公开(公告)日：2023-06-08

申请号：US17580616

申请日：2022-01-20

Applicant: Interface Technology (ChengDu) Co., Ltd. ,  Interface Optoelectronics (ShenZhen) Co., Ltd. ,  Interface Optoelectronics (Wuxi) Co., Ltd. ,  General Interface Solution Limited

Inventor： Chih-Wei LAI ,  Hui-Ping SHEN

IPC: H01L25/075 ,  H01L33/50 ,  H01L33/00 ,  H01L33/44

CPC classification number: H01L25/0753 ,  H01L33/502 ,  H01L33/005 ,  H01L33/44 ,  H01L2933/0041 ,  H01L2933/0025

Abstract: The present disclosure provides a micro light emitting diode display including a metal substrate, a plurality of micro light emitting diode chips on the metal substrate, a plurality of light absorbing layers on the metal substrate between the micro light emitting diode chips, a light conversion layer above the micro light emitting diode chips, and a cover plate above the light conversion layer, where sidewalls of the micro light emitting diode chips are separated by a gap, and where a contact angle of the light absorbing layers is between 0 degree and 30 degrees.

公开(公告)号：US11669046B2

公开(公告)日：2023-06-06

申请号：US17326351

申请日：2021-05-21

Applicant: Interface Technology (ChengDu) Co., Ltd. ,  Interface Optoelectronics (ShenZhen) Co., Ltd. ,  Interface Optoelectronics (Wuxi) Co., Ltd. ,  General Interface Solution Limited

Inventor： Shih-Yu Wang ,  Chun-Ta Chen ,  Shiuan-Huei Lin ,  Zih-Fan Chen ,  Wan-Lin Li ,  Yi-Hsin Lin ,  Yu-Jen Wang ,  Wei-Cheng Cheng ,  Chang-Nien Mao

IPC: G02B27/01 ,  G03H1/22 ,  G02F1/29 ,  G09G3/34 ,  G09G3/36

CPC classification number: G03H1/2202 ,  G02B27/0172 ,  G02F1/29 ,  G09G3/3413 ,  G09G3/36 ,  G02B2027/0123 ,  G02B2027/0174 ,  G03H2223/16 ,  G03H2223/18 ,  G03H2223/23

Abstract: A display device includes a light source, a waveguide element, a liquid crystal coupler, a first holographic optical element and a second holographic optical element. The light source is configured to emit light. The waveguide element is located above the light source. The liquid crystal coupler is located between the waveguide element and the light source. The first holographic optical element is located on a top surface of the waveguide element, in which the liquid crystal coupler is configured to change an incident angle that the light emits to the first holographic optical element. The second holographic optical element is located on the top surface of the waveguide element, and there is a first distance in a horizontal direction between the first holographic optical element and the second holographic optical element, in which the second holographic optical element is configured to diffract the light to the waveguide element below.

公开(公告)号：US11659655B2

公开(公告)日：2023-05-23

申请号：US17453541

申请日：2021-11-04

Applicant: INTERFACE TECHNOLOGY (CHENGDU) CO., LTD. ,  INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD. ,  INTERFACE OPTOELECTRONICS (WUXI) CO., LTD. ,  GENERAL INTERFACE SOLUTION LIMITED

Inventor： Chia Ming Fan ,  Po Lun Chen ,  Chun Ta Chen ,  Po Ching Lin ,  Ya Chu Hsu ,  Chin I Tu ,  Kuo Fung Huang

IPC: H05K1/02

CPC classification number: H05K1/0283

Abstract: A tensile electronic module and electronic device using the same are provided. The tensile electronic module includes two electrical components and a stretchable trace connected between the two electrical components. The stretchable trace includes two arcs and at least three circular segments. The circular segments are connected to each other and have at least two various central angles. Each of the arcs is configured at one end of the circular segments for respectively connecting with one of the electrical components. The tensile electronic module proposed in the invention achieves to reduce tensile stress of the stretchable trace in multiple directions and can be further applied to an electronic device which is stretchable or having a curved surface. Damages caused by stress accumulation when the stretchable trace is stretched in different directions are therefore avoided. Therefore, it is believed reliability and service life of the electronic device are greatly improved.

公开(公告)号：US20230152690A1

公开(公告)日：2023-05-18

申请号：US17569809

申请日：2022-01-06

Applicant: INTERFACE TECHNOLOGY (CHENGDU) CO., LTD. ,  INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD. ,  INTERFACE OPTOELECTRONICS (WUXI) CO., LTD. ,  GENERAL INTERFACE SOLUTION LIMITED

Inventor： HUNG-HSIN SHIH

IPC: G03F7/00 ,  G02B27/01 ,  G02B6/10 ,  G03F1/54

CPC classification number: G03F7/0007 ,  G02B27/0172 ,  G02B6/10 ,  G03F1/54 ,  G02B2027/0178

Abstract: Methods for fabricating an optical waveguide and a display device and a photomask used therein is provided. Firstly, a photomask is provided, wherein the photomask has light blocking structures regularly distributed. A first light curing resin layer is formed on a first transparent substrate. Next, the photomask is placed on the first light curing resin layer. The first light curing resin layer is irradiated and cured with incident light through the photomask and the light blocking structures to have a first curing level and a first refractive index. The first curing level and the first refractive index, corresponding to each other, are periodically distributed. Finally, the photomask is removed from the first light curing resin layer to form an optical waveguide with the first light curing resin layer having the first curing level that is periodically distributed and the first transparent substrate.

公开(公告)号：US11600242B2

公开(公告)日：2023-03-07

申请号：US17204965

申请日：2021-03-18

Applicant: Interface Technology (ChengDu) Co., Ltd. ,  Interface Optoelectronics (ShenZhen) Co., Ltd. ,  Interface Optoelectronics (Wuxi) Co., Ltd. ,  General Interface Solution Limited

Inventor： Po-Lun Chen ,  Chun-Ta Chen ,  Chih-Lin Liao ,  Fu-Cheng Wei ,  Po-Tsun Liu ,  Guang-Ting Zheng ,  Ting-Yu Wei

IPC: G09G3/36

Abstract: A single-stage gate driving circuit with multiple outputs includes a first bootstrapping circuit, a first pre-charge circuit, a first output control circuit, a second bootstrapping circuit, a second pre-charge circuit, and a second output control circuit. During a first duration, the first pre-charge circuit precharges a first node to a first voltage. During a second duration, the first bootstrapping circuit boosts the first node from the first voltage to a second voltage, and the second pre-charge circuit precharges a second node to a fourth voltage. During a third duration, the first output control circuit boosts the first node from the second voltage to a third voltage, and the second bootstrapping circuit boosts the second node from the fourth voltage to a fifth voltage. During a fourth duration, the second output control circuit boosts the second node from the fifth voltage to a sixth voltage.

公开(公告)号：US11594065B2

公开(公告)日：2023-02-28

申请号：US17689272

申请日：2022-03-08

Applicant: INTERFACE TECHNOLOGY (CHENGDU) CO., LTD. ,  INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD. ,  GENERAL INTERFACE SOLUTION LIMITED

Inventor： Chun Te Chang ,  Chung Wu Liu ,  Ming Chiang Yu ,  Chia Yuan Wu

IPC: G06V40/13 ,  H05K13/04 ,  G02B27/30

Abstract: An optical image recognition device and a method for fabricating the same are disclosed. The device includes a flexible printed circuit board, an image sensor, a glue, an optical collimator, a supporting ring, a sealant, and an optical filter. The top of the flexible printed circuit board is provided with a recess, the image sensor is located in the recess, the sidewalls of the image sensor and the recess are separated from each other, and the image sensor is coupled to the flexible printed circuit board through conductive wires. The glue adheres to the flexible printed circuit board and the image sensor and covers the conductive wires. The optical collimator is disposed on the image sensor. The supporting ring, disposed on the flexible printed circuit board, surrounds the glue and the optical collimator. The optical filter, disposed on the sealant, shields the optical collimator and the image sensor.

公开(公告)号：US20230058420A1

公开(公告)日：2023-02-23

申请号：US17483134

申请日：2021-09-23

Applicant: INTERFACE TECHNOLOGY (CHENGDU) CO., LTD. ,  INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD. ,  INTERFACE OPTOELECTRONICS (WUXI) CO., LTD. ,  GENERAL INTERFACE SOLUTION LIMITED

Inventor： CHE WEN CHIANG ,  TSUNG YI SU ,  PO LUN CHEN

IPC: H01L33/62 ,  H01L25/075

Abstract: A LED display structure and its display module thereof are provided. The LED display module includes a LED array, a substrate disposed below the LED array, and at least one trace configuration layer, which is disposed below the LED array and adjacent to the substrate. The at least one trace configuration layer includes a plurality of wires, and a distribution density of the wires varies according to a distance between the wires and the LED array. When the distance increases, the distribution density of the wires is denser. Otherwise, the distribution density is sparse when the wires are closer to the LED array. In view of the simulation experimental analyses of the present invention, it is believed that at least 30% of the stray light ratio can be reduced so as to enhance the LED display structure with better transparency and image quality.

公开(公告)号：US20230055037A1

公开(公告)日：2023-02-23

申请号：US17448706

申请日：2021-09-24

Applicant: Interface Technology (ChengDu) Co., Ltd. ,  Interface Optoelectronics (ShenZhen) Co., Ltd. ,  Interface Optoelectronics (Wuxi) Co., Ltd. ,  General Interface Solution Limited

Inventor： Tien-Chang LU ,  Kuo-Bin HONG ,  Lih-Ren CHEN ,  Ten-Hsing JAW

IPC: H01S5/11 ,  H01S5/0225 ,  H01S5/34 ,  H01S5/183

Abstract: A photonic crystal surface-emitting laser includes a substrate, an n-type cladding layer, an active layer, a photonic crystal structure, a p-type cladding layer, an n-type semiconductor layer and a meta-surface structure. The n-type cladding layer is disposed over the substrate. The active layer is disposed over the n-type cladding layer. The photonic crystal structure is disposed over the active layer. The p-type cladding layer is disposed over the photonic crystal structure. The n-type semiconductor layer is disposed over the p-type cladding layer. The meta-surface structure disposed on a surface of the n-type semiconductor layer away from the p-type cladding layer.

公开(公告)号：US20230014671A1

公开(公告)日：2023-01-19

申请号：US17490099

申请日：2021-09-30

Applicant: Interface Technology (ChengDu) Co., Ltd. ,  INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD. ,  GENERAL INTERFACE SOLUTION LIMITED

Inventor： KUANG-WEI LIU

IPC: H01L33/40 ,  H01L25/075

Abstract: A light emitting diode includes a light emitting portion, a first electrode, a first reflecting portion, and a second electrode. The first reflecting portion includes conductive material. The first electrode is in electrical contact with the first reflecting portion. The second electrode is electrically connected to the light emitting portion. The first electrode and the second electrode receive different driving voltages and apply the driving voltage to the light emitting portion to drive the light emitting portion to emit light, the first reflecting portion being configured to reflect the light from the light emitting portion.