公开(公告)号：US20220228909A1

公开(公告)日：2022-07-21

申请号：US17612916

申请日：2020-05-12

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Daniel Dietze ,  Wolfgang Zinkl

IPC: G01J1/42 ,  G01J1/04

Abstract: In an embodiment, an optoelectronic measuring device 1ncludes a first detector configured to provide a first detector signal, a second detector configured to provide a second detector signal, wherein each of the first detector and the second detector is configured to detect electromagnetic radiation, a signal difference determiner configured to generate a difference signal by subtracting the second detector signal from the first detector signal and a spectral filter arranged in a beam path upstream of the second detector, wherein the spectral filter is configured to filter the electromagnetic radiation before detection by the second detector, wherein the optoelectronic measuring device is configured to measure an intensity of the electromagnetic radiation impinging on the optoelectronic measuring device.

公开(公告)号：US20220223570A1

公开(公告)日：2022-07-14

申请号：US17614249

申请日：2020-05-27

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schwarz ,  Sebastian Wittmann ,  Andreas Plößl

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/46 ,  H01L33/00 ,  H01L27/14

Abstract: In an embodiment an arrangement includes a plurality of optoelectronic semiconductor components arranged in a common plane, wherein each semiconductor component is laterally delimited by side faces, and wherein each semiconductor component includes a semiconductor body having an active region configured to emit electromagnetic radiation, a radiation outlet side configured to couple out the electromagnetic radiation, a rear face opposite to the radiation outlet side, and a contact structure arranged on the rear face, an output element, an electrically insulating insulation layer and an electrical connection structure, wherein the insulation layer is arranged between side faces of adjacent semiconductor components, wherein the output element is arranged at the radiation outlet sides of the semiconductor components, wherein the electrical connection structure is electrically conductively connected with the contact structure, and wherein the connection structure includes an adhesive layer, a growth layer and a connection layer.

公开(公告)号：US20220216076A1

公开(公告)日：2022-07-07

申请号：US17604977

申请日：2019-07-22

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Hubert Halbritter ,  Alexander Pfeuffer ,  Mikko Peraelae

IPC: H01L21/67 ,  H01L21/683

Abstract: In an embodiment an adhesive transfer stamp for transferring semiconductor chips includes a volume region including an electrically insulating material, at least one adhesive surface configured to receive a semiconductor chip and an electrically conductive element configured to electrically conductively connected to a ground conductor during operation and to dissipate electrical charges from the semiconductor chip to the ground conductor, wherein the volume region is embodied as a solid body, and wherein the volume region has at least one stepped structure.

公开(公告)号：US20220209073A1

公开(公告)日：2022-06-30

申请号：US17611502

申请日：2020-04-15

Applicant: OSRAM Opto Semiconductors GmbH ,  Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.

Inventor： Vesna MÜLLER ,  David O'BRIEN ,  Gerhard DOMANN ,  Peer LÖBMANN

IPC: H01L33/44 ,  H01L33/00 ,  H01L33/50 ,  C09D183/04

Abstract: A method for producing an optoelectronic component is described with the steps of providing monomeric structural units, providing nanoparticles in a liquid medium, mixing the monomeric structural units and the nanoparticles in the liquid medium so that a starting sol is formed, introducing an acid into the starting sol to adjust a pH value, at least partial condensation of the monomeric structural units to form a network, wherein the nanoparticles are at least partially covalently bonded to the network, so that a sol-gel material is formed, applying the sol-gel material to a semiconductor chip, curing the sol-gel material to form a coating material. Furthermore, an optoelectronic component is specified.

公开(公告)号：US20220199405A1

公开(公告)日：2022-06-23

申请号：US17127264

申请日：2020-12-18

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Darshan Kundaliya

IPC: H01L21/02 ,  H01L33/26 ,  H01L31/032

Abstract: In an embodiment, a method includes providing a substrate and epitaxially growing a semiconductor layer of a semiconductor material on the substrate using physical vapor deposition, wherein the semiconductor material has a tetragonal phase, wherein the semiconductor material has the general formula: (In1-xMx)(Te1-yZy), and wherein M=Ga, Zn, Cd, Hg, Tl, Sn, Pb, Ge, or combinations thereof, Z═As, S, Se, Sb, or combinations thereof, x=0-0.1, and y=0-0.1, or wherein the semiconductor material has the general formula: (In1-xTlx)(Te1-ySey) with x=0-1 and y=0-1.

公开(公告)号：US20220181266A1

公开(公告)日：2022-06-09

申请号：US17602051

申请日：2020-04-08

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael BRANDL

IPC: H01L23/544 ,  H01L33/62 ,  H01L25/16

Abstract: An optoelectronic component includes at least one optoelectronic semiconductor chip and an electronic first storage medium. The first storage medium electrically stores first component information. The component can be uniquely identified via the first component information. The optoelectronic component also includes a second storage medium which can be read out wirelessly at least in an unmounted state of the component. The second storage medium stores second component information that is representative of the first component information.

公开(公告)号：US20220180808A1

公开(公告)日：2022-06-09

申请号：US17602232

申请日：2020-03-11

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Daniel RICHTER

IPC: G09G3/3216

Abstract: A component for a display device, a display device and a method for operating the display device, a computer program and a storage medium are disclosed. The component comprises LED chips arranged in rows, wherein one red, one green and one blue LED chip are arranged alternately per row in the extension direction of the respective row and per column obliquely to the extension direction, and the rows have an offset from one another in the extension direction.

公开(公告)号：US11355896B2

公开(公告)日：2022-06-07

申请号：US16488573

申请日：2018-02-27

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Andreas Wojcik ,  Markus Pindl

IPC: H01S5/00 ,  H01S5/20 ,  H01S5/40 ,  G02B6/12

Abstract: An optoelectronic component comprising a laser diode is disclosed. In an embodiment an optoelectronic component includes a carrier, a laser diode arranged on the carrier, wherein the laser diode is configured to emit electromagnetic radiation in a lateral radiation and a radiation-guiding layer arrangement located in front of the lateral face of the laser diode, wherein the layer arrangement includes at least a first layer and a second layer, wherein the first layer is arranged on the carrier, wherein the second layer is arranged on the first layer, wherein the first layer and the second layer abut each other, wherein the second layer is transparent for the electromagnetic radiation, wherein the first layer has a smaller refractive index than the second layer, and wherein the layer arrangement is arranged such that the electromagnetic radiation of the laser diode is coupled into the second layer, guided in the second layer to a radiation surface of the second layer, and emitted via the radiation surface of the second layer.

公开(公告)号：US20220172976A1

公开(公告)日：2022-06-02

申请号：US17607804

申请日：2020-04-21

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Andreas Biebersdorf ,  Stefan Illek ,  Christoph Klemp ,  Felix Feix ,  Ines Pietzonka ,  Petrus Sundgren ,  Christian Berger ,  Ana Kanevce ,  Karl Engl

IPC: H01L21/683 ,  H01L25/075

Abstract: In an embodiment an arrangement includes a plurality of semiconductor chips arranged on a carrier, wherein the carrier is a growth substrate or an auxiliary carrier, wherein the semiconductor chips are arranged at grid points of a grid, and wherein the grid is a hexagonal grid deformed by a deformation factor along at least one of a plurality of axes of the grid and has a shearing along at least one of the plurality of axes of the grid.

公开(公告)号：US11348906B2

公开(公告)日：2022-05-31

申请号：US16982066

申请日：2018-03-21

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Choon Kim Lim

IPC: H01L25/075 ,  H01L33/00 ,  H01L25/16 ,  H01L33/50

Abstract: An optoelectronic device comprises a phosphor plate, an optoelectronic chip comprising a layer stack of a first optoelectronic semiconductor layer and a second optoelectronic semiconductor layer, a first electrode, and a second electrode. The optoelectronic chip is attached to the phosphor plate, so that the second optoelectronic semiconductor layer is arranged between the phosphor plate and the first optoelectronic semiconductor layer. The first electrode and the second electrode are arranged on a first main surface of the first optoelectronic semiconductor layer on a side remote from the phosphor plate. The second electrode directly contacts the first optoelectronic semiconductor layer.