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公开(公告)号:US20220123182A1
公开(公告)日:2022-04-21
申请号:US17645644
申请日:2021-12-22
发明人: Andreas Biebersdorf , Michael Brandl , Peter Brick , Jean-Jacques Drolet , Hubert Halbritter , Laura Kreiner , Erwin Lang , Andreas Leber , Marc Philippens , Thomas Schwarz , Julia Stolz , Xue Wang , Karsten Diekmann , Karl Engl , Siegfried Herrmann , Stefan Illek , Ines Pietzonka , Andreas Rausch , Simon Schwalenberg , Petrus Sundgren , Georg Bogner , Christoph Klemp , Christine Rafael , Felix Feix , Eva-Maria Rummel , Nicole Heitzer , Marie Assmann , Christian Berger , Ana Kanevce
IPC分类号: H01L33/52 , H01L33/50 , H01L33/60 , H01L33/04 , H01L25/075
摘要: The invention relates to various aspects of a μ-LED or a μ-LED array for augmented reality or lighting applications, in particular in the automotive field. The μ-LED is characterized by particularly small dimensions in the range of a few μ.
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公开(公告)号:US20220059737A1
公开(公告)日:2022-02-24
申请号:US17515138
申请日:2021-10-29
发明人: Andreas Biebersdorf , Michael Brandl , Peter Brick , Jean-Jacques Drolet , Hubert Halbritter , Laura Kreiner , Erwin Lang , Andreas Leber , Marc Philippens , Thomas Schwarz , Julia Stolz , Xue Wang , Karsten Diekmann , Karl Engl , Siegfried Herrmann , Stefan Illek , Ines Pietzonka , Andreas Rausch , Simon Schwalenberg , Petrus Sundgren , Georg Bogner , Christoph Klemp , Christine Rafael , Felix Feix , Eva-Maria Rummel , Nicole Heitzer , Marie Assmann , Christian Berger , Ana Kanevce
IPC分类号: H01L33/52 , H01L33/50 , H01L33/60 , H01L33/04 , H01L25/075
摘要: The invention relates to various aspects of a μ-LED or a μ-LED array for augmented reality or lighting applications, in particular in the automotive field. The μ-LED is characterized by particularly small dimensions in the range of a few μm.
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公开(公告)号:US20220172976A1
公开(公告)日:2022-06-02
申请号:US17607804
申请日:2020-04-21
发明人: Andreas Biebersdorf , Stefan Illek , Christoph Klemp , Felix Feix , Ines Pietzonka , Petrus Sundgren , Christian Berger , Ana Kanevce , Karl Engl
IPC分类号: H01L21/683 , H01L25/075
摘要: In an embodiment an arrangement includes a plurality of semiconductor chips arranged on a carrier, wherein the carrier is a growth substrate or an auxiliary carrier, wherein the semiconductor chips are arranged at grid points of a grid, and wherein the grid is a hexagonal grid deformed by a deformation factor along at least one of a plurality of axes of the grid and has a shearing along at least one of the plurality of axes of the grid.
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