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公开(公告)号：US20240372245A1
公开(公告)日：2024-11-07
申请号：US18772078
申请日：2024-07-12
Applicant: Apple Inc.
Inventor： Matthew D. Hill , Michael B. Wittenberg , Shane Bustle , Duy P. Le
Abstract: A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.
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公开(公告)号：US11838432B2
公开(公告)日：2023-12-05
申请号：US17068619
申请日：2020-10-12
Applicant: Apple Inc.
Inventor： Bryan D. Keen , Devon A. Monaco , Sherry Lee , Ihtesham H. Chowdhury , Eric N. Nyland , Matthew D. Hill , Arun R. Varma , Lucy E. Browning , Sawyer I. Cohen , Benjamin J. Pope , Abhishek Choudhury , James W. Bilanski , Yaodong Wang , Daniel J. Morizio , Nicholas W. Ruhter , David A. Karol , Sean M. Gordoni
CPC classification number: H04M1/0206 , G06F1/1637 , G06F1/1686 , H04M1/026 , H04M1/0264 , H04M1/0266 , H05K1/115 , H05K1/118 , H05K1/189 , H05K5/0047 , H05K5/0086 , H05K5/0217 , H04M2201/38
Abstract: A portable electronic device includes a housing defining an internal volume and a circuit board assembly within the internal volume. The circuit board assembly includes a first circuit board, a wall structure soldered to the first circuit board, and a second circuit board soldered to the wall structure and supported above the first circuit board by the wall structure. The second circuit board defines an exterior top surface of the circuit board assembly. A processor is coupled to the first circuit board and positioned within an internal volume defined between the first circuit board and the second circuit board and at least partially surrounded by the wall structure. A memory module is coupled to the exterior top surface of the circuit board assembly.
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公开(公告)号：US11792309B2
公开(公告)日：2023-10-17
申请号：US17378695
申请日：2021-07-17
Applicant: Apple Inc.
Inventor： Matthew D. Hill , Derek C. Krass , Benjamin Shane Bustle , Lucy Elizabeth Browning , Michael Benjamin Wittenberg , James B. Smith , Ashutosh Y. Shukla , Scott A. Myers
CPC classification number: H04M1/0249 , H04M1/02 , H04M1/0202 , H04M1/0247 , H04M1/23
Abstract: An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.
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公开(公告)号：US11750900B2
公开(公告)日：2023-09-05
申请号：US17687497
申请日：2022-03-04
Applicant: Apple Inc.
Inventor： Scott W. Miller , Brian A. Argyres , Lindsay M. Alanen , Matthew D. Hill , Nicholas D. Smyth , Shujun Tang
Abstract: Various embodiments include a chassis for a multi-camera system and techniques for forming such a chassis. The chassis may comprise multiple chassis portions that define cavities for mounting cameras. Some embodiments include a chassis portion comprising an integrated shield can-chassis that may be formed as a single component. According to some embodiments, subtractive manufacturing may be used to form one or more features of the chassis.
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公开(公告)号：US20230261695A1
公开(公告)日：2023-08-17
申请号：US18306116
申请日：2023-04-24
Applicant: Apple Inc.
Inventor： Harish Rajagopalan , Bilgehan Avser , David Garrido Lopez , Forhad Hasnat , Mattia Pascolini , Mikal Askarian Amiri , Rodney A. Gomez Angulo , Thomas W. Yang , Jiechen Wu , Eric N. Nyland , Simone Paulotto , Jennifer M. Edwards , Matthew D. Hill , Ihtesham H. Chowdhury , David A. Hurrell , Siwen Yong , Jiangfeng Wu , Daniel C. Wagman , Soroush Akbarzadeh , Robert Scritzky , Subramanian Ramalingam
CPC classification number: H04B3/52 , G01R31/2822 , H01Q1/2283 , H01Q13/24 , H04B3/54
Abstract: An electronic device may be provided with an antenna module having a substrate. A phased antenna array of dielectric resonator antennas and a radio-frequency integrated circuit for the array may be mounted to one or more surfaces of the substrate. The dielectric resonator antennas may include dielectric columns excited by feed probes. The feed probes may be printed onto sidewalls of the dielectric columns or may be pressed against the sidewalls by biasing structures. A plastic substrate may be molded over each dielectric column and each of the feed probes in the array. The feed probes may cover multiple polarizations. The array may include elements for covering multiple frequency bands. The dielectric columns may be aligned a longitudinal axis and may be rotated at a non-zero and non-perpendicular angle with respect to the longitudinal axis.
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Patent Agency Ranking
公开(公告)号：US20230224392A1
公开(公告)日：2023-07-13
申请号：US17903900
申请日：2022-09-06
Applicant: Apple Inc.
Inventor： Matthew D. Hill , Rasamy Phouthavong , Jun Sik Ham , James A. Bertin , Benjamin J. Kallman , Sherry Cao
CPC classification number: H04M1/0266 , H01L51/5215 , H01L51/5234 , H01L27/323 , H04M2201/38
Abstract: A portable electronic device may include an enclosure including a front cover defining a front exterior surface, and a display positioned below the front cover and including a set of transparent conductive traces positioned in a graphically active region of the display and including a first plurality of transparent conductive traces and a second plurality of transparent conductive traces oriented perpendicular to the first plurality of transparent conductive traces. The portable electronic device may further include a proximity sensor including an optical emitter below the display and configured to emit light through the display and through the front cover. The optical emitter may be arranged relative to an optical receiver along a direction oblique to the first plurality of transparent conductive traces and to the second plurality of transparent conductive traces.
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公开(公告)号：US20230221782A1
公开(公告)日：2023-07-13
申请号：US17903963
申请日：2022-09-06
Applicant: Apple Inc.
Inventor： David A. Hurrell , Gregory N. Stephens , Isabel Yang , John J. Baker , Sherry Lee , Matthew D. Hill , Obinna Onyemepu , Douglas G. Fournier , Benjamin J. Pope , Michael W. Firka , Griffin L. Schmitt , Arun R. Varma , Robert Hrabchak
CPC classification number: G06F1/203 , H05K7/20481 , H05K7/205 , H04M1/0202
Abstract: A mobile phone may include an enclosure defining an internal volume, the enclosure including a front cover formed from a transparent material and defining a front exterior surface, a rear cover formed from a glass material and defining a rear exterior surface, and a housing component defining a side exterior surface. The mobile phone may include a circuit board assembly within the internal volume. The circuit board assembly may include a circuit board, a circuit component coupled to an exterior surface of the circuit board, and a cowling coupled to the circuit board and covering the circuit component, the cowling having a thickness less than about 0.5 mm and including a base structure formed from an aluminum alloy having a thickness less than about 0.4 mm and a thermally conductive structure positioned over the base structure and configured to dissipate heat.
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公开(公告)号：US11637919B2
公开(公告)日：2023-04-25
申请号：US17068432
申请日：2020-10-12
Applicant: Apple Inc.
Inventor： John J. Baker , Eric W. Bates , Lucy E. Browning , Kodiak Burke , Benjamin S. Bustle , Trent Canales , Tyler B. Cater , Sawyer I. Cohen , Richard Hung Minh Dinh , Michael Firka , Kevin M. Froese , Jun Sik Ham , Matthew D. Hill , Hugh J. Jay , Benjamin J. Kallman , Paul U. Leutheuser , Matthew W. Miller , Michael K. Mondry , Donald J. Parr , Benjamin J. Pope , Matthew P. Rao , Griffin Schmitt , Allegra Shum , Christopher R. Xydis , Luman Zhang , Yaocheng Zhang , Zhipeng Zhang , Xiao Ying Zhao
Abstract: A portable electronic device includes a housing member defining a first portion of an exterior front surface of the portable electronic device, a first portion of an exterior rear surface of the portable electronic device, at least a portion of an exterior side surface of the portable electronic device, a recess along an interior side of the housing member, and a ledge feature along the interior side of the housing member. The device also includes a top module coupled to the housing member and including a front cover defining a second portion of the exterior front surface of the portable electronic device, a display stack attached to the front cover, and a frame member extending at least partially around a periphery of the display stack and set apart from a surface of the recess by a gap.
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公开(公告)号：US11522983B2
公开(公告)日：2022-12-06
申请号：US17068596
申请日：2020-10-12
Applicant: Apple Inc.
Inventor： Eric W. Bates , Xiao Ying Zhao , Luman Zhang , Christopher R. Xydis , Michael Firka , Benjamin J. Kallman , Ihtesham H. Chowdhury , Matthew D. Hill , Hugh J. Jay , Trent Canales , Lucy E. Browning
Abstract: A portable electronic device includes a front cover, a rear cover, and a housing structure between and coupled to the front cover and the rear cover. The housing structure includes a first housing member defining and a first interlock feature formed along a first end surface. The portable electronic device also includes a second housing member defining a second interlock feature formed along a second end surface. The portable electronic device also includes a nonconductive joining element engaged with the first interlock feature and the second interlock feature, thereby structurally coupling the first housing member to the second housing member.
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公开(公告)号：US20220115770A1
公开(公告)日：2022-04-14
申请号：US17555920
申请日：2021-12-20
Applicant: Apple Inc.
Inventor： Matthew D. Hill , Michael B. Wittenberg , Shane Bustle , Duy P. Le
Abstract: A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.
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