摘要:
A scalable energy harvesting system comprising at least one charging control device, at least one energy storage device responsive to the charging control device, at least one energy harvesting device operatively coupled to the charging control device, and a plurality of bus based power connectors operatively coupled to the charging control device.
摘要:
A method evaluating threshold of a data cell in a memory device including a programming locus coupled with the data cell for receiving a programming signal setting a stored signal level in the data cell and responding to a read signal to indicate the stored signal at a read locus; includes the steps of: (a) in no particular order: (1) selecting a test threshold signal; and (2) setting a read signal at a non-read level; (b) applying the test threshold signal to the programming locus; (c) cycling the read signal between a read level and a non-read level while applying the test threshold signal to the programming locus to present at least two test signals at the read locus when the read signal is at the read level; and (d) while cycling, observing whether the at least two test signals manifest a difference greater than a predetermined amount.
摘要:
The present invention provides a system for stress testing an oxide structure to determine that structure's reliability in overstress conditions. The present invention provides an overstress test structure (400) that comprises a first transistor (406), having a first terminal coupled to ground, a second terminal coupled to a control signal (402), and a third terminal coupled to a first end of a first resistive element (412). A first voltage source (414) is coupled to the second end of the first resistive element. A second resistive element (416) is intercoupled between the second end of the first resistive element and ground. A second transistor (418) has a first terminal coupled to the second end of the first resistive element, a second terminal coupled to the first end of the first resistive element, and a third terminal coupled to a first node (420). A third resistive element (422) is intercoupled between the third terminal of the second transistor and ground; and a third transistor (424) has a first terminal coupled (426) to the oxide structure, a second terminal coupled to the first end of the first resistive elerment, and a third terminal coupled to a second voltage source (428).
摘要:
A switch mode controller circuit includes: a hysteretic comparator HYST_COMP for monitoring an output of a switch mode circuit; a standard comparator PHASE_COMP for monitoring a phase of the switch mode circuit; a logic block having a first input coupled to a clock signal generator Oscillator, a second input coupled to an output of the hysteretic comparator HYST_COMP, and a third input coupled to an output of the standard comparator PHASE_COMP, wherein the logic block generates switching cycles based on a fixed ON/OFF time during a first part of a cycle and based on a hysteretic control during a second part of the cycle.
摘要:
The present invention relates to a reverse bias protection structure which comprises a PMOS transistor structure having a drain portion, a gate portion, a source portion and a backgate portion, wherein the gate portion is coupled to a first voltage potential, the source portion is selectively coupleable to a power supply, and the drain portion is selectively coupleable to a circuit needing power to be supplied thereto from the power supply. The reverse bias protection structure further comprises a Schottky diode structure having an anode coupled to the source portion of the PMOS transistor structure, and a cathode coupled to the backgate portion of the PMOS structure. Under forward bias conditions, the PMOS transistor conducts and exhibits a small voltage drop thereacross. Under reverse bias conditions, the PMOS transistor is off and the Schottky structure is reverse biased, thus preventing current through the protection structure.
摘要:
The regulator circuit with an auxiliary boundary regulator that provides enhanced transient response includes: an upper comparator 24 having a first input coupled to a feedback node and a second input coupled to a first reference voltage node V_HIGH; a lower comparator 26 having a first input coupled to the feedback node and a second input coupled to a second reference voltage node V_LOW; a first switching device 30 having a control node coupled to an output of the upper comparator 24; a second switching device 28 having a control node coupled to an output of the lower comparator 26; an inductor 36 having a first end coupled to the first and second switching devices 28 and 30, and a second end coupled to an output node Vout; and a feedback circuit 32 and 34 coupled between the output node Vout and the feedback node. This circuit provides a precise, quiet, linear regulator that provides a tightly regulated output with a fast regulator working in parallel to ensure that the output voltage stays within an acceptable boundary.
摘要:
A controlled area network (CAN) driver provides improved symmetry between its differential output signals CAN-H and CAN-L, and provides protection for its low voltage devices from voltage transients occurring on its output lines. A plurality of CAN drivers 80 are serially interconnected to form a driver system, wherein each downstream driver stage receives a time-delayed form of the digital input signal TxD, each stage providing a time-delayed contribution to the differential output signals of the overall driver system.
摘要:
The device has a semiconductor chip having active circuitry in the face thereof. The circuitry has busing over it containing two conductive layers having a plurality of contacts and vias with spacings between them that alternate with respect to one another to provide current ballasting and improved switching uniformity. The spacings between the alternating contacts and vias provide regions of maximum conductor thickness and therefore reduces the busing resistance. Staggering the rows of alternating contacts and vias provides further current ballasting. A first conducting layer is used to contact and provide electrically isolated low resistive conducting paths to the various semiconductor regions while the second conducting region is used to provide selective contact to the first conductive layer, thus providing a means of busing large currents over active semiconductor area without sacrificing performance parameters.
摘要:
A voltage level shifting circuit (FIG. 4) has a plurality of PMOS transistors M.sub.1, M.sub.2, M.sub.3 connected in parallel for respectively driving a capacitive load C.sub.L with a selected different voltage level V.sub.1, V.sub.2 or V.sub.3. Transistors M.sub.1, M.sub.2, M.sub.3 are controlled so that one of them is placed in the ON condition, with the others in the OFF condition, to connect one of the voltages V.sub.1, V.sub.2 or V.sub.3 to charge the load CL. The largest voltage transistor M.sub.3 has its body connected to its source. The lower voltage transistors M.sub.1, M.sub.2 have their bodies respectively connected to switches S.sub.1, S.sub.2, which connect the bodies to the sources when the transistors are placed in the ON condition and connect the bodies to the highest voltage V.sub.3 when the transistors are placed in the OFF condition.
摘要:
In accordance with the present invention, an output current limit circuit for protecting a power MOS output device of an integrated circuit from an excessive drain current comprises a power MOS device 110, a means 30 to sense a predetermined trigger current, and a means 20 to reduce a gate-source voltage on MOS output device 110 to a predetermined approximately fixed value. A drain current I.sub.D flows through power MOS device 110 from output terminal 102 in response to the gate-source voltage. A short circuit condition may allow an excessive amount of drain current I.sub.D to flow through output terminal 102. The gate-source voltage is reduced in response to sensing the trigger current. Reducing the gate-source voltage raises a drain-source resistance of MOS device 110 and reduces drain current I.sub.D so that MOS device 110 is not damaged by the short circuit condition.