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公开(公告)号：US07251547B2
公开(公告)日：2007-07-31
申请号：US10960574
申请日：2004-10-08
CPC分类号： G05D23/1934
摘要： In a method for correlating vent tiles with racks based upon vent tile settings and rack inlet temperatures, the vent tiles are set to a first setting, the first vent tile settings are recorded and the temperatures at the inlets of the racks are detected at the first vent tile settings. One of the vent tiles is closed to obtain a second setting, the second vent tile settings are recorded and the temperatures at the inlets of the racks are detected at the second vent tile settings. In addition, the vent tiles and the racks are correlated based upon the settings of the vent tiles and the temperatures detected at the first vent tile settings and the second vent tile settings.
摘要翻译： 在根据排气瓦设置和机架入口温度将通风瓦与机架相关联的方法中，排气瓦被设置为第一设定，记录第一排气瓦设置，并且在第一次检测到机架入口处的温度 通风瓦设置。 一个通风瓦片关闭以获得第二设定，记录第二排气瓦设置，并且在第二排气瓦设置处检测机架入口处的温度。 此外，排气瓦片和机架基于排气瓦片的设置和在第一排气瓦设置和第二排气瓦设置处检测到的温度而相关。
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公开(公告)号：US07218996B1
公开(公告)日：2007-05-15
申请号：US11474765
申请日：2006-06-26
IPC分类号： G06F19/00
CPC分类号： H05K7/20745 , H05K7/20836
摘要： In a method for thermally managing a room with at least one air moving device having a temperature actuator and an airflow rate actuator, a temperature of airflow at a first location in the room is received and compared with a first predetermined temperature range and a second predetermined temperature range. In the method, one of the temperature actuator and the airflow rate actuator is varied when the received temperature of the airflow is outside of the first predetermined temperature range and the other of the temperature actuator and the airflow rate actuator is varied when the received temperature of the airflow is within the first predetermined temperature range and outside of the second predetermined temperature range.
摘要翻译： 在具有至少一个具有温度致动器和气流速率致动器的空气移动装置的热管理房间的方法中，接收房间第一位置处的气流温度，并与第一预定温度范围和第二预定温度范围进行比较 温度范围。 在该方法中，当气流的接收温度超出第一预定温度范围时，温度致动器和气流速率致动器中的一个变化，并且温度致动器和气流速率致动器中的另一个在接收到的温度 气流在第一预定温度范围内并且在第二预定温度范围之外。
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公开(公告)号：US07134289B2
公开(公告)日：2006-11-14
申请号：US11005283
申请日：2004-12-04
IPC分类号： F28C1/00
CPC分类号： H01L23/4735 , F25B23/006 , F25B2339/021 , F28D5/00 , F28D15/02 , H01L2224/73204
摘要： A cooling system including a thermosyphon subsystem and a spray cooling subsystem, each being configured to evaporatively cool a component, and a controller configured to selectively operate the spray cooling subsystem based on the cooling requirements of the component. The controller controls a valve limiting the operation of the thermosyphon when the spray cooling system is active. The component is configured to run in a plurality of performance states including a low power state and a high power state. The spray cooling system operates when the component is in the high power state. The controller can order the component to operate in a lower power state if the cooling systems are inadequate to the cooling needs. The cooling needs are determined with a component temperature sensor, a vapor temperature sensor, a vapor pressure sensor, or a power usage sensor.
摘要翻译： 一种包括热虹吸子系统和喷雾冷却子系统的冷却系统，每个都被配置为蒸发冷却部件，以及控制器，其被配置为基于部件的冷却要求选择性地操作喷射冷却子系统。 当喷雾冷却系统处于活动状态时，控制器控制阀门限制热虹吸管的运行。 该组件被配置为在包括低功率状态和高功率状态的多个性能状态下运行。 当组件处于高功率状态时，喷雾冷却系统运行。 如果冷却系统不足以满足冷却需要，则控制器可以命令组件在较低功率状态下运行。 冷却需要由部件温度传感器，蒸汽温度传感器，蒸汽压力传感器或电力使用传感器确定。
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公开(公告)号：US07082778B2
公开(公告)日：2006-08-01
申请号：US10656588
申请日：2003-09-04
IPC分类号： F25D23/12
CPC分类号： H01L23/4336 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor chip cooling system having a body that forms an enclosed spray chamber, and having a thermal-transmittance wall configured to conformingly adjoin to a chip, a substrate or printed circuit board carrying one or more chips, or another such heated device. Inkjet-type sprayers are configured to spray cooling fluid on the thermal-transmittance wall to cool the chip. A controller transmits a control signal to the sprayer to cause the sprayer to spray at a rate leading to the cooling fluid being vaporized by the semiconductor device without the device either drying or becoming covered by a pool. The cooling system uses cooling fluid surface tension forces to draw liquid cooling fluid up a porous member from the spray chamber back to the sprayers, to be sprayed again. The cooling system uses gravity and/or pressure within the spray chamber to direct vaporized cooling fluid upward from the spray chamber to a condenser. The condenser is configured to cool and condense the vapor. A reservoir is positioned below the condenser and above the sprayers so as to receive condensed vapor from the condenser and feed it to the sprayers.
摘要翻译： 一种半导体芯片冷却系统，其具有形成封闭的喷射室的主体，并且具有配置成与芯片相配合的热透射率壁，承载一个或多个芯片的基板或印刷电路板，或另一个这样的加热装置。 喷墨式喷雾器被配置成在热透射率壁上喷射冷却流体以冷却芯片。 控制器将控制信号发送到喷雾器，以使喷雾器以导致冷却流体被半导体器件蒸发的速率喷射，而不会使设备干燥或变得被池覆盖。 冷却系统使用冷却流体表面张力将液体冷却流体从喷雾室向上抽吸到喷雾器上，以再次喷洒。 冷却系统使用喷雾室内的重力和/或压力将蒸发的冷却流体从喷雾室向上引导到冷凝器。 冷凝器被配置为冷却并冷凝蒸气。 储存器位于冷凝器下方和喷雾器上方，以便从冷凝器接收冷凝的蒸汽并将其送入喷雾器。
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公开(公告)号：US07057506B2
公开(公告)日：2006-06-06
申请号：US10758229
申请日：2004-01-16
IPC分类号： G08B25/00
CPC分类号： H05K7/20836 , F24F11/30 , F24F2120/10 , F24F2120/12 , H05K7/20745 , Y10T137/1939
摘要： A method of controlling cooling fluid provisioning in a room housing a plurality of components. The room includes at least one plenum having one or more cooling system components configured to vary a characteristic of at least one of cooling fluid supply to and removal from the room. In the method, location aware sensors are positioned at various locations in the room and their locations are determined. One or more conditions are detected with the location aware sensors and it is determined whether to manipulate at least one of the one or more cooling system components to modify a characteristic of cooling fluid contained in the plenum based upon the detected one or more conditions. In addition, at least one of the one or more cooling system components is manipulated in response to a determination to that the at least of the one or more cooling system components is to be modified.
摘要翻译： 一种在容纳多个部件的房间内控制冷却液供应的方法。 该房间包括具有一个或多个冷却系统组件的至少一个增压室，该冷却系统组件被配置成改变至室内的冷却流体供应和从房间移除中的至少一个的特性。 在该方法中，位置感知传感器位于房间中的各个位置，并确定其位置。 利用位置感知传感器检测一个或多个条件，并且基于检测到的一个或多个条件确定是否操纵一个或多个冷却系统部件中的至少一个以修改容纳在集气室中的冷却流体的特性。 另外，响应于要修改至少一个或多个冷却系统组件的确定来操纵一个或多个冷却系统组件中的至少一个。
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公开(公告)号：US07024573B2
公开(公告)日：2006-04-04
申请号：US10062443
申请日：2002-02-05
CPC分类号： H05K7/20781 , F25B25/005 , G06F1/20 , G06F1/206 , G06F2200/201 , Y02D10/16
摘要： A device and a system for cooling heat generating electronics is disclosed. In one embodiment, the invention is a system for cooling at least one computer component. The system has a plurality of cold plates which are adapted to transfer heat from a plurality of computer components to a cooling fluid. A supply line supplies the cooling fluid to and from these cold plates. The system also has a housing with one or more racks to support the computer component(s). The racks may also support the cold plates so that the cold plates are in thermal communication with at least one computer component.
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公开(公告)号：US06868682B2
公开(公告)日：2005-03-22
申请号：US10345723
申请日：2003-01-16
CPC分类号： H05K7/20745 , G01K7/42 , H05K7/20836
摘要： Controlling the temperature in a data center includes receiving sensory data corresponding to a temperature from a subsystem in a data center, processing the sensory data by a first agent in a hierarchy of agents to determine if the subsystems in the data center is operating within a predetermined temperature range, adjusting a delivery rate for a cooling fluid using the first agent to keep the temperature range of the subsystem within the predetermined temperature range, and requesting a second agent from the hierarchy of agents to process the sensory data when the first agent cannot keep the temperature range within the predetermined temperature range unless the second agent redistributes the cooling fluid being delivered. A third agent is used to vary the amount of cooling fluid output when at least the first and second agent cannot keep the subsystem operating within the predetermined temperature range.
摘要翻译： 控制数据中心的温度包括接收对应于来自数据中心的子系统的温度的感觉数据，由代理层级中的第一代理处理感觉数据，以确定数据中心中的子系统是否在预定的 温度范围，使用第一试剂调节冷却流体的输送速率以将子系统的温度范围保持在预定温度范围内，以及当第一代理不能保持时从代理层级请求第二代理处理感觉数据 温度范围在预定温度范围内，除非第二试剂重新分配正在输送的冷却流体。 当至少第一和第二代理不能使子系统在预定温度范围内运行时，第三代理用于改变冷却液输出量。
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公开(公告)号：US06853554B2
公开(公告)日：2005-02-08
申请号：US10022112
申请日：2001-12-14
IPC分类号： H05K7/20
CPC分类号： H05K7/20772
摘要： A modular semiconductor chip cooling system having a readily openable enclosure defining a chamber configured to hold a printed circuit board carrying components to be cooled. The enclosure can include a reservoir, a condenser and a pump. Sprayers within the chamber are adjustably mounted on one or more brackets to allow each sprayer to be set for the individual height of its respective component. The enclosure can be readily removed from a computer system through a quick release connection. The computer system can include a condenser and pump to operate all its modular cooling systems, removing the condensing function from the individual modules.
摘要翻译： 一种模块化半导体芯片冷却系统，其具有容易打开的外壳，其限定了配置成容纳承载待冷却部件的印刷电路板的室。 外壳可以包括储存器，冷凝器和泵。 室内的喷雾器可调节地安装在一个或多个支架上，以允许每个喷雾器为其各自部件的单独高度设定。 外壳可以通过快速释放连接容易地从计算机系统中移除。 计算机系统可以包括冷凝器和泵来操作其所有的模块化冷却系统，从各个模块中去除冷凝功能。
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公开(公告)号：US06817199B2
公开(公告)日：2004-11-16
申请号：US10697691
申请日：2003-10-31
IPC分类号： F25B100
CPC分类号： H05K7/20745 , F25B5/02 , F25B49/02 , F25B2600/0253 , F25B2600/112 , F25B2600/2515 , F25B2700/2104 , F25B2700/2117 , Y02B30/741 , Y02B30/743
摘要： A system and method for cooling a room configured to house a plurality of computer systems. A heat exchanger unit is configured to receive air from the room and to deliver air to the room. The heat exchanger unit is supplied with cooling fluid operable to cool the received air in the heat exchanger unit. At least one of the temperature of the cooling fluid supplied to the heat exchanger unit and the air delivery to the room may be controlled in response to temperatures sensed at one or more locations in the room.
摘要翻译： 一种用于冷却被配置为容纳多个计算机系统的房间的系统和方法。 热交换器单元被配置为从房间接收空气并将空气输送到房间。 热交换器单元被供应有冷却流体，其可操作以冷却热交换器单元中的接收空气。 可以响应于在房间中的一个或多个位置处感测到的温度来控制供应到热交换器单元的冷却流体的温度和送到房间的空气中的至少一个。
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公开(公告)号：US06644058B2
公开(公告)日：2003-11-11
申请号：US09945044
申请日：2001-08-31
IPC分类号： F25D1702
CPC分类号： G06F1/20 , F25D19/00 , G06F2200/201 , H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： A modular semiconductor chip cooling system having a readily openable enclosure defining a chamber configured to hold a printed circuit board carrying components to be cooled. The enclosure can include a reservoir, a condenser and a pump. Sprayers within the chamber are adjustably mounted on one or more brackets to allow each sprayer to be set for the individual height of its respective component. The enclosure can be readily removed from a computer system through a quick release connection. The computer system can include a condenser and pump to operate all its modular cooling systems, removing the condensing function from the individual modules.
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