中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

81 records (took 0.021 seconds)

    Microelectronic die cooling device including bonding posts and method of forming same
    71.
    发明申请
    Microelectronic die cooling device including bonding posts and method of forming same 有权

    公开(公告)号：US20060289987A1

    公开(公告)日：2006-12-28

    申请号：US11170289

    申请日：2005-06-28

    Applicant: Chia-Pin Chiu

    Inventor： Chia-Pin Chiu

    IPC: H01L23/34

    CPC classification number: H01L23/473 ,  H01L2224/73253 ,  H01L2924/15311

    Abstract: A microelectronic assembly and a method of forming same. The microelectronic assembly comprises: a microelectronic package including a substrate and a die, the die being electrically conductively bonded to the substrate at a front side thereof and further having a backside; a cover plate defining an inlet opening and an outlet opening therethrough; bonding posts mechanically bonding the cover plate to the backside of the die; a sealant body sealingly bonding an inner periphery of a die side of the cover plate to an inner periphery of a backside of the die to form, along with the backside of the die and the cover plate, a cooling fluid chamber. The backside of the die, the cover plate, the bonding posts and the sealant body together define a microelectronic cooling device including the cooling fluid chamber and configured to receive cooling fluid through the inlet opening, to flow the cooling fluid in the chamber between the bonding posts, and to allow the cooling fluid to exit from the outlet opening to cool the die.

    Integrated circuit coolant microchannel assembly with targeted channel configuration
    72.
    发明申请
    Integrated circuit coolant microchannel assembly with targeted channel configuration 有权
    具有目标通道配置的集成电路冷却液微通道组件

    公开(公告)号：US20060226539A1

    公开(公告)日：2006-10-12

    申请号：US11101061

    申请日：2005-04-07

    Applicant: Je-Young Chang ,  Ioan Sauciuc ,  Chuan Hu ,  Chia-Pin Chiu ,  Gregory Chrysler ,  Ravi Prasher

    Inventor： Je-Young Chang ,  Ioan Sauciuc ,  Chuan Hu ,  Chia-Pin Chiu ,  Gregory Chrysler ,  Ravi Prasher

    IPC: H01L23/34

    CPC classification number: H01L23/473 ,  F28F3/12 ,  F28F2260/02 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A microchannel structure has microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. At least one of the microchannels has a length extent and has a first section at a first location along the length extent and a second section at a second location along the length extent. The first section of the microchannel has a first aspect ratio and the second section is divided into at least two sub-channels. Each sub-channel has a respective second aspect ratio that is greater than the first aspect ratio.

    Abstract translation: 微通道结构中形成有微通道。 微通道将输送冷却剂并靠近集成电路以将热量从集成电路传递到冷却剂。 微通道中的至少一个具有长度范围，并且具有沿着长度范围的第一位置处的第一部分和沿着长度范围的第二位置处的第二部分。 微通道的第一部分具有第一宽高比，第二部分被划分为至少两个子通道。 每个子通道具有大于第一宽高比的相应的第二宽高比。

    Embedded heat spreader for folded stacked chip-scale package
    74.
    发明申请
    Embedded heat spreader for folded stacked chip-scale package 有权
    嵌入式散热器用于折叠堆叠芯片级封装

    公开(公告)号：US20050184370A1

    公开(公告)日：2005-08-25

    申请号：US10788071

    申请日：2004-02-24

    Applicant: Chia-Pin Chiu

    Inventor： Chia-Pin Chiu

    IPC: H01L23/02 ,  H01L23/538 ,  H01L25/065 ,  H05K1/02

    CPC classification number: H01L25/0652 ,  H01L23/5387 ,  H01L2224/48227 ,  H05K1/0206

    Abstract: In some embodiments, a T-shaped heat spreader may be provided centrally within a folded stacked chip-scale package. The dice may be situated around the T-shaped heat spreader which may be made of high conductivity material. Heat may be dissipated through the T-shaped spreader 24 and downwardly through thermal vias into a printed circuit board.

    Abstract translation: 在一些实施例中，T形散热器可以在折叠的堆叠芯片级封装内集中提供。 骰子可以位于可由高导电性材料制成的T形散热器周围。 热量可以通过T形吊具24散开，并通过热通孔向下散布到印刷电路板中。

    Integrated socket for microprocessor package and cache memory
    76.
    发明授权
    Integrated socket for microprocessor package and cache memory 失效
    用于微处理器封装和高速缓存的集成插座

    公开(公告)号：US06890217B2

    公开(公告)日：2005-05-10

    申请号：US10637375

    申请日：2003-08-08

    Applicant: Chia-Pin Chiu

    Inventor： Chia-Pin Chiu

    IPC: G06F1/18 ,  H05K7/10 ,  H01R9/09

    CPC classification number: H05K7/1092 ,  G06F1/183 ,  Y10S439/946

    Abstract: A socket comprises a socket body having a bottom surface at which the socket can be mounted to a motherboard, a top surface, and several side surfaces. The top surface has an array of electrical contacts at which a package containing a microprocessor can be coupled to the socket. One or more of the side surfaces have a slot, which includes an electrical interface at which a circuit card containing cache memory for use by the microprocessor can be removably inserted into the socket body parallel to the motherboard.

    Abstract translation: 插座包括具有底表面的插座本体，该插座可以在该底表面处安装到主板，顶表面和几个侧表面。 顶表面具有电触头阵列，在该触点阵列处，包含微处理器的封装可以耦合到插座。 一个或多个侧表面具有槽，其包括电接口，在该电接口处包含用于由微处理器使用的高速缓冲存储器的电路卡可以在该电接口处平行于主板可拆卸地插入到插座主体中。

    Folded BGA package design with shortened communication paths and more electrical routing flexibility
    77.
    发明授权
    Folded BGA package design with shortened communication paths and more electrical routing flexibility 有权
    折叠式BGA封装设计，缩短了通信路径和更多的电气布线灵活性

    公开(公告)号：US06869825B2

    公开(公告)日：2005-03-22

    申请号：US10334650

    申请日：2002-12-31

    Applicant: Chia-Pin Chiu

    Inventor： Chia-Pin Chiu

    IPC: H01L23/538 ,  H01L21/44

    CPC classification number: H01L23/5387 ,  H01L2224/48227

    Abstract: A method and apparatus for making a multiply folded BGA package design with shortened communication paths and more electrical routing flexibility. A package apparatus includes a substrate and a first integrated circuit (IC), wherein the first IC is electrically connected to the first face of the substrate, and wherein a first segment and a second segment of the substrate are both folded around the first IC. A second IC is electrically connected to the second face of the substrate, such that the second IC is connected to the first and second folded segments of the substrate abode the first IC.

    Abstract translation: 一种用于制造具有缩短的通信路径和更多电路布置灵活性的多折叠BGA封装设计的方法和装置。 封装装置包括基板和第一集成电路（IC），其中第一IC电连接到基板的第一面，并且其中基板的第一段和第二段都围绕第一IC折叠。 第二IC电连接到基板的第二面，使得第二IC连接到基板的第一和第二折叠段，留下第一IC。

    Short carbon fiber enhanced thermal grease
    79.
    发明授权
    Short carbon fiber enhanced thermal grease 失效
    短碳纤维增强导热油脂

    公开(公告)号：US06651736B2

    公开(公告)日：2003-11-25

    申请号：US09894259

    申请日：2001-06-28

    Applicant: Chia-Pin Chiu ,  James C. Shipley ,  Craig B. Simmons

    Inventor： Chia-Pin Chiu ,  James C. Shipley ,  Craig B. Simmons

    IPC: F28F700

    CPC classification number: C09K5/14 ,  Y10T428/1419

    Abstract: A thermal conducting material with higher thermal conductivity for a given low viscosity is shown. Carbon fibers are added to the thermal grease to promote thermal conductivity. The carbon fibers are also not highly electrically conductive, reducing the danger of short circuiting due to misapplication of the thermal grease. Due to the high thermal conductivity of the carbon fibers, a lower loading percentage is needed to obtain significant gains in thermal conductivity. The low loading percentages in turn permit lower thermal grease viscosity, which allows the thermal grease to be spread very thin during application.

    Abstract translation: 示出了对于给定的低粘度具有较高导热性的导热材料。 将碳纤维添加到导热油脂中以促进导热性。 碳纤维也不是高导电性的，从而降低了由于导热油脂的误用造成短路的危险。 由于碳纤维的高导热性，需要较低的负载百分比以获得显着的导热性增益。 低负载百分比又允许较低的导热油脂粘度，这使得导热油脂在使用过程中传播非常薄。

    Method for an integrated circuit thermal grease mesh structure
    80.
    发明授权
    Method for an integrated circuit thermal grease mesh structure 失效
    集成电路导热油脂网结构的方法

    公开(公告)号：US6150195A

    公开(公告)日：2000-11-21

    申请号：US356013

    申请日：1999-07-16

    Applicant: Chia-Pin Chiu ,  Nadir Sharaf ,  Gary Solbrekken ,  Correy D. Cooks

    Inventor： Chia-Pin Chiu ,  Nadir Sharaf ,  Gary Solbrekken ,  Correy D. Cooks

    IPC: H01L23/42 ,  H01L23/427 ,  H01L21/48

    CPC classification number: H01L23/42 ,  H01L23/427 ,  H01L2224/16 ,  H01L2224/29076 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/3011

    Abstract: The invention includes a method for assembling an integrated circuit package. In the method, a substrate is presented. Next, an integrated circuit may be mounted to the substrate. A retaining structure is presented that is shaped as a mesh that is at least one of a hexagonal mesh, a triangular mesh, and an irregular shaped mesh. The retaining structure is then impregnated with a thermal grease to form a heat pipe. The heat pipe is trimmed to the perimeter of the top surface so that the heat pipe does not extend into the at least one corner of the top surface. The heat pipe is placed on the top surface of the integrated circuit. A thermal element is then placed on the impregnated retaining structure.

    Abstract translation: 本发明包括一种用于组装集成电路封装的方法。 在该方法中，呈现基板。 接下来，可以将集成电路安装到基板。 呈现保持结构，其形状为网格，其为六边形网格，三角形网格和不规则形状的网格中的至少一种。 然后将保持结构用导热油脂浸渍以形成热管。 热管被修剪到顶表面的周边，使得热管不延伸到顶表面的至少一个角部。 热管放置在集成电路的顶面。 然后将热元件放置在浸渍的保持结构上。

Patent Agency Ranking