摘要:
Some embodiments include a number of nodes configured to receive a number of signals. The signals may represent information stored in a number of memory cells of a device such as a memory device. The device may include a number of transfer paths having storage elements coupled between the nodes and an output node. The transfer paths may be configured to transfer a selected signal of the signals from one of the nodes to the output node via one of the transfer paths. The transfer paths may be configured to hold a value of the selected signal in only one of the storage elements. Each of the transfer paths may include only one of the storage elements. Other embodiments including additional apparatus, systems, and methods are disclosed.
摘要:
A method and circuitry for boosting a driven signal along a circuit line so as to reduce RC delays is disclosed. In one embodiment, the circuitry includes a line amplifier positioned at a distance from the circuitry that drives signals onto the line, for example, across a memory array. The line amplifier detects the driven signal on the line at early stages, and even before the signal reaches its full potential, the amplifier amplifies that signal and drives it back to the line to help boost the detected signal. In a preferred embodiment, the amplifier comprises a differential amplifier capable of boosting one of two input signal lines. In an alternative embodiment, the amplifier output may additionally input to a feedback loop, which loop ultimately drives a pull-up transistor to boost the detected signal and passes it back to the line to even further assist the differential amplifier in boosting. Use of the disclosed circuitry benefits, as one example, the boosting of a DRAM column select line that passes a long distance through the memory array.
摘要:
The present invention is generally directed to an apparatus with embedded (bottom side) control lines for vertically stacked semiconductor elements. In accordance with various embodiments, a first semiconductor wafer is provided with a first facing surface on which a first conductive layer is formed. The first semiconductor wafer is attached to a second semiconductor wafer to form a multi-wafer structure, the second semiconductor wafer having a second facing surface on which a second conductive wafer is formed. The first conductive layer is contactingly bonded to the second conductive layer to form an embedded combined conductive layer within said structure. Portions of the combined conductive layer are removed to form a plurality of spaced apart control lines that extend in a selected length or width dimension through said structure.
摘要:
Apparatus and method for decoding addresses of control lines in a semiconductor device, such as a solid state memory (SSM). In accordance with some embodiments, a switching circuit includes an array of switching devices coupled to 2N output lines and M input lines, wherein M and N are respective non-zero integers and each output line has a unique N-bit address. A decoder circuit coupled to the switching circuit divides the N-bit address for a selected output line into a plurality of multi-bit subgroup addresses, and asserts the M input lines in relation to respective bit values of said subgroup addresses to apply a first voltage to the selected output line and to concurrently apply a second voltage to the remaining 2N−1 output lines.
摘要:
Apparatus and method for decoding addresses of control lines in a semiconductor device, such as a solid state memory (SSM). In accordance with some embodiments, a switching circuit includes an array of switching devices coupled to 2N output lines and M input lines, wherein M and N are respective non-zero integers and each output line has a unique N-bit address. A decoder circuit coupled to the switching circuit divides the N-bit address for a selected output line into a plurality of multi-bit subgroup addresses, and asserts the M input lines in relation to respective bit values of said subgroup addresses to apply a first voltage to the selected output line and to concurrently apply a second voltage to the remaining 2N−1 output lines.
摘要:
Apparatus and method for decoding addresses of control lines in a semiconductor device, such as a solid state memory (SSM). In accordance with some embodiments, a switching circuit includes an array of switching devices coupled to 2N output lines and M input lines, wherein M and N are respective non-zero integers and each output line has a unique N-bit address. A decoder circuit coupled to the switching circuit divides the N-bit address for a selected output line into a plurality of multi-bit subgroup addresses, and asserts the M input lines in relation to respective bit values of said subgroup addresses to apply a first voltage to the selected output line and to concurrently apply a second voltage to the remaining 2N-1 output lines.
摘要:
A sense amplifier having an amplifier stage with decreased gain is described. The sense amplifier includes a first input/output (“I/O”) node and a second complementary I/O node. The sense amplifier includes two amplifier stages, each for amplifying a signal on one of the I/O nodes. The first amplifier stage, having a first conductivity-type, amplifies one of the I/O node towards a first voltage. The second amplifier stage, having a second conductivity-type, amplifies the other I/O node towards a second voltage. The sense amplifier also includes a resistance circuit coupled to the second amplifier stage to reduce the gain of the second amplifier stage thereby reducing the rate of amplification of the signal on the corresponding I/O node.
摘要:
Various embodiments of the present invention are generally directed to an apparatus with embedded (bottom side) control lines for vertically stacked semiconductor elements, and a method for forming the same. In accordance with various embodiments, a first semiconductor wafer is provided with a first facing surface on which a first conductive layer is formed. The first semiconductor wafer is attached to a second semiconductor wafer to form a multi-wafer structure, the second semiconductor wafer having a second facing surface on which a second conductive wafer is formed. The first conductive layer is contactingly bonded to the second conductive layer to form an embedded combined conductive layer within said structure. Portions of the combined conductive layer are removed to form a plurality of spaced apart control lines that extend in a selected length or width dimension through said structure.
摘要:
Some embodiments include a number of nodes configured to receive a number of signals. The signals may represent information stored in a number of memory cells of a device such as a memory device. The device may include a number of transfer paths having storage elements coupled between the nodes and an output node. The transfer paths may be configured to transfer a selected signal of the signals from one of the nodes to the output node via one of the transfer paths. The transfer paths may be configured to hold a value of the selected signal in only one of the storage elements. Each of the transfer paths may include only one of the storage elements. Other embodiments including additional apparatus, systems, and methods are disclosed.
摘要:
A sense amplifier having an amplifier stage with decreased gain is described. The sense amplifier includes a first input/output (“I/O”) node and a second complementary I/O node. The sense amplifier includes two amplifier stages, each for amplifying a signal on one of the I/O nodes. The first amplifier stage, having a first conductivity-type, amplifies one of the I/O node towards a first voltage. The second amplifier stage, having a second conductivity-type, amplifies the other I/O node towards a second voltage. The sense amplifier also includes a resistance circuit coupled to the second amplifier stage to reduce the gain of the second amplifier stage thereby reducing the rate of amplification of the signal on the corresponding I/O node.