摘要:
A magnetic memory device comprises magneto-resistance elements each including a cylindrical fixed magnetization layer, an insulating film which covers an external surface of the fixed magnetization layer, and a free magnetization layer which faces the fixed magnetization layer through the insulating film and covers a surface of the insulating film, wherein a magnetization direction of the fixed magnetization layer is parallel to a central axis direction of the cylinder.
摘要:
MTJ elements are accumulated in a plurality of portions on a semiconductor substrate. A first conductive line functioning as a read line and extending in the X direction is connected to pin layers of the MTJ elements. A second conductive line functioning as a write line and read line and extending in the X direction is connected to free layers of the MTJ elements. A write line extends in the Y direction and is shared with two MTJ elements present above and below the write line. The two MTJ elements present above and below the write line are arranged symmetric to the write line.
摘要:
MTJ elements are accumulated in a plurality of portions on a semiconductor substrate. A first conductive line functioning as a read line and extending in the X direction is connected to pin layers of the MTJ elements. A second conductive line functioning as a write line and read line and extending in the X direction is connected to free layers of the MTJ elements. A write line extends in the Y direction and is shared with two MTJ elements present above and below the write line. The two MTJ elements present above and below the write line are arranged symmetric to the write line.
摘要:
A semiconductor device comprising: a support substrate; an embedded insulating layer formed on the support substrate; a semiconductor layer on the embedded insulating layer; at least an element region formed in the semiconductor layer; a plurality of source/drain regions of a first conductivity type, formed in the element region at predetermined intervals; a plurality of body regions of a second conductivity type, sandwiched between a pair of adjacent ones of the source/drain regions in the element region; and a gate formed on each of the body regions with a gate insulating film being laid between them, each of the source/drain regions including: an inner high-concentration portion extending to the embedded insulating layer, and an outer low-concentration portion surrounding the inner high-concentration portion and having a direct contact with the body regions.
摘要:
A semiconductor device includes a first wiring line having a first through hole, and a first connection member which extends through the first through hole at an interval from the first wiring line.
摘要:
A semiconductor memory device includes a semiconductor substrate, and a first magneto resistive element separated from the semiconductor substrate, and including a first magnetic layer and a first nonmagnetic layer. The first magnetic layer and the first nonmagnetic layer are formed in a direction perpendicular to the semiconductor substrate.
摘要:
MTJ elements are accumulated in a plurality of portions on a semiconductor substrate. Upper lines and lower lines extending in the X direction are connected to the MTJ elements. The number of MTJ elements arranged in each portion is gradually increased from a lower portion towards an upper portion. With respect to the upper lines, the upper lines arranged in the lower portion are connected to transistors present near an array of the MTJ elements, and the upper lines arranged in the upper portion are connected to transistors distant from the array of the MTJ elements. Also with respect to the lower lines, the lower lines in the lower portion are connected to transistors nearer to the array of the TRM elements than the lower lines in the upper portion.
摘要:
A semiconductor device according to an aspect of the present invention includes a substrate having a semiconductor substrate and a semiconductor layer provided on the semiconductor substrate, said semiconductor layer being insulated by an insulating film; a thyristor with a gate, its pnpn structure being laterally formed in said semiconductor layer of said substrate; and a transistor formed in said semiconductor layer of said substrate; said transistor being connected to one terminal of said thyristor. A method of manufacturing a semiconductor device according to other aspect of the present invention includes defining an element forming region isolated by an element isolation insulation film in a semiconductor layer of a first conductivity type provided on a semiconductor substrate, said semiconductor layer being insulated by an insulation film provided on the semiconductor substrate; forming a second base region of a first conductivity type in said element forming region; forming a first gate electrode of the thyristor and a second gate of the transistor above said second base region, said first and second gate electrodes being arranged in parallel; implanting ions to form a source and drain diffused regions of the second conductivity at both sides of said second gate electrode, and to form, at the same time, a second emitter region of the second conductivity type and a first base region, one of said source and drain diffused regions and said second emitter region being common region; providing a hole penetrating said first base region and said insulating film under said base region; and filling said hole with material of the first conductivity type to obtain a plug member as a first emitter region which contacts said semiconductor substrate.
摘要:
In a MOS transistor using shallow trench isolation, a pattern of an element formation region has a shape of a modified hexagon in which a hexagon is compressed into a shape like a rhombus in a direction perpendicular to an extension direction of a gate electrode wiring. The pattern of element formation region is constructed as described above, so that an element formation region is formed in a lager current path in a corner device. Thus, a lowering of a threshold voltage (a short channel effect) due to the comer device can be restricted without increasing a width of the gate electrode wiring.