公开(公告)号：US4753498A

公开(公告)日：1988-06-28

申请号：US841757

申请日：1986-03-20

申请人： Hiroshi Saitoh ,  Hiromitsu Okada ,  Hironobu Watanabe ,  Hiroshi Watanabe ,  Michio Waki ,  Keizo Shiihara ,  Hiromitsu Kijima ,  Yukito Matsuo ,  Tsuyoshi Ishida

发明人： Hiroshi Saitoh ,  Hiromitsu Okada ,  Hironobu Watanabe ,  Hiroshi Watanabe ,  Michio Waki ,  Keizo Shiihara ,  Hiromitsu Kijima ,  Yukito Matsuo ,  Tsuyoshi Ishida

IPC分类号： G02B5/09 ,  G02B26/12 ,  G06K7/10 ,  G02B26/10

CPC分类号： G06K7/10871 ,  G02B26/12 ,  G02B5/09

摘要： The present invention relates to an optical reader for scanning a surface to be scanned by using information beam ray such as laser beam ray and optically reading a recorded information such as bar code recorded in the surface to be scanned. The optical reader is constituted such that optical beam emitted from a light source is reflected on a first rotary multiface mirror to scan on a surface to be scanned, and information beam reflected on the surface to be scanned is reflected on a second rotary multiface mirror to guide to an opto-electric transforming means. A scanning optical path for permitting the optical beam from the light source to pass therealong is formed independently from a reflecting optical path for permitting the information beam from the surface to be scanned to pass therealong. A condensing lens system including a bore diameter large enough to cover the scanning optical path and reflecting optical path as well as a single optical axis is disposed between the surface to be scanned and the first and second rotary multiface mirrors.

摘要翻译： 本发明涉及一种用于通过使用诸如激光束射线的信息束射线扫描待扫描的表面的光学读取器，并且光学地读取记录在待扫描表面中的条形码的记录信息。 光学读取器被构造成使得从光源发射的光束被反射在第一旋转多功能镜上以在待扫描的表面上扫描，并且将要扫描的表面上反射的信息光束在第二旋转多镜面反射到 指导光电转换手段。 独立于反射光路形成用于允许来自光源的光束通过的扫描光路，用于允许来自表面的信息光束被扫描通过。 在被扫描的表面与第一和第二旋转多功能镜之间设置有包括足够大以覆盖扫描光路和反射光路以及单个光轴的孔直径的聚光透镜系统。

公开(公告)号：US4741286A

公开(公告)日：1988-05-03

申请号：US862031

申请日：1986-05-12

申请人： Tsutomu Itoh ,  Haruo Tateno ,  Hideo Nagasaka ,  Masahiro Yamamoto ,  Yusuke Mitsuyoshi ,  Susumu Matsuno ,  Hiroshi Saitoh ,  Masayuki Kitoh

发明人： Tsutomu Itoh ,  Haruo Tateno ,  Hideo Nagasaka ,  Masahiro Yamamoto ,  Yusuke Mitsuyoshi ,  Susumu Matsuno ,  Hiroshi Saitoh ,  Masayuki Kitoh

IPC分类号： B05D1/10 ,  B05B7/22 ,  B05D1/04 ,  C23C4/12 ,  H05H1/42 ,  B05B5/02

CPC分类号： H05H1/42 ,  B05B7/226 ,  C23C4/134

摘要： A single torch-type plasma spray coating method wherein a gas flow in a nozzle of a plasma torch is made to be a laminer flow, thereby the plasma flame jetted from the end of the plasma torch is modified to be a laminer flow flame, the plasma is separated from the plasma flame which contains liquid droplets of molten spray coating material and runs toward an object to be worked by means for separating plasma arranged immediately before said object to be worked, and remaining droplets of molten spray coating material impinges on said object to form a coating film thereon, and an apparatus therefor.

摘要翻译： 单炬式等离子体喷涂法，其中将等离子体焰炬的喷嘴中的气流制成层压机，由此等离子体焰炬末端喷射的等离子体火焰变为层流式火焰， 将等离子体与包含熔融喷涂材料的液滴的等离子体火焰分离，并且通过用于分离刚好在所述待加工物体之前排出的等离子体的方式朝向待加工物体运行，并且剩余的熔融喷涂材料的液滴撞击在所述物体上 以在其上形成涂膜及其装置。

公开(公告)号：US08218997B2

公开(公告)日：2012-07-10

申请号：US12469223

申请日：2009-05-20

申请人： Takatsugu Fujishiro ,  Hiroshi Saitoh

发明人： Takatsugu Fujishiro ,  Hiroshi Saitoh

IPC分类号： G03G15/02 ,  G03G21/00

CPC分类号： G03G21/0058

摘要： A cleaning member includes a core bar, an elastic coating layer, and high-friction coefficient parts provided on both ends of the cleaning member. The high-friction coefficient parts include an elastic material. Outer peripheries of the high-friction coefficient parts are inclined with respect to an axial direction of the core bar. The cleaning member is roller-shaped and is configured to clean a surface of a roller member to be cleaned in contact therewith. A charging device and a process cartridge also include the cleaning member.

摘要翻译： 清洁部件包括芯棒，弹性涂层和设置在清洁部件两端的高摩擦系数部件。 高摩擦系数部件包括弹性材料。 高摩擦系数部分的外周相对于芯棒的轴向倾斜。 清洁构件是辊状的并且构造成清洁与其清洁的辊构件的表面接触。 充电装置和处理盒还包括清洁构件。

公开(公告)号：US08138757B2

公开(公告)日：2012-03-20

申请号：US11214986

申请日：2005-08-31

申请人： Hiroshi Adachi ,  Hiroshi Saitoh ,  Kenichi Shirasaka ,  Hideki Sato ,  Masayoshi Omura

发明人： Hiroshi Adachi ,  Hiroshi Saitoh ,  Kenichi Shirasaka ,  Hideki Sato ,  Masayoshi Omura

IPC分类号： G01R33/02

CPC分类号： G01R33/0206 ,  G01C17/30 ,  H01L21/565 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  Y10T29/49121 ,  Y10T29/49169 ,  Y10T29/49174 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A magnetic sensor is constituted using magnetic sensor chips mounted on stages supported by interconnecting members and a frame having leads in a lead frame. Herein, the stages are inclined upon plastic deformation of the interconnecting members. When the frame is held in a metal mold and the stages are pressed, the interconnecting members are elastically deformed, so that the magnetic sensor chips are bonded onto the stages placed substantially in the same plane and are then wired with the leads. Thereafter, the stages are released from pressure, so that the interconnecting members are restored from the elastically deformed states thereof. When the magnetic sensor chips are combined together to realize three sensing directions, it is possible to accurately measure three-dimensional bearings of magnetism, and the magnetic sensor can be reduced in dimensions and manufactured with a reduced cost thereof.

摘要翻译： 磁传感器由安装在由互连构件支撑的台架上的磁传感器芯片和在引线框架中具有引线的框架构成。 这里，阶段倾向于互连构件的塑性变形。 当框架保持在金属模具中并且阶段被按压时，互连构件弹性变形，使得磁性传感器芯片被接合到基本上位于同一平面上的台架上，然后与引线接线。 此后，各级从压力释放，使互连构件从其弹性变形状态恢复。 当磁传感器芯片组合在一起以实现三个感测方向时，可以精确地测量磁性的三维轴承，并且可以降低磁性传感器的尺寸并降低成本。

公开(公告)号：US07924325B2

公开(公告)日：2011-04-12

申请号：US11547634

申请日：2005-04-14

申请人： Nobukatsu Okuda ,  Hideki Otaka ,  Katsuyuki Sakaniwa ,  Hiroshi Saitoh ,  Toshihiro Tanaka ,  Hisataka Ueda ,  Norikatsu Yoshida

发明人： Nobukatsu Okuda ,  Hideki Otaka ,  Katsuyuki Sakaniwa ,  Hiroshi Saitoh ,  Toshihiro Tanaka ,  Hisataka Ueda ,  Norikatsu Yoshida

IPC分类号： H04N5/225

CPC分类号： H04N5/772 ,  G11B27/034 ,  G11B27/329 ,  H04N5/781 ,  H04N5/907 ,  H04N9/8042 ,  H04N9/8063 ,  H04N9/8205

摘要： In recording materials of a video program or the like, the video materials are efficiently and optimally acquired so that processing steps in and after an editing step subsequent to a recording step can be reduced. A recording support information (metadata) on a schedule of and a performer for an imaging operation, and the like, which are determined in advance is recorded in a first recording medium 16 by a program constitution input device 100. The first recording medium 16 is inserted in to an imaging device 200, materials to be recorded are classified and confirmed based on the metadata, and the materials which can constitute a desirable program as potentially as possible are acquired in the recording operation.

摘要翻译： 在视频节目等的记录材料中，高效地和最佳地获取视频资料，从而能够减少在记录步骤之后的编辑步骤之后和之后的处理步骤。 通过程序结构输入装置100将预先确定的用于成像操作的计划和执行者的记录支持信息（元数据）等记录在第一记录介质16中。第一记录介质16是 插入到成像装置200中，基于元数据对要记录的材料进行分类和确认，并且在记录操作中获取尽可能潜在地构成期望的程序的材料。

公开(公告)号：US07829982B2

公开(公告)日：2010-11-09

申请号：US11355175

申请日：2006-02-16

申请人： Kenichi Shirasaka ,  Hiroshi Saitoh

发明人： Kenichi Shirasaka ,  Hiroshi Saitoh

IPC分类号： H01L23/495

CPC分类号： G01C17/28 ,  H01L21/565 ,  H01L23/49503 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/181 ,  Y10T29/49 ,  Y10T29/49121 ,  Y10T29/49174 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A lead frame includes a frame body defining an internal region, a plurality of leads extending from the frame body, and first and second stages that are disposed in the internal region. The first and second stages are sloped and are parallel to a first line along which a primary stream of a molten resin runs, so that slope angles of the stages are not substantially changed by the injection of the molten resin into the cavity.

摘要翻译： 引线框架包括限定内部区域的框架体，从框体延伸的多个引线以及设置在内部区域中的第一和第二级。 第一和第二阶段是倾斜的，并且平行于熔融树脂的初级流沿其流动的第一行，使得通过将熔融树脂注入空腔中实质上不改变阶段的倾斜角。

公开(公告)号：US07727793B2

公开(公告)日：2010-06-01

申请号：US11543034

申请日：2006-10-05

申请人： Kenichi Shirasaka ,  Hiroshi Saitoh

发明人： Kenichi Shirasaka ,  Hiroshi Saitoh

IPC分类号： H01L21/58

CPC分类号： B81B7/0077 ,  B81B2201/0235 ,  B81B2201/025 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A physical quantity sensor includes a pair of physical quantity sensor chips that are inclined with respect to the bottom of an exterior mold package whose side surfaces are each inclined in a thickness direction by an angle ranging from 0° to 5° and are formed in proximity to the outer ends of the physical quantity sensor chips. It is possible to realize the inclination of stages without using molds, wherein absorption devices are used to absorb prescribed portions related to stages, which rotate about axial lines and are thus inclined with respect to a prescribed base. In manufacturing, a thin metal plate having a plurality of lead frames is placed on a base delimited by a clamp; then, intersecting points of intermediate portions formed between the lead frames are subjected to pressing so as to realize the inclination of stages.

摘要翻译： 物理量传感器包括一对物理量传感器芯片，其相对于外部模具封装的底部倾斜，其侧表面各自在厚度方向上倾斜0°至5°的角度并且形成在接近 到物理量传感器芯片的外端。 可以在不使用模具的情况下实现阶段的倾斜，其中吸收装置用于吸收与围绕轴线旋转并且因此相对于规定的基座倾斜的阶段相关的规定部分。 在制造中，具有多个引线框架的薄金属板放置在由夹具限定的基座上; 然后，对形成在引线框架之间的中间部分的相交点进行压制，以实现级的倾斜。

公开(公告)号：US07560811B2

公开(公告)日：2009-07-14

申请号：US11634384

申请日：2006-12-06

申请人： Shingo Sakakibara ,  Hiroshi Saitoh ,  Toshihisa Suzuki

发明人： Shingo Sakakibara ,  Hiroshi Saitoh ,  Toshihisa Suzuki

IPC分类号： H01L29/82

CPC分类号： B81B7/007 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81C1/0023 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00011

摘要： A semiconductor device is designed such that a semiconductor sensor chip having a diaphragm for detecting pressure variations based on the displacement thereof is fixed onto the upper surface of a substrate having a rectangular shape, which is covered with a cover member so as to form a hollow space embracing the semiconductor sensor chip between the substrate and the cover member. Herein, the substrate is sealed with a molded resin such that chip connection leads packaging leads are partially exposed externally of the molded resin; the chip connection leads are electrically connected to the semiconductor sensor chip and are disposed in line along one side of the semiconductor sensor chip; and the packaging leads are positioned opposite the chip connection leads by way of the semiconductor sensor chip. Thus, it is possible to downsize the semiconductor device without substantially changing the size of the semiconductor sensor chip.

摘要翻译： 半导体器件被设计成使得具有用于检测基于其位移的压力变化的隔膜的半导体传感器芯片被固定到矩形形状的基板的上表面上，该基板被覆盖件覆盖以形成中空 覆盖基板和盖构件之间的半导体传感器芯片的空间。 这里，基板被模制树脂密封，使得芯片连接将封装引线部分地暴露在模制树脂的外部; 芯片连接引线电连接到半导体传感器芯片并且沿着半导体传感器芯片的一侧设置成一行; 并且封装引线通过半导体传感器芯片与芯片连接引线相对定位。 因此，可以实质上改变半导体传感器芯片的尺寸来减小半导体器件的尺寸。

公开(公告)号：US07554182B2

公开(公告)日：2009-06-30

申请号：US11516705

申请日：2006-09-07

申请人： Kenichi Shirasaka ,  Hiroshi Saitoh

发明人： Kenichi Shirasaka ,  Hiroshi Saitoh

IPC分类号： H01L23/495

CPC分类号： H01L23/3107 ,  H01L21/565 ,  H01L23/49503 ,  H01L23/49551 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A semiconductor package encapsulating a semiconductor chip provides inner leads and outer leads for establishing electrical connections with the substrate. Herein, a lead frame is set into the metal mold, into which a resin is injected and which is clamped in proximity to the outer leads. Thus, the semiconductor package is sealed so as to avoid unwanted formation of resin burrs around lower surfaces of the inner leads. In addition, a semiconductor device is produced using a package in which a semiconductor chip mounted on a stage and terminals are embedded within a resin. Each terminal provides an electrode surface, an interconnecting portion, and an exposed terminal surface. Herein, an isolation portion is formed as an integral part of the package made by the resin and is arranged in the prescribed area between the electrode surface and the exposed terminal surface.

摘要翻译： 封装半导体芯片的半导体封装提供用于建立与衬底的电连接的内引线和外引线。 这里，将引线框架设置在金属模具中，树脂被注入到金属模具中，并且被夹紧在外部引线附近。 因此，密封半导体封装，以避免在内引线的下表面周围形成树脂毛刺。 此外，使用其中安装在载物台上的半导体芯片和端子嵌入树脂中的封装制造半导体器件。 每个端子提供电极表面，互连部分和暴露的端子表面。 这里，隔离部形成为由树脂制成的封装的一体部分，并且布置在电极表面和暴露端子表面之间的规定区域中。

公开(公告)号：US07170149B2

公开(公告)日：2007-01-30

申请号：US10120391

申请日：2002-04-12

申请人： Kenichi Shirasaka ,  Hiroshi Saitoh

发明人： Kenichi Shirasaka ,  Hiroshi Saitoh

IPC分类号： H01L23/495

CPC分类号： H01L23/3107 ,  H01L21/565 ,  H01L23/49503 ,  H01L23/49551 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A semiconductor package encapsulating a semiconductor chip provides inner leads and outer leads for establishing electrical connections with the substrate. Herein, a lead frame is set into the metal mold, into which a resin is injected and which is clamped in proximity to the outer leads. Thus, the semiconductor package is sealed so as to avoid unwanted formation of resin burrs around lower surfaces of the inner leads. In addition, a semiconductor device is produced using a package in which a semiconductor chip mounted on a stage and terminals are embedded within a resin. Each terminal provides an electrode surface, an interconnecting portion, and an exposed terminal surface. Herein, an isolation portion is formed as an integral part of the package made by the resin and is arranged in the prescribed area between the electrode surface and the exposed terminal surface.

摘要翻译： 封装半导体芯片的半导体封装提供用于建立与衬底的电连接的内引线和外引线。 这里，将引线框架设置在金属模具中，树脂被注入到金属模具中，并且被夹紧在外部引线附近。 因此，密封半导体封装，以避免在内引线的下表面周围形成树脂毛刺。 此外，使用其中安装在载物台上的半导体芯片和端子嵌入树脂中的封装制造半导体器件。 每个端子提供电极表面，互连部分和暴露的端子表面。 这里，隔离部形成为由树脂制成的封装的一体部分，并且布置在电极表面和暴露端子表面之间的规定区域中。