公开(公告)号：US20230207408A1

公开(公告)日：2023-06-29

申请号：US17561735

申请日：2021-12-24

Applicant: Intel Corporation

Inventor： Georgios C. DOGIAMIS ,  Aleksandar ALEKSOV ,  Telesphor KAMGAING ,  Neelam PRABHU GAUNKAR ,  Brandon RAWLINGS ,  Veronica STRONG

IPC: H01L23/15 ,  H01L23/498 ,  H01L21/48 ,  H01L23/00

CPC classification number: H01L23/15 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L21/486 ,  H01L24/16 ,  C03C23/0025

Abstract: Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment, an electronic package comprises a core. In an embodiment, the core comprises glass. In an embodiment, a blind via is provided into the core. In an embodiment, a plate spans across the blind via.

公开(公告)号：US20230207407A1

公开(公告)日：2023-06-29

申请号：US17561734

申请日：2021-12-24

Applicant: Intel Corporation

Inventor： Georgios C. DOGIAMIS ,  Telesphor KAMGAING ,  Brandon RAWLINGS ,  Neelam PRABHU GAUNKAR ,  Veronica STRONG ,  Aleksandar ALEKSOV

IPC: H01L23/15 ,  H01L23/498 ,  H01L21/48 ,  H01L23/00

CPC classification number: H01L23/15 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L21/486 ,  H01L24/16 ,  C03C23/0025

Abstract: Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment, an electronic package comprises a core, where the core comprises glass. In an embodiment, a via opening is formed through the core. In an embodiment, the via opening has an aspect ratio (depth:width) that is approximately 5:1 or greater. In an embodiment, the electronic package further comprises a via in the via opening, where the via opening is fully filled.

公开(公告)号：US20230197541A1

公开(公告)日：2023-06-22

申请号：US17557913

申请日：2021-12-21

Applicant: Intel Corporation

Inventor： Veronica STRONG ,  Telesphor KAMGAING ,  Aleksandar ALEKSOV ,  Georgios C. DOGIAMIS ,  Brandon RAWLINGS ,  Neelam PRABHU GAUNKAR

IPC: H01L23/15 ,  H01L23/48 ,  H01L23/498

CPC classification number: H01L23/15 ,  H01L23/481 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49816

Abstract: Embodiments disclosed herein include an electronic package that comprises a substrate with a first surface and a second surface opposite from the first surface. In an embodiment, the substrate comprises glass. In an embodiment, the electronic package further comprises an opening through the substrate from the first surface to the second surface, where the opening comprises a first end proximate to the first surface of the substrate, a second end proximate to the second surface of the substrate, and a middle region between the first end and the second end. In an embodiment, the middle region has a discontinuous slope at junctions with the first end and the second end.

公开(公告)号：US20220407203A1

公开(公告)日：2022-12-22

申请号：US17350169

申请日：2021-06-17

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING ,  Veronica STRONG ,  Georgios C. DOGIAMIS ,  Neelam PRABHU GAUNKAR ,  Aleksandar ALEKSOV

IPC: H01P3/06 ,  H01L49/02 ,  H01L23/15 ,  H01L23/498 ,  H01L23/66 ,  H01L21/48 ,  H01P11/00

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to creating coaxial structures within glass package substrates. These techniques, in embodiments, may be extended to create other structures, for example capacitors within glass substrates. Other embodiments may be described and/or claimed.

公开(公告)号：US20220407199A1

公开(公告)日：2022-12-22

申请号：US17354903

申请日：2021-06-22

Applicant: Intel Corporation

Inventor： Aleksandar ALEKSOV ,  Neelam PRABHU GAUNKAR ,  Veronica STRONG ,  Georgios C. DOGIAMIS ,  Telesphor KAMGAING

IPC: H01P1/20 ,  H05K1/02 ,  H01L21/48 ,  H01L23/498

Abstract: Embodiments disclosed herein include package substrates with filter architectures. In an embodiment, a package substrate comprises a core with a first surface and a second surface, and a filter embedded in the core. In an embodiment, the filter comprises a ground plane, where the ground plane is substantially orthogonal to the first surface of the core, and a resonator adjacent to the ground plane.

公开(公告)号：US20220406991A1

公开(公告)日：2022-12-22

申请号：US17349653

申请日：2021-06-16

Applicant: Intel Corporation

Inventor： Neelam PRABHU GAUNKAR ,  Telesphor KAMGAING ,  Veronica STRONG ,  Georgios C. DOGIAMIS ,  Aleksandar ALEKSOV

IPC: H01L43/02 ,  H01L23/13 ,  H01L23/15 ,  H01L23/473 ,  H01L23/498 ,  H01L23/66 ,  H01L27/22

Abstract: Embodiments disclosed herein comprise package substrates and methods of forming such package substrates. In an embodiment, a package substrate comprises a core, where the core comprises glass. In an embodiment, an opening if formed through the core. In an embodiment, a magnetic region is disposed in the opening.

公开(公告)号：US20210265732A1

公开(公告)日：2021-08-26

申请号：US17317332

申请日：2021-05-11

Applicant: Intel Corporation

Inventor： Feras EID ,  Sasha N. OSTER ,  Telesphor KAMGAING ,  Georgios C. DOGIAMIS ,  Aleksandar ALEKSOV

IPC: H01Q9/04 ,  H01L21/56 ,  H01L23/31 ,  H01L23/495 ,  H01L23/552 ,  H01L23/66 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/52 ,  H01Q19/22

Abstract: Embodiments of the invention include a microelectronic device that includes a first substrate having radio frequency (RF) components and a second substrate that is coupled to the first substrate. The second substrate includes a first conductive layer of an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. A mold material is disposed on the first and second substrates. The mold material includes a first region that is positioned between the first conductive layer and a second conductive layer of the antenna unit with the mold material being a dielectric material to capacitively couple the first and second conductive layers of the antenna unit.

公开(公告)号：US20200227366A1

公开(公告)日：2020-07-16

申请号：US16827296

申请日：2020-03-23

Applicant: Intel Corporation

Inventor： Georgios C. DOGIAMIS ,  Telesphor KAMGAING ,  Javier A. FALCON ,  Yoshihiro TOMITA ,  Vijay K. NAIR

IPC: H01L23/66 ,  H01L23/00 ,  H01L25/18

Abstract: Embodiments of the invention include a microelectronic device that includes a first die formed with a silicon based substrate and a second die coupled to the first die. The second die is formed with compound semiconductor materials in a different substrate (e.g., compound semiconductor substrate, group III-V substrate). An antenna unit is coupled to the second die. The antenna unit transmits and receives communications at a frequency of approximately 4 GHz or higher.

公开(公告)号：US20200219861A1

公开(公告)日：2020-07-09

申请号：US16647451

申请日：2017-12-28

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING ,  Vijay K. NAIR ,  Feras EID ,  Georgios C. DOGIAMIS ,  Johanna M. SWAN ,  Stephan LEUSCHNER

IPC: H01L25/16 ,  H01L23/498 ,  H01L23/24 ,  H03H9/17 ,  H03H9/05

Abstract: RF front end systems or modules with an acoustic wave resonator (AWR) on an interposer substrate are described. In an example, an integrated system includes an active die, the active die comprising a semiconductor substrate having a plurality of active circuits therein. An interposer is also included, the interposer comprising an acoustic wave resonator (AWR). A seal frame couples the active die to the interposer, the seal frame surrounding the acoustic wave resonator and hermetically sealing the acoustic wave resonator between the active die and the interposer.

公开(公告)号：US20200168402A1

公开(公告)日：2020-05-28

申请号：US16605968

申请日：2017-06-27

Applicant: Intel Corporation

Inventor： Feras EID ,  Aleksandar ALEKSOV ,  Georgios C. DOGIAMIS ,  Thomas L. SOUNART ,  Johanna M. SWAN

IPC: H01G5/16 ,  H01G5/14 ,  H01L23/00

Abstract: Embodiments of the invention include a microelectronic device that includes a plurality of organic dielectric layers and a piezoelectrically actuated tunable capacitor having a variable capacitance formed in-situ with at least one organic dielectric layer of the plurality of organic dielectric layers. A piezoelectric actuator of the tunable capacitor includes first and second conductive electrodes and a piezoelectric layer that is positioned between the first and second conductive electrodes.