公开(公告)号：US07724182B2

公开(公告)日：2010-05-25

申请号：US12099905

申请日：2008-04-09

申请人： Kenichi Inoue ,  Daisuke Ueda ,  Noboru Negoro ,  Hiroyuki Sakai

发明人： Kenichi Inoue ,  Daisuke Ueda ,  Noboru Negoro ,  Hiroyuki Sakai

IPC分类号： G01S7/40

CPC分类号： G01S7/4004 ,  G01S7/285 ,  G01S13/931

摘要： The radar system includes: a transmission circuit transmitting the radar waves via a transmission antenna; a receiving circuit receiving the reflected waves via a receiving antenna; a delay line having an end connected to aid transmission circuit and the other end connected to said receiving circuit, which delays the radar waves by a predetermined delay amount; a correlation circuit/coherent detection circuit which detects a waveform having a strength equal to or higher than a predetermined strength, from a signal provided from said receiving circuit which obtains the signal from the reflected waves or the delayed radar waves; and a level decision circuit which judges, during self-diagnosis, whether or not the detected waveform is a waveform of the delayed radar wave according to the predetermined delay amount, and if the waveform is not the waveform of the delayed radar wave, determines that abnormality occurs in said radar system.

摘要翻译： 雷达系统包括：通过发射天线发射雷达波的发射电路; 接收电路，经由接收天线接收反射波; 延迟线，其端部连接以辅助传输电路，另一端连接到所述接收电路，其将雷达波延迟预定的延迟量; 相关电路/相干检测电路，从从所述接收电路提供的信号中检测出具有等于或大于预定强度的强度的波形，该信号从反射波或延迟雷达波获得信号; 以及电平判定电路，在自诊断期间，根据预定的延迟量判断检测出的波形是否是延迟的雷达波的波形，如果波形不是延迟的雷达波的波形，则判定为 所述雷达系统发生异常。

公开(公告)号：US07568834B2

公开(公告)日：2009-08-04

申请号：US11926721

申请日：2007-10-29

申请人： Hidebumi Seki ,  Hiroyuki Sakai ,  Tomohiro Rokugawa

发明人： Hidebumi Seki ,  Hiroyuki Sakai ,  Tomohiro Rokugawa

IPC分类号： G01K1/00 ,  G01K13/00

CPC分类号： G01K1/14 ,  G01D11/24 ,  G01D11/30 ,  G01F15/06 ,  G01F15/18 ,  G01F15/185 ,  G01K1/06 ,  G01L19/16

摘要： A detector (10) includes: a joint (20) mounted on a fluid pipe; a case (30) mounted on the joint (20) to house a sensor (60); a holder (40) attached to the case (30) and housing a circuit board (70); and a cover (50) attached to the holder (40) and integrated with a light-shielding plate (53). An annular first lug (421), a leaf spring (422) having a projection (423) and a rotation restrainer which projects further from the first lug (421) along an inner circumferential side thereof are integrally formed on the holder (40). An annular first recess (32) to be engaged with the first lug (421) is formed on the case (30). A groove (33) is formed on an inner surface of the first recess. An annular second recess (34) is provided on an inner circumferential side of the first recess (32). A riser portion (35) is provided to a bottom surface thereof.

摘要翻译： 检测器（10）包括：安装在流体管上的接头（20）; 安装在接头（20）上以容纳传感器（60）的壳体（30）; 安装在壳体（30）上并容纳电路板（70）的支架（40）; 以及附接到所述保持器（40）并与遮光板（53）一体化的盖（50）。 在保持器（40）上一体形成环状的第一凸缘（421），具有突起（423）的旋转限制器的环形第一凸耳（421）和从第一凸缘（421）进一步突出的旋转限制器。 在壳体（30）上形成有与第一凸耳（421）接合的环形第一凹部（32）。 在第一凹部的内表面上形成有凹槽（33）。 在第一凹部（32）的内周侧设有环状的第二凹部（34）。 提升部分（35）设置在其底面。

公开(公告)号：US20080252574A1

公开(公告)日：2008-10-16

申请号：US11979042

申请日：2007-10-30

申请人： Hiroyuki Sakai ,  Takehiro Koyama ,  Hideki Muramatsu ,  Toshiaki Kobayashi

发明人： Hiroyuki Sakai ,  Takehiro Koyama ,  Hideki Muramatsu ,  Toshiaki Kobayashi

IPC分类号： G09G3/32

CPC分类号： G09G3/14

摘要： An LED display apparatus 1 in which at least multiple LEDs are serially-connected to a power circuit part having a constant current power source, each one of the LEDs has a switching element parallel-connected thereto, and a control circuit part is used to selectively turn on/off the switching elements to control the LEDs for a specific display, characterized by the fact that the apparatus comprises a display matrix circuit part 9 constituted by parallel-connecting to the power circuit part 8 multiple LED circuits 7a, 7b, 7c . . . consisting of multiple LEDs 2 . . . and a single first switching element 3a, 3b, 3c . . . serially-connected and second switching element 4 . . . each parallel-connected to one of the LEDs 2 . . . , and a control circuit part 10 turning on the first switching elements 3a . . . for a given time period (Ts) in sequence and turning on/off a row La, Lb, Lc . . . of multiple second switching elements 4 . . . extending across the LED circuits 7a . . . of the display matrix circuit part 9 in correspondence with the first switch 3a . . . being turned on.

摘要翻译： 一种LED显示装置1，其中至少多个LED串联连接到具有恒流电源的电源电路部分，每个LED具有与其并联的开关元件，并且控制电路部分被选择性地 打开/关闭开关元件以控制用于特定显示器的LED，其特征在于该装置包括通过并联连接到电源电路部分8构成的显示矩阵电路部分9，多个LED电路7a，7b， 7 c。 。 。 由多个LED组成2。 。 。 和单个第一开关元件3a，3b，3c。 。 。 串联和第二开关元件4。 。 。 每个并联连接到一个LED 2。 。 。 以及接通第一开关元件3a的控制电路部10。 。 。 对于给定的时间段（Ts）并且打开/关闭行La，Lb，Lc。 。 。 多个第二开关元件4。 。 。 延伸穿过LED电路7a。 。 。 显示矩阵电路部分9对应于第一开关3a。 。 。 被打开

公开(公告)号：US20080205697A1

公开(公告)日：2008-08-28

申请号：US12026380

申请日：2008-02-05

申请人： Hiroyuki Sakai ,  Kiyoshi Umeda

发明人： Hiroyuki Sakai ,  Kiyoshi Umeda

IPC分类号： G06K9/00

CPC分类号： G06T1/0064 ,  G06T2201/0051 ,  G06T2201/0061 ,  H04N1/32203 ,  H04N1/32267 ,  H04N1/32352

摘要： For facilitating detecting the position of additional information embedded in image information shown on a printed matter, an input unit configured to input image information and an embedding unit configured to embed a plurality of code patterns in the image information according to additional information are provided. The additional information includes direction-determination information used to detect the direction in which the additional information is embedded in the image information. When one of the code patterns is rotated, the rotated code pattern corresponds to one of the code patterns that are not yet rotated.

摘要翻译： 为了便于检测嵌入在印刷品上显示的图像信息中的附加信息的位置，提供了被配置为输入图像信息的输入单元和被配置为根据附加信息将多个代码图案嵌入在图像信息中的嵌入单元。 附加信息包括用于检测在图像信息中嵌入附加信息的方向的方向确定信息。 当其中一个代码图案旋转时，旋转的代码图案对应于尚未旋转的代码图案之一。

公开(公告)号：US06774501B2

公开(公告)日：2004-08-10

申请号：US10381034

申请日：2003-03-21

申请人： Kazuhiko Kurafuchi ,  Naoya Suzuki ,  Masaaki Yasuda ,  Tatsuo Kawata ,  Hiroyuki Sakai ,  Masao Kawasumi

发明人： Kazuhiko Kurafuchi ,  Naoya Suzuki ,  Masaaki Yasuda ,  Tatsuo Kawata ,  Hiroyuki Sakai ,  Masao Kawasumi

IPC分类号： H01L2329

CPC分类号： H01L23/3107 ,  C08G59/302 ,  C08L63/00 ,  H01L23/293 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A resin-sealed semiconductor device which comprises a lead frame having a die bond pad and an inner lead, a semiconductor chip installed on the die bond pad via a die bonding material and a sealing material for sealing the semiconductor chip and the lead frame, wherein properties of the die bonding material and the sealing material after curing satisfies the following formulae: &sgr;e≦0.2×&sgr;b formula (1) Ui≧2.0×10−6×&sgr;ei formula (2) Ud≧4.69×10−6×ed formula (3) wherein &sgr;b (MPa)represents the flexural strength at break of the sealing material at 25°, Ui (N·m) and Ud (N·m) represent shear strain energies of the sealing material at a soldering temperature for the inner lead and the die bonding pad, respectively, at a peak temperature during soldering, where &sgr;e=(1/log(kd1))×Ee1×(&agr;m−&agr;e1)×&Dgr;T1 formula (4), &sgr;ei=Ee2×(&agr;e2−&agr;m)×&Dgr;T2 formula (5), &sgr;ed=log(kd2)×Ee2×(&agr;e2−&agr;m)×&Dgr;T2 Formula (6), kd1: a ratio of the flexural elastic modulus Ed1 (MPa) of the die bonding material at 25° to 1 MPa of elastic modulus (Ed1>1 MPa), kd2: a ratio of the flexural elastic modulus Ed2 (MPa) of the die bonding material at the peak temperature during the soldering to 1 MPa of elastic modulus (Ed2>1 MPa), Ee1: a flexural modulus (MPa) of the sealing material at 25°, Ee2: a flexural modulus (MPa) of the sealing material at the peak temperature during soldering, &agr;e1: an average thermal expansion coefficient (1/° C.) of the sealing material from forming temperature for the semiconductor to room temperature (25° C.), &agr;e2: an average thermal expansion coefficient (1/° C.) of the sealing material from the forming temperature for the semiconductor to a peak temperature during soldering, &agr;m: a thermal expansion coefficient (1/° C.) of the lead frame, &Dgr;T1: the difference (° C.) between the forming temperature for the semiconductor and the low temperature side temperature in the temperature cycle, and &Dgr;T2: the difference (° C.) between the forming temperature for the semiconductor and the peak temperature during soldering.

公开(公告)号：USD473249S1

公开(公告)日：2003-04-15

申请号：US29162472

申请日：2002-06-18

申请人： Kazuhisa Horikiri ,  Hiroyuki Sakai

设计人： Kazuhisa Horikiri ,  Hiroyuki Sakai

公开(公告)号：US06284818B1

公开(公告)日：2001-09-04

申请号：US09521212

申请日：2000-03-08

申请人： Tatsuo Kawata ,  Hiroyuki Sakai ,  Terumi Tsukahara

发明人： Tatsuo Kawata ,  Hiroyuki Sakai ,  Terumi Tsukahara

IPC分类号： C08K536

CPC分类号： H01L23/293 ,  C08K3/28 ,  C08K5/23 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/1301 ,  H01L2924/181 ,  C08L63/00 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： In the present invention, provided are i) an encapsulant composition comprising an epoxy resin, a curing agent, an inorganic filler, an adduct of triphenylphosphine with benzoquinone, and a hydrous bismuth nitrate oxide; the inorganic filler being mixed in an amount of from 70% by volume to 85% by volume based on the total weight of the encapsulant composition, and the hydrous bismuth nitrate oxide being mixed in an amount of from 2.5 parts by weight to 20 parts by weight based on 100 parts by weight of the epoxy resin, and ii) an electronic device having an encapsulating member comprising a cured product of this encapsulant composition.

摘要翻译： 在本发明中，i）包含环氧树脂，固化剂，无机填料，三苯基膦与苯醌的加成物和硝酸铋硝酸盐的密封剂组合物; 相对于密封剂组合物的总重量，无机填料的混合量为70体积％至85体积％，硝酸铋水合物的混合量为2.5重量份至20重量份， 基于100重量份的环氧树脂的重量，以及ii）具有包含该密封剂组合物的固化产物的封装构件的电子器件。

公开(公告)号：US5787853A

公开(公告)日：1998-08-04

申请号：US601287

申请日：1996-02-16

申请人： Shuhei Adachi ,  Hiroyuki Sakai

发明人： Shuhei Adachi ,  Hiroyuki Sakai

IPC分类号： F02F1/24 ,  B23C3/05 ,  B23K20/00 ,  F01L1/26 ,  F01L3/02 ,  F01L3/22 ,  F02F7/00

CPC分类号： F01L3/22 ,  B23C3/055 ,  F01L1/265 ,  F02F7/006

摘要： Valve seat-bonding area structures of a cylinder head unit, wherein a valve seat made of a metal different from and harder than that of the cylinder head unit is bonded to a circumference of a valve opening of the cylinder head unit, which structures are characterized in that a second tapered guide surface, which has an open angle larger than that of a first tapered guide surface with respect to an axis of a valve shaft, is formed outward of the first tapered guide surface in order to prevent pitting and cracking of the surfaces during grinding and improve the gas-interchanging efficiency.

摘要翻译： 气缸盖单元的阀座接合区域结构，其中由不同于并且比气缸盖单元更硬的金属制成的阀座结合到气缸盖单元的阀开口的圆周上，该结构被表征 因为相对于阀轴的轴线具有大于第一锥形引导表面的开口角的第二锥形引导表面被形成在第一锥形引导表面的外部，以防止点蚀和破裂 研磨过程中的表面，提高了气体互换效率。

公开(公告)号：US5483466A

公开(公告)日：1996-01-09

申请号：US151813

申请日：1993-11-15

申请人： Tetsuya Kawahara ,  Junji Nakata ,  Yuji Kimura ,  Hiroyuki Sakai ,  Masakazu Hamaguchi ,  Takahiro Yamada ,  Tomohisa Kohiyama ,  Takahiro Nakano

发明人： Tetsuya Kawahara ,  Junji Nakata ,  Yuji Kimura ,  Hiroyuki Sakai ,  Masakazu Hamaguchi ,  Takahiro Yamada ,  Tomohisa Kohiyama ,  Takahiro Nakano

IPC分类号： G06F13/00 ,  H04L12/58 ,  H04L29/06

CPC分类号： H04L12/5885 ,  G06Q10/107 ,  H04L29/06 ,  H04L51/34 ,  H04L12/5855 ,  H04L67/42

摘要： A mail reception/display control method which permits a user on a reception side to be informed the reception of an item of mail immediately upon reception of the mail even during the course of another job, and to ascertain the content of the received mail with ease upon mail reception. A mail reception detection unit included in each of the client terminals monitors the mail reception from any other client. When the mail reception has been detected, a mail attribute discrimination unit decides whether or not the received mail is to be transferred from a server to that particular client. When the mail transfer is required, a mail transfer unit transfers the mail from the server to the particular client. Subsequently, a mail reception display unit disposed at the client on the reception side presents a display to the effect that the mail has been received. Further, when the user has made a reply of confirmation to the display of the mail reception, a mail replay unit replays the received mail.

摘要翻译： 一种邮件接收/显示控制方法，即使在另一作业的过程中也允许接收方的用户在接收到邮件时立即接收邮件项目，并且容易地确定接收的邮件的内容 邮件接收。 包括在每个客户终端中的邮件接收检测单元监视来自任何其他客户端的邮件接收。 当检测到邮件接收时，邮件属性判别单元判定接收到的邮件是否从服务器传送到该特定客户端。 当需要邮件传输时，邮件传送单元将邮件从服务器传送到特定客户端。 随后，在接收侧的客户端处设置的邮件接收显示单元显示出已经接收到邮件的显示。 此外，当用户对邮件接收的显示做出确认的答复时，邮件重放单元重播所接收的邮件。

公开(公告)号：US5070375A

公开(公告)日：1991-12-03

申请号：US437571

申请日：1989-11-17

申请人： Hiroyuki Sakai

发明人： Hiroyuki Sakai

IPC分类号： H01L29/201 ,  H01L21/20 ,  H01L29/06 ,  H01L29/15

CPC分类号： B82Y10/00 ,  H01L29/151 ,  H01L29/158

摘要： The present invention teaches a semiconductor having a quantum box structure, where the quantum box structure consists of quantum boxes and barriers and arranged in adjacent positions. By combining the quantum boxes with the barriers, electrons are confined by a quantum within the quantum effects box structure, and an electron state having a miniband with finite width and gap with finite width is generated so that the electrons can move between quantum box structures by a tunnel effect. It is characterized in that the width of the miniband is smaller than the intrinsic energy of a phonon, that the gap between the miniband generated from the lower energy level and the miniband generated from the next lowest energy level is bigger than said intrinsic energy, and that most of the electrons are in the miniband state generated from the lowest energy level. This makes it possible to suppress the lattice vibration by confining the electrons within the quantum boxes while enabling electric conduction and to improve the dependency of electron mobility on temperature in the semiconductor.