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公开(公告)号:US11003388B2
公开(公告)日:2021-05-11
申请号:US16116533
申请日:2018-08-29
Applicant: Micron Technology, Inc.
Inventor: Robert Nasry Hasbun , Dean D. Gans , Sharookh Daruwalla
IPC: G06F3/06
Abstract: Methods, systems, and devices for prefetch signaling in a memory system or sub-system are described. A memory device (e.g., a local memory controller of memory device) of a main memory may transmit a prefetch indicator indicating a size of prefetch data associated with a first set of data requested by an interface controller. The size of the prefetch data may be equal to or different than the size of the first set of data. The main memory may, in some examples, store the size of prefetch data along with the first set of data. The memory device may transmit the prefetch indicator (e.g., an indicator signal) to the interface controller using a pin compatible with an industry standard or specification and/or a separate pin configured for transmitting command or control information. The memory device may transmit the prefetch indicator while the first set of data is being transmitted.
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公开(公告)号:US10963168B2
公开(公告)日:2021-03-30
申请号:US16248685
申请日:2019-01-15
Applicant: Micron Technology, Inc.
Inventor: Dean D. Gans
IPC: G06F3/06 , G06F12/0802
Abstract: Methods, systems, and devices related to a memory system or scheme that includes a first memory device configured for low-energy access operations and a second memory device configured for storing high-density information and operations of the same are described. The memory system may include an array configured for high-density information and may interface with a host via a controller and a cache or another array of a relatively fast memory type. The memory system may support signals communicated according to one or several modulation schemes, including a modulation scheme or schemes that employ two, three, or more voltage levels (e.g., NRZ, PAM4). The memory system may include, e.g., separate channels configured to communicate using different modulation schemes between a host and between memory arrays or memory types within the memory system.
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公开(公告)号:US10956333B2
公开(公告)日:2021-03-23
申请号:US16105545
申请日:2018-08-20
Applicant: Micron Technology, Inc.
Inventor: Robert Nasry Hasbun , Dean D. Gans , Sharookh Daruwalla
IPC: G06F12/0862 , G06F13/20
Abstract: Methods, systems, and devices are described for wireless communications. A request for data located in a memory page of a memory array may be received at a device, and a value of a prefetch counter associated with the memory page may be identified. A portion of the memory page that includes the requested data may then be communicated between a memory array and memory bank of the device based on the value of the prefetch counter. For instance, the portion of the memory page may be selected based on the value of the prefetch counter. A second portion of the memory page may be communicated to a buffer of the device, and the value of the prefetch counter may be modified based on a relationship between the first portion of the memory page and the second portion of the memory page.
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公开(公告)号:US10788985B2
公开(公告)日:2020-09-29
申请号:US16452424
申请日:2019-06-25
Applicant: MICRON TECHNOLOGY, INC.
Inventor: Dean D. Gans , Shunichi Saito
Abstract: Apparatuses and methods for configurable memory array bank architectures are described. An example apparatus includes a mode register configured to store information related to bank architecture and a memory array including a plurality of memory banks. The plurality of memory banks are configured to be arranged in a bank architecture based at least in part on the information related to bank architecture stored in the mode register.
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公开(公告)号:US10754578B2
公开(公告)日:2020-08-25
申请号:US15975607
申请日:2018-05-09
Applicant: Micron Technology, Inc.
Inventor: Robert Nasry Hasbun , Dean D. Gans , Sharookh Daruwalla
IPC: G06F3/06 , G06F13/16 , G06F12/1009 , G06F12/02
Abstract: Methods, systems, and devices for memory buffer management and bypass are described. Data corresponding to a page size of a memory array may be received at a virtual memory bank of a memory device, and a value of a counter associated with the virtual memory bank may be incremented. Upon determining that a value of the counter has reached a threshold value, the data may be communicated from the virtual memory bank to a buffer of the same memory device. For instance, the counter may be incremented based on the virtual memory bank receiving an access command from a host device.
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公开(公告)号:US10715127B2
公开(公告)日:2020-07-14
申请号:US16198493
申请日:2018-11-21
Applicant: MICRON TECHNOLOGY, INC.
Inventor: Dean D. Gans
Abstract: Embodiments of the disclosure are drawn to apparatuses and methods for lookahead duty cycle adjustment of a clock signal. Clock signals may be provided to a semiconductor device, such as a memory device, to synchronize one or more operations. A duty cycle adjuster (DCA) of the device may adjust the clock signal(s) based on a duty code determined during an initialization of the device. While the device is in operation, a lookahead DCA (LA DCA) may test a number of different adjustments to the clock signal(s), the results of which may be determined by a duty cycle monitor (DCM). The results of the DCM may be used to select one of the tested adjustments, which may be used to update the duty code.
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公开(公告)号:US20200066318A1
公开(公告)日:2020-02-27
申请号:US16666045
申请日:2019-10-28
Applicant: Micron Technology, Inc.
Inventor: Robert Nasry Hasbun , Timothy M. Hollis , Jeffrey P. Wright , Dean D. Gans
IPC: G11C8/12 , G06F12/02 , G11C11/4093 , G11C7/10 , G11C11/4096
Abstract: Methods, systems, and devices that supports dual-mode modulation in the context of memory access are described. A system may include a memory array coupled with a buffer, and a multiplexer may be coupled with the buffer, where the multiplexer may be configured to output a bit pair representative of data stored within the memory array. The multiplexer may also be coupled with a driver, where the driver may be configured to generate a symbol representative of the bit pair that is output by the multiplexer.
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公开(公告)号:US20190103148A1
公开(公告)日:2019-04-04
申请号:US15977813
申请日:2018-05-11
Applicant: Micron Technology, Inc.
Inventor: Robert Nasry Hasbun , Timothy M. Hollis , Jeffrey P. Wright , Dean D. Gans
CPC classification number: H04L27/04 , G06F12/0284 , G06F13/16 , G06F13/38 , G11C5/066 , G11C7/10 , G11C7/1051 , G11C7/1066 , G11C7/1078 , G11C7/1093 , G11C7/222 , G11C8/12 , G11C2207/101 , H04L25/49 , H04L27/02 , H04L27/06
Abstract: Methods, systems, and devices for multiplexing distinct signals on a single pin of a memory device are described. Techniques are described herein to multiplex data using a modulation scheme having at least three levels. The modulated data may be communicated to multiple memory dies over a shared bus. Each of the dies may include a same or different type of memory cell and, in some examples, a multi-level signaling scheme may be pulse amplitude modulation (PAM). Each unique symbol of the modulated signal may be configured to represent a plurality of bits of data.
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公开(公告)号:US20190103143A1
公开(公告)日:2019-04-04
申请号:US15977815
申请日:2018-05-11
Applicant: Micron Technology, Inc.
Inventor: Robert Nasry Hasbun , Timothy M. Hollis , Jeffrey P. Wright , Dean D. Gans
CPC classification number: G11C7/1048 , G06F1/3234 , G06F13/42 , G11C7/1051 , G11C7/1078 , G11C11/221 , G11C11/2253 , G11C11/2273 , G11C11/4093
Abstract: Methods, systems, and devices for multiple concurrent modulation schemes in a memory system are described. Techniques are provided herein to communicate data using a modulation scheme having at least three levels and using a modulation scheme having at least two levels within a common system or memory device. Such communication with multiple modulation schemes may be concurrent. The modulated data may be communicated to a memory die through distinct signal paths that may correspond to a particular modulation scheme. An example of a modulation scheme having at least three levels may be pulse amplitude modulation (PAM) and an example of a modulation scheme having at least two levels may be non-return-to-zero (NRZ).
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公开(公告)号:US20190065105A1
公开(公告)日:2019-02-28
申请号:US15684773
申请日:2017-08-23
Applicant: Micron Technology, Inc.
Inventor: Dean D. Gans
IPC: G06F3/06 , G06F12/1009
Abstract: Methods, systems, and devices for memory with a virtual page size are described. Memory cells may be accessed in portions or page sizes that are tailored to a particular use or application. A variable page size may be defined that represents a subset or superset of memory cells in a nominal page size for the array. For example, memory cells associated with a page size of a memory array may be accessed with commands to a memory array. Each command may contain a particular addressing scheme based on the page size of the memory array and may activate one or more sets of memory cells within the array. The addressing scheme may be modified based on the page size of the memory array. Upon activating a desired set of memory cells, one or more individual activated cells may be accessed.
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