公开(公告)号：US06786704B2

公开(公告)日：2004-09-07

申请号：US10283217

申请日：2002-10-30

Applicant: Hirokazu Kamiya ,  Shigeru Kamiya ,  Masafumi Inoue ,  Takashi Inoue ,  Mikio Matsuda

Inventor： Hirokazu Kamiya ,  Shigeru Kamiya ,  Masafumi Inoue ,  Takashi Inoue ,  Mikio Matsuda

IPC: F04B126

CPC classification number: F04B27/0882 ,  F04B27/0878 ,  F04B27/1054 ,  F04B27/1063 ,  F04B27/1072

Abstract: A piston type compressor having a drive plate (swash plate), wherein sliding friction between the drive plate and shoes is reduced and the compressor is made smaller by slidably attaching the shoes engaged with spherical ends of pistons to a shoe holding plate formed with guide grooves in the radial direction and supporting the shoe holding plate by the drive plate through a thrust bearing. The drive plate is connected to an arm of the shaft side through a double slide link mechanism to enable it to be supported by only a front end of the front housing.

Abstract translation: 一种具有驱动板（斜盘）的活塞式压缩机，其中驱动板和滑块之间的滑动摩擦力减小，并且通过将与活塞的球形端接合的鞋可滑动地附接到形成有导向槽的鞋保持板而使压缩机变小 在径向方向上，并通过驱动板通过止推轴承来支撑鞋保持板。 驱动板通过双滑动连杆机构连接到轴侧的臂上，使其能够仅由前壳体的前端支撑。

公开(公告)号：US06729532B2

公开(公告)日：2004-05-04

申请号：US10037125

申请日：2001-10-25

Applicant: Masafumi Inoue ,  Yusuke Yamamoto ,  Hikaru Onizaki ,  Yoichi Yanai ,  Yasuhiro Morimitsu

Inventor： Masafumi Inoue ,  Yusuke Yamamoto ,  Hikaru Onizaki ,  Yoichi Yanai ,  Yasuhiro Morimitsu

IPC: B23K3512

CPC classification number: H05K3/3442 ,  H05K3/3484 ,  H05K2201/10522 ,  H05K2201/10636 ,  H05K2203/048 ,  H05K2203/0545 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49169 ,  Y10T29/49179

Abstract: A component mounting method for mounting several micro component chips aligned in parallel onto a board by soldering. An allowable offset is set for each electrode, taking into account a self-alignment effect of melted solder in soldering for bonding component terminals onto electrodes formed on the board corresponding to a component layout. Solder printing and component placement onto the electrodes are shifted by the offset. This offset is balanced by the self-alignment effect of melted solder, and each component is secured at an appropriate position. This mounting method allows less stringent spacing conditions to be applied for mounting and prevents the occurrence of defects during printing and placement.

Abstract translation: 一种用于通过焊接将几个微型组件芯片并联平行地安装到板上的部件安装方法。 考虑到焊接中熔化的焊料的自对准效应，将组件端子接合到对应于部件布局的板上形成的电极上，为每个电极设置允许的偏移。 焊接印刷和部件放置在电极上移位偏移。 该偏移由熔融焊料的自对准效应平衡，并且每个部件固定在适当的位置。 该安装方法允许不太严格的间隔条件用于安装，并防止在打印和放置期间出现缺陷。

公开(公告)号：US06610818B2

公开(公告)日：2003-08-26

申请号：US10034089

申请日：2001-12-28

Applicant: Yasuhiro Yamamoto ,  Shuji Shimizu ,  Masafumi Inoue ,  Hideki Oishi

Inventor： Yasuhiro Yamamoto ,  Shuji Shimizu ,  Masafumi Inoue ,  Hideki Oishi

IPC: C08J510

CPC classification number: C08J3/16 ,  C08G12/30 ,  C08G12/32 ,  C08J3/26 ,  C08J2361/20

Abstract: A process for producing amino resin particles includes: a reaction process for obtaining a reaction solution containing an amino resin precursor which is obtained by a reaction of an amino compound with formaldehyde, and having a viscosity in a range of from 2×10−2 Pa·s to 5.8×10−2 Pa·s at a temperature in a range of from 95° C. to 98° C.; an emulsion process for obtaining an emulsion by emulsifying the reaction solution; and a curing process for curing the amino resin precursor in the emulsion state by adding a catalyst to the emulsion. With this producing process, it is possible to readily produce amino resin particles with an essentially uniform particle size (narrow particle size distribution). Further, with use of an aqueous dispersion of an inorganic pigment which is obtained by wet pulverizing the inorganic pigment in an aqueous medium until the average particle size of the inorganic pigment measured by a light scattering method becomes not more than 300 nm, it is possible to obtain amino resin particles with superior properties in coloring strength, visibility, heat resistance, solvent resistance, and chemicals resistance.

公开(公告)号：US5226437A

公开(公告)日：1993-07-13

申请号：US795762

申请日：1991-11-21

Applicant: Yuji Kamikawa ,  Masafumi Inoue ,  Mitsuo Nishi

Inventor： Yuji Kamikawa ,  Masafumi Inoue ,  Mitsuo Nishi

IPC: H01L21/00 ,  H01L21/677

CPC classification number: H01L21/67017 ,  H01L21/67051 ,  H01L21/67766 ,  H01L21/67781 ,  Y10S134/902

Abstract: A washing apparatus for performing a batch treatment of a plurality of wafers has a vessel and a wafer boat dedicated to the vessel and movable in the vertical direction. The boat has a fork, which supports the wafers in the vessel in a manner such that the wafers are spaced from one another at predetermined intervals. The wafers are received in a carrier, and are transferred to the boat by a rotary transfer arm. This arm has a fork for supporting the wafers during transfer thereof in a manner such that the wafers are spaced from one another at the predetermined intervals. Transfer of the rotary transfer arm is performed above the washing vessel by moving the boat up and down. At this time, the forks of the boat and arm engage with each other.

Abstract translation: 用于执行多个晶片的批量处理的洗涤装置具有专用于容器并可在垂直方向上移动的容器和晶片舟。 该船具有叉子，该叉子以使得晶片以预定间隔彼此间隔的方式支撑在容器中的晶片。 晶片被接收在载体中，并通过旋转传递臂传送到船上。 该臂具有用于在其转移期间支撑晶片的叉，使得晶片以预定间隔彼此间隔开。 通过上下移动舟皿，在洗涤容器上方进行旋转传送臂的传送。 在这时候，船和手臂的叉子相互啮合。