Semiconductor member, manufacturing method thereof, and semiconductor device
    72.
    发明授权
    Semiconductor member, manufacturing method thereof, and semiconductor device 失效
    半导体元件及其制造方法以及半导体器件

    公开(公告)号:US07750367B2

    公开(公告)日:2010-07-06

    申请号:US11711711

    申请日:2007-02-28

    IPC分类号: H01L29/165 H01L29/786

    摘要: An SiGe layer is grown on a silicon substrate. The SiGe layer or the silicon substrate and SiGe layer are porosified by anodizing the SiGe layer to form a strain inducing porous layer or a porous silicon layer and strain inducing porous layer. An SiGe layer and strained silicon layer are formed on the resultant structure. The SiGe layer in the stacking growth step only needs to be on the uppermost surface of the porous layer. For this reason, an SiGe layer with a low defect density and high concentration can be formed. Since the SiGe layer on the strain inducing porous layer can achieve a low defect density without lattice mismatching. Hence, a high-quality semiconductor substrate having a high strained silicon layer can be obtained.

    摘要翻译: SiGe层生长在硅衬底上。 通过阳极氧化SiGe层来形成SiGe层或硅衬底和SiGe层以形成应变诱导多孔层或多孔硅层和应变诱导多孔层。 在所得结构上形成SiGe层和应变硅层。 层叠生长步骤中的SiGe层仅需要在多孔层的最上表面上。 因此,可以形成具有低缺陷密度和高浓度的SiGe层。 由于应变诱导多孔层上的SiGe层可以实现低缺陷密度而没有晶格失配。 因此,可以获得具有高应变硅层的高质量半导体衬底。

    Semiconductor substrate and manufacturing method for the same
    73.
    发明授权
    Semiconductor substrate and manufacturing method for the same 失效
    半导体衬底及其制造方法相同

    公开(公告)号:US07642179B2

    公开(公告)日:2010-01-05

    申请号:US11199597

    申请日:2005-08-08

    IPC分类号: H01L21/20

    摘要: A method of manufacturing a semiconductor substrate includes a growing step of growing a second single crystalline semiconductor on a first single crystalline semiconductor, a blocking layer forming step of forming a blocking layer on the second single crystalline semiconductor, and a relaxing step of generating crystal defects at a portion deeper than the blocking layer to relax a stress acting on the second single crystalline semiconductor. The blocking layer includes, e.g., a porous layer, and prevents the crystal defects at the portion deeper than the blocking layer from propagating to the surface of the second single crystalline semiconductor.

    摘要翻译: 一种制造半导体衬底的方法包括在第一单晶半导体上生长第二单晶半导体的生长步骤,在第二单晶半导体上形成阻挡层的阻挡层形成步骤以及产生晶体缺陷的松弛步骤 在比阻挡层更深的部分放松作用在第二单晶半导体上的应力。 阻挡层包括例如多孔层,并且防止在比阻挡层更深的部分处的晶体缺陷传播到第二单晶半导体的表面。

    MASK PATTERN DATA GENERATING METHOD, INFORMATION PROCESSING APPARATUS, PHOTOMASK FABRICATION SYSTEM, AND IMAGE SENSING APPARATUS
    74.
    发明申请
    MASK PATTERN DATA GENERATING METHOD, INFORMATION PROCESSING APPARATUS, PHOTOMASK FABRICATION SYSTEM, AND IMAGE SENSING APPARATUS 有权
    掩模图形数据生成方法,信息处理装置,光电装置制造系统和图像感测装置

    公开(公告)号:US20080263502A1

    公开(公告)日:2008-10-23

    申请号:US12048691

    申请日:2008-03-14

    IPC分类号: G06F17/50

    摘要: A method for generating mask pattern data of a photomask used to form microlenses divides a pattern formation surface of a mask pattern to be used for the photomask into a plurality of grid cells, acquires data which represents transmitted light distribution of the mask pattern to be used for the photomask, determines whether to place a shield on each of the plurality of grid cells by binarizing the plurality of grid cells in order of increasing or decreasing distance from a center of the pattern formation surface using an error diffusion method to acquire the transmitted light distribution, and generates mask pattern data which represents an arrangement of the shields based on results from the determining step.

    摘要翻译: 用于生成用于形成微透镜的光掩模的掩模图案数据的方法将用于光掩模的掩模图案的图案形成表面划分成多个网格单元,获取表示要使用的掩模图案的透射光分布的数据 对于光掩模,通过使用误差扩散方法使用误差扩散方法来依次增加或减小距离图案形成表面的中心的距离来二进制化多个网格单元,来确定是否将多个网格单元中的每一个放置屏蔽,以获取透射光 分配,并且基于来自确定步骤的结果生成表示屏蔽的布置的掩模图案数据。

    Semiconductor member, manufacturing method thereof, and semiconductor device
    75.
    发明申请
    Semiconductor member, manufacturing method thereof, and semiconductor device 失效
    半导体元件及其制造方法以及半导体器件

    公开(公告)号:US20070272944A1

    公开(公告)日:2007-11-29

    申请号:US11711711

    申请日:2007-02-28

    IPC分类号: H01L31/00

    摘要: An SiGe layer is grown on a silicon substrate. The SiGe layer or the silicon substrate and SiGe layer are porosified by anodizing the SiGe layer to form a strain inducing porous layer or a porous silicon layer and strain inducing porous layer. An SiGe layer and strained silicon layer are formed on the resultant structure. The SiGe layer in the stacking growth step only needs to be on the uppermost surface of the porous layer. For this reason, an SiGe layer with a low defect density and high concentration can be formed. Since the SiGe layer on the strain inducing porous layer can achieve a low defect density without lattice mismatching. Hence, a high-quality semiconductor substrate having a high strained silicon layer can be obtained.

    摘要翻译: SiGe层生长在硅衬底上。 通过阳极氧化SiGe层来形成SiGe层或硅衬底和SiGe层以形成应变诱导多孔层或多孔硅层和应变诱导多孔层。 在所得结构上形成SiGe层和应变硅层。 层叠生长步骤中的SiGe层仅需要在多孔层的最上表面上。 因此,可以形成具有低缺陷密度和高浓度的SiGe层。 由于应变诱导多孔层上的SiGe层可以实现低缺陷密度而没有晶格失配。 因此,可以获得具有高应变硅层的高质量半导体衬底。

    Semiconductor member manufacturing method and semiconductor device manufacturing method
    77.
    发明授权
    Semiconductor member manufacturing method and semiconductor device manufacturing method 失效
    半导体元件制造方法及半导体器件的制造方法

    公开(公告)号:US07008701B2

    公开(公告)日:2006-03-07

    申请号:US10883792

    申请日:2004-07-06

    IPC分类号: B32B9/04

    摘要: This invention provides an SOI substrate manufacturing method using a transfer method (bonding and separation). A separation layer (12) is formed on a silicon substrate (11). A silicon layer (13), SiGe layer (14), silicon layer (15′), and insulating layer (21) are sequentially formed on the resultant structure to prepare a first substrate (10′). This first substrate (10′) is bonded to a second substrate (30). The bonded substrate stack is separated into two parts at the separation layer (12). Next, Ge in the SiGe layer (14) is diffused into the silicon layer (13) by hydrogen annealing. With this process, a strained SOI substrate having the SiGe layer on the insulating layer (21) and a strained silicon layer on the SiGe layer is obtained.

    摘要翻译: 本发明提供一种使用转印方法(接合和分离)的SOI衬底制造方法。 在硅衬底(11)上形成分离层(12)。 在所得结构上依次形成硅层(13),SiGe层(14),硅层(15')和绝缘层(21),以制备第一衬底(10')。 该第一基板(10')结合到第二基板(30)上。 键合衬底叠层在分离层(12)处分成两部分。 接下来,SiGe层(14)中的Ge通过氢退火扩散到硅层(13)中。 通过该工艺,可以获得在绝缘层(21)上具有SiGe层的应变SOI衬底和SiGe层上的应变硅层。

    Semiconductor substrate and manufacturing method for the same
    78.
    发明申请
    Semiconductor substrate and manufacturing method for the same 失效
    半导体衬底及其制造方法相同

    公开(公告)号:US20060035447A1

    公开(公告)日:2006-02-16

    申请号:US11199597

    申请日:2005-08-08

    IPC分类号: H01L21/20 G12B21/02

    摘要: A method of manufacturing a semiconductor substrate includes a growing step of growing a second single crystalline semiconductor on a first single crystalline semiconductor, a blocking layer forming step of forming a blocking layer on the second single crystalline semiconductor, and a relaxing step of generating crystal defects at a portion deeper than the blocking layer to relax a stress acting on the second single crystalline semiconductor. The blocking layer includes, e.g., a porous layer, and prevents the crystal defects at the portion deeper than the blocking layer from propagating to the surface of the second single crystalline semiconductor.

    摘要翻译: 一种制造半导体衬底的方法包括在第一单晶半导体上生长第二单晶半导体的生长步骤,在第二单晶半导体上形成阻挡层的阻挡层形成步骤以及产生晶体缺陷的松弛步骤 在比阻挡层更深的部分放松作用在第二单晶半导体上的应力。 阻挡层包括例如多孔层,并且防止在比阻挡层更深的部分处的晶体缺陷传播到第二单晶半导体的表面。

    Shaver
    79.
    发明授权
    Shaver 失效
    剃须刀

    公开(公告)号:US06769179B2

    公开(公告)日:2004-08-03

    申请号:US09888190

    申请日:2001-06-22

    IPC分类号: B26B1914

    摘要: The present invention relates to the shaver capable of cutting deeply, provided with the outer blade having a plurality of the hair-guiding ports and the inner blade being adjacently located to the inner part of the outer blade and relatively moving against the said inner part, serving like an electric shaver of rotation or motion, which consists in going back and forth adjacently, wherein there is provided an escaping gap for taking hairs out in one part between the outer and inner blades, thus hooking the hairs guided into the gap, on the tip of the inner blade or pinching them inside the escaping gap and afterward, taking out the hairs and beards from the root of hairs and when the hairs move to the region without any escaping gap, they will be cut in the deep location.

    摘要翻译: 本发明涉及能够深切切割的剃须刀,其具有设置有多个头发引导口的外刀片,内刀片相邻地位于外刀片的内部并相对于所述内部部件移动, 像旋转或运动的电动剃须刀一样,其前后相邻地设置有一个逸出的间隙,用于在外刀片和内刀片之间的一部分中将毛发出去,从而将头发引导到间隙中 内刀片的尖端或者将它们夹在逸出的间隙内,然后从头发根部取出毛发和胡须,当毛发移动到该区域而没有任何逸出的间隙时,它们将被切割在深处。

    Output apparatus and output environment setting method in output apparatus
    80.
    发明授权
    Output apparatus and output environment setting method in output apparatus 失效
    输出设备输出设备及输出环境设定方法

    公开(公告)号:US06633397B2

    公开(公告)日:2003-10-14

    申请号:US08508696

    申请日:1995-07-28

    IPC分类号: G06K1500

    摘要: An output apparatus for forming output information on the basis of input information inputted from an external apparatus and outputting is constructed by a connector for connecting the output apparatus to the external apparatus so that they can communicate, a memory to store a data group to manage a menu structure for setting an output environment, an internal environment setting unit for setting an output environment on the basis of the data group, a transfer unit for transferring the data group from the memory to the external apparatus through the connector, and an external environment setting unit for setting an output environment onto the external apparatus on the basis of the data group transferred to the external apparatus. An operating method for the internal environment setting unit and an operating method for the external environment setting unit are identical.

    摘要翻译: 一种用于根据从外部设备输入的输入信息形成输出信息并输出的输出设备由用于将输出设备连接到外部设备的连接器构成,以便它们可以通信,存储器以存储数据组以管理 用于设置输出环境的菜单结构,用于基于数据组设置输出环境的内部环境设置单元,用于通过连接器将数据组从存储器传送到外部设备的传送单元和外部环境设置 单元,用于基于传送到外部设备的数据组将输出环境设置到外部设备上。 用于内部环境设置单元的操作方法和用于外部环境设置单元的操作方法相同。