公开(公告)号：US07637029B2

公开(公告)日：2009-12-29

申请号：US11472415

申请日：2006-06-22

申请人： Yuji Kamikawa ,  Kazuhiko Kobayashi ,  Nobutaka Kuroda ,  Mikio Nakashima ,  Osamu Tsuda

发明人： Yuji Kamikawa ,  Kazuhiko Kobayashi ,  Nobutaka Kuroda ,  Mikio Nakashima ,  Osamu Tsuda

IPC分类号： F26B19/00

CPC分类号： H01L21/67051 ,  H01L21/67023 ,  H01L21/67028 ,  H01L21/67034 ,  Y10S134/902

摘要： A vapor drying apparatus comprises a processing chamber 1a adapted to contain semiconductor wafers W; a supply nozzle 2 adapted to supply IPA vapor or N2 gas into the processing chamber 1a; a two-fluid nozzle 3 connected to both of an IPA supply source 8 and an N2 gas supply source 5 and adapted to produce a mixed fluid of IPA and N2 gas; a vapor generating apparatus 10 adapted to produce IPA vapor by heating the mixed fluid produced by the two-fluid nozzle 3; an N2 gas supply line 23 connected to the upstream side of the two-fluid nozzle 3; and a mixed fluid supply line 22 connected to the downstream side of the two-fluid nozzle 3. An open-and-close valve V2 is provided on a branch line 25 connecting the N2 gas supply line 23 and the mixed fluid supply line 22. First, N2 gas is supplied to the two-fluid nozzle 3 while IPA from the IPA supply source 8 is supplied to the two-fluid nozzle 3 so as to produce the mixed fluid, followed by supplying it to the processing chamber 1a so as to perform a first drying step. Subsequently, N2 gas from the N2 gas supply source 5 is supplied to the processing chamber 1a through the two-fluid nozzle 3 and the branch line 25 so as to perform a second drying step.

摘要翻译： 蒸气干燥装置包括适于容纳半导体晶片W的处理室1a; 供应喷嘴2，其适于将IPA蒸汽或N 2气体供应到处理室1a中; 连接到IPA供应源8和N 2气体供应源5两者并且适于产生IPA和N 2气体的混合流体的双流体喷嘴3; 蒸汽发生装置10，适于通过加热由双流体喷嘴3产生的混合流体产生IPA蒸气; 连接到双流体喷嘴3的上游侧的N 2气体供给管线23; 以及连接到双流体喷嘴3的下游侧的混合流体供给管线22.开关阀V2设置在连接N2气体供给管线23和混合流体供给管线22的分支管线25上。 首先，向双流体喷嘴3供给N2气体，同时将来自IPA供给源8的IPA供给至双流体喷嘴3，生成混合流体，然后将其供给到处理室1a， 执行第一干燥步骤。 接着，将来自N2气体供给源5的N2气通过双流体喷嘴3和分支管线25供给到处理室1a，进行第二干燥工序。

公开(公告)号：US20090265039A1

公开(公告)日：2009-10-22

申请号：US12418305

申请日：2009-04-03

申请人： Yuji Kamikawa

发明人： Yuji Kamikawa

IPC分类号： G05D7/06

CPC分类号： G05D7/0635 ,  H01L21/67253

摘要： A substrate processing apparatus capable of reducing a consumed amount of a processing liquid is provided. The substrate processing apparatus includes a plurality of processing units 22-1 to 22-6 to perform liquid processing on a substrate by using a processing liquid, a processing liquid supply pipe 210 to supply the processing liquid in common to the plurality of processing units 22-1 to 22-6, and a flow control part 220 to control a flow rate of the processing liquid within the processing liquid supply pipe 210 to be increased or decreased according to a number of operating processing units from among the plurality of processing units 22-1 to 22-6.

摘要翻译： 提供了能够减少处理液的消耗量的基板处理装置。 基板处理装置包括多个处理单元22-1至22-6，以通过使用处理液体在基板上进行液体处理;处理液供给管210，用于向多个处理单元22提供处理液体 -1〜22-6，以及流量控制部220，用于根据多个处理单元22中的操作处理单元的数量来控制处理液供给管210内的处理液的流量的增减 -1〜22-6。

公开(公告)号：US20090056764A1

公开(公告)日：2009-03-05

申请号：US12222871

申请日：2008-08-18

申请人： Teruomi Minami ,  Norihiro Ito ,  Yuji Kamikawa

发明人： Teruomi Minami ,  Norihiro Ito ,  Yuji Kamikawa

IPC分类号： B08B3/08 ,  B08B3/02

CPC分类号： H01L21/67051 ,  H01L21/67028 ,  H01L21/67034

摘要： A liquid processing apparatus 1 comprises a casing 5, a substrate holding mechanism 20 that holds a wafer (substrate to be processed) W, a process-liquid supplying mechanism 30 that supplies a process liquid, a draining cup 12 that receives a process liquid, and a draining pipe 13 that discharges a process liquid outside. The process-liquid supplying mechanism 30 includes a first chemical-liquid supply mechanism that supplies a hydrofluoric process liquid, and a drying-liquid supplying mechanism that supplies an organic solvent for drying a wafer W. A control part 50 causes the first chemical-liquid supplying mechanism to supply a hydrofluoric process liquid, and then causes the drying-liquid supplying mechanism to supply an organic solvent. In addition, before the control part 50 causes the drying-liquid supplying mechanism to supply an organic solvent, the control part causes a cleaning mechanism 10 to remove an alkaline component in a casing 5.

摘要翻译： 液体处理装置1包括壳体5，保持晶片（待处理基板）W的基板保持机构20，供给处理液的处理液供给机构30，接收处理液的排出杯12， 以及将处理液体排出到外部的排水管13。 处理液供给机构30包括供给氢氟化处理液的第一药液供给机构和供给干燥晶片W的有机溶剂的干燥液供给机构。控制部50使第一药液 供给机构供给氢氟化处理液，然后使干燥液供给机构供给有机溶剂。 此外，在控制部50使干燥液供给机构供给有机溶剂之前，控制部使清洁机构10除去壳体5内的碱性成分。

公开(公告)号：US20090010748A1

公开(公告)日：2009-01-08

申请号：US11585337

申请日：2006-10-24

申请人： Yuji Kamikawa ,  Koji Egashira

发明人： Yuji Kamikawa ,  Koji Egashira

IPC分类号： B65G59/00

CPC分类号： H01L21/67739 ,  H01L21/67718 ,  H01L21/67763 ,  H01L21/67778 ,  H01L21/67781 ,  Y10S414/138

摘要： A batch forming apparatus forms a batch of substrates by combining a plurality of substrates that have been taken out from a plurality of carriers each containing therein the substrates in a stacked manner. The batch forming apparatus includes: a substrate transfer mechanism that takes out the substrates from each carrier and transfer the substrates; a substrate relative positional relationship changing mechanism that rearranges one or more substrates out of the substrates transferred by the substrate transfer mechanism one by one relative to other substrates to change positional relationships of the substrates relative to each other; and a batch forming mechanism that forms a batch of substrates out of the substrates that have been transferred thereto by the substrate transfer mechanism, with positional relationships of the substrates having been changed relative to each other by the substrate relative positional relationship changing mechanism. A substrate processing system includes such a batch forming apparatus, and a substrate processing apparatus that process the batch of substrates formed by the batch forming apparatus.

摘要翻译： 批量形成装置通过组合从多个载体中取出的多个基板形成一批基板，每个载体以堆叠的方式包含在其中的基板。 批量形成装置包括：基板转印机构，其从每个载体取出基板并转印基板; 基板相对位置关系改变机构，用于相对于其它基板逐一地将由基板传送机构转印的基板中的一个或多个基板重新布置，以改变基板相对于彼此的位置关系; 以及批量形成机构，其通过基板传送机构在已经被转印到基板之外形成一批基板，基板的位置关系通过基板相对位置关系改变机构而相对于彼此改变。 一种基板处理系统包括这样的分批成型装置，以及处理由批量形成装置形成的一批基板的基板处理装置。

公开(公告)号：US07404409B2

公开(公告)日：2008-07-29

申请号：US10901405

申请日：2004-07-29

申请人： Yuji Kamikawa

发明人： Yuji Kamikawa

IPC分类号： B08B3/00

CPC分类号： H01L21/67778 ,  H01L21/67766 ,  H01L21/67781

摘要： A substrate processing system includes a substrate transfer unit having a plural-wafer conveyer that transfers plural wafers collectively and a single wafer conveyer that transfers a single wafer at a time. The single-wafer conveyer is accessible to the plural-wafer conveyer to deliver and remove a wafer to and from the plural-wafer conveyer.

摘要翻译： 基板处理系统包括具有多个晶片传送器的基板传送单元，该多个晶片传送器一体地传送多个晶片，以及一次传送单个晶片的单个晶片传送器。 单晶片输送机可接触多晶圆输送机，以将晶片输送到多晶圆输送机和从多晶圆输送机移出晶片。

公开(公告)号：US07337792B2

公开(公告)日：2008-03-04

申请号：US10377492

申请日：2003-02-28

申请人： Yuji Kamikawa ,  Shori Mukuo

发明人： Yuji Kamikawa ,  Shori Mukuo

IPC分类号： B08B3/02

CPC分类号： H01L21/67781 ,  Y10S134/902

摘要： A cleaning apparatus 1 includes a foup loading/unloading part 2 for mounting foups F each accommodating a plurality of wafers W at intervals of a constant pitch (normal pitch), a rotor 34 capable of holding the wafers W at half the normal pitch (half pitch), a wafer transporting device 11 for transporting the wafer E between the foup F and the rotor 34, wafer posture changing devices 20a, 20b, a wafer elevating mechanism 40, a motor 31 for rotating the rotor 34, an outer chamber 71a and an inner chamber 71b both accommodating the rotor 34, and cleaning liquid nozzles 53, 55 for supplying a cleaning liquid to the wafers W. The rotor 34 holds the wafers W at intervals of an optional pitch (every one holding pitch or every plural holding pitches) to carry out a cleaning operation. Consequently, it is possible to process substrates accommodated in two containers at one batch processing.

摘要翻译： 清洁装置1包括用于安装用于以恒定节距（正常间距）的间隔容纳多个晶片W的支架F的成型装载/卸载部分2，能够将晶片W保持在正常节距的一半（一半） 用于在晶圆F和转子34之间输送晶片E的晶片传送装置11，晶片姿势改变装置20a，20b，晶片升降机构40，用于使转子34旋转的电动机31，外部腔 71a和内部容纳转子34的内部室71b，以及用于向晶片W供给清洗液的清洗液体喷嘴53,55。转子34以可选的间距（每个保持间距或每个保持间距）的间隔保持晶片W 每个多个保持间距）进行清洁操作。 因此，可以在一次批处理中处理容纳在两个容器中的基板。

公开(公告)号：US20070267040A1

公开(公告)日：2007-11-22

申请号：US11798599

申请日：2007-05-15

申请人： Tsukasa Watanabe ,  Naoki Shindo ,  Koukichi Hiroshiro ,  Yuji Kamikawa

发明人： Tsukasa Watanabe ,  Naoki Shindo ,  Koukichi Hiroshiro ,  Yuji Kamikawa

IPC分类号： B08B3/12

CPC分类号： H01L21/67057 ,  H01L21/67051

摘要： A substrate cleaning method can uniformly removing particles from substrates at a high removing efficiency. The substrate cleaning method includes the steps of immersing substrates W in a cleaning liquid in a cleaning tank 12, and generating ultrasonic waves in the cleaning liquid contained in the cleaning tank. A region in the cleaning tank toward which the cleaning liquid is supplied is varied with respect to a vertical level in the step of generating ultrasonic waves in the cleaning liquid while the cleaning liquid is being supplied into the cleaning tank.

摘要翻译： 基板清洗方法可以以高的去除效率从基板中均匀地除去颗粒。 基板清洗方法包括将清洗液中的基板W浸渍在清洗槽12中的步骤，在清洗槽内所含的清洗液中产生超声波。 在将清洗液供给到清洗槽中时，在清洗槽中供给清洗液的区域相对于在清洗液中产生超声波的步骤中的垂直高度变化。

公开(公告)号：US07284560B2

公开(公告)日：2007-10-23

申请号：US10851335

申请日：2004-05-24

申请人： Yuji Kamikawa

发明人： Yuji Kamikawa

IPC分类号： B08B3/00

CPC分类号： H01L21/67781 ,  H01L21/67051 ,  H01L21/67248 ,  H01L21/67303 ,  H01L21/67313 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67751 ,  H01L21/67754 ,  H01L21/67757 ,  Y10S134/902

摘要： A liquid processing apparatus has a substrate rotating device including a holder for holding a substrate and a motor, a chamber for applying the liquid processing to the substrate, a posture changing mechanism for changing the posture of the substrate rotating device at outside of the chamber such that a state of the substrate held by the holder changes between vertical and horizontal, and a position adjusting mechanism for relatively adjusting the positions of the chamber and the substrate rotating device together with the posture changing mechanism such that the holder is housed in the chamber. The substrate is taken out from the container and held by the holder in a horizontal state. After the posture of the holder was changed to vertical, a process liquid is supplied to the substrate of vertical state.

摘要翻译： 液体处理装置具有基板旋转装置，该基板旋转装置包括用于保持基板的保持器和马达，用于向基板施加液体处理的腔室，用于改变在室外的基板旋转装置的姿势的姿势改变机构， 由保持器保持的基板的状态在垂直和水平之间变化;以及位置调整机构，用于相应地调节室和基板旋转装置的位置以及姿势改变机构，使得保持器容纳在室中。 将基板从容器中取出并保持在水平状态。 在保持器的姿势变为垂直状态之后，将处理液体供给垂直状态的基板。

公开(公告)号：US06743297B2

公开(公告)日：2004-06-01

申请号：US10151092

申请日：2002-05-21

申请人： Koji Egashira ,  Sadayuki Fujishima ,  Yuji Kamikawa

发明人： Koji Egashira ,  Sadayuki Fujishima ,  Yuji Kamikawa

IPC分类号： B08B300

CPC分类号： H01L21/67303 ,  H01L21/67313 ,  H01L21/68707

摘要： A rotary substrate processing apparatus includes a rotor 1 having a holding member for holding a plurality of semiconductor wafers W arranged at appropriate intervals and a motor 4 for rotating the rotor 1. The holding member includes open/close holding rods 3 that are moved to open or close the rotor 1 in inserting the wafers W into the rotor 1 sideways and a plurality of constant-position holding rods 2a to 2d for holding the wafers W in cooperation with the open/close holding rods 3. Among the constant-position holding rods 2a to 2d, at least one constant-position holding rod 2a is equipped with a plurality of press members 5 which move toward respective peripheral portions of the wafers W by centrifugal force due to the rotation of the rotor 1. Consequently, it becomes possible to make the wafers W follow the rotation of the rotor 1 ensurely and also possible to reduce slip between the open/close holding rods 3, the constant-position holding rods 2a to 2d and the wafers W. Therefore, it is possible to accomplish both improvement in processing efficiency for the substrates and reduction in abrasion amount of the holding member and also possible to increase a life span of the apparatus.

摘要翻译： 旋转基板处理装置包括转子1，转子1具有用于保持以适当间隔布置的多个半导体晶片W的保持部件和用于使转子1旋转的马达4.保持部件具有开闭的保持棒3， 或关闭转子1，将晶片W侧向插入转子1，以及多个恒定位置保持杆2a至2d，用于与打开/关闭保持杆3配合保持晶片W.在恒定位置保持杆 如图2a至2d所示，至少一个恒定位置保持杆2a配备有多个按照转子1的旋转通过离心力朝向晶片W的周边部分移动的按压部件5。因此， 使得晶片W确保地跟随转子1的旋转，并且还可以减小打开/关闭保持杆3，恒定位置保持杆2a至2d和晶片W之间的滑动。因此 e，可以实现基板的加工效率的提高和保持部件的磨损量的降低，并且还可以延长设备的使用寿命。

公开(公告)号：US06698439B2

公开(公告)日：2004-03-02

申请号：US09912412

申请日：2001-07-02

申请人： Yuji Kamikawa ,  Koji Egashira

发明人： Yuji Kamikawa ,  Koji Egashira

IPC分类号： B08B302

CPC分类号： H01L21/67028 ,  Y10S134/902 ,  Y10T29/41

摘要： A processing apparatus includes an inner cylinder 25 (a processing chamber 23) accommodated in a carrying unit for carrying an object to be processed and further seals up the object with the inner cylinder 25 or a first stationary wall 34 to process the object in contact with processing fluid. In this processing apparatus with sealing mechanism, flexible hollow packings 100, 101 are arranged doubly in either the inner cylinder 25 or the first stationary wall 34, at its occluded part with the first stationary wall 34 and the inner cylinder 25. The hollow packings 100, 101 have their hollow parts 102 connected with respective pressurized-air sources 103 through pressure-detecting switches 110 and closing valves 105. By expanding or contracting the hollow packings 100, 101, the operation of the apparatus is switched in between its sealing state and non-sealing state. With this arrangement, it is possible to improve the sealing capability and prolong the life of the mechanism.

摘要翻译： 处理装置包括容纳在用于承载待处理物体的搬运单元中的内筒25（处理室23），并进一步用内筒25或第一固定壁34密封物体，以处理与物体接触的物体 加工液 在具有密封机构的该处理装置中，柔性中空填料100,101在内筒25或第一固定壁34中，在其与第一固定壁34和内筒25的封闭部分处双重布置。中空填料100 101具有通过压力检测开关110和关闭阀105与相应的加压空气源103连接的中空部分102.通过膨胀或收缩中空填料100,101，将设备的操作切换到其密封状态和 非密封状态。 通过这种布置，可以提高密封能力并延长机构的使用寿命。