Abstract:
A liquid crystal display (LCD) substrate and a fabrication method thereof are provided. The LCD substrate comprises a substrate, a spacer definition layer formed on the substrate comprising a first step, and a spacer formed along a profile of the first step of spacer definition layer and adjacent to the first step, thereby forming a second step on the spacer. The invention utilizes a single photolithographic process to form spacers with steps, thus, effectively lowering the probability of mura defects caused by gravity, contact, or an uneven cell gap.
Abstract:
A reflective liquid crystal display panel for dual display. The panel has a plurality of pixels and each pixel having first and second display regions. Each pixel includes a first substrate and a second substrate opposite thereto, wherein the first substrate includes a pixel driving device. A first reflective layer is formed overlying the first substrate in the first display region. A second reflective layer is formed overlying an interior of the second substrate in the second display region. A liquid crystal layer is interposed between the first substrate and the second substrate.
Abstract:
A liquid crystal display is suitable for displaying images with rapid motions, and comprises an active matrix substrate equipped with a plurality of thin film transistors. The active matrix substrate comprises a plurality of pixels that are placed at the encircled areas of a plurality of scanning lines and a plurality of data lines. Each pixel consists of two thin film transistors and one pixel electrode. The data lines connected electrodes of the thin film transistors are connected to two adjoining data lines respectively, whereas the pixel connected electrodes of the two thin film transistors are together connected to the pixel electrode. The gate electrodes of the two thin film transistors are connected to two adjoining scanning lines respectively.
Abstract:
A process for forming an in-plane switching mode liquid crystal display (IPS-LCD), which defines pixel portions of the common and data electrodes by the same photo-masking and lithography procedure, is disclosed. Accordingly, the misalignment can be avoid. An in-plane switching mode liquid crystal display (IPS-LCD) is also disclosed. The IPS-LCD includes a storage capacitor consisting of storage-capacitor portions of the common and data electrode structures, which is disposed outside the pixel region so as to enhance the aperture ratio of the pixel region.
Abstract:
A method of fabricating cup shape cylindrical capacitor of high density Dynamic Random Access Memory (DRAM) cells is disclosed. The cup shape capacitor shape is achieved by first depositing a first polysilicon layer on a silicon substrate; a third dielectric layer is then formed overlaying the first polysilicon layer, and defined third dielectric crowns by the conventional lithography and etching techniques; a second polysilicon layer is deposited overlaying the third dielectric crowns and first polysilicon layer; the first polysilicon and second polysilicon layers are then vertically anisotropically etchback to define storage nodes of the cylindrical capacitors; the third dielectric crowns are removed; finally, the capacitor dielectric layer and the polysilicon top plate of the capacitor are formed to complete the cup shape cylindrical capacitor formation for high density DRAM applications.
Abstract:
A simplified tri-layer process for forming a thin film transistor matrix for a liquid crystal display is disclosed. By using a backside exposure technique, the masking step for patterning an etch stopper layer can be omitted. After forming an active region including a gate electrode and a scan line on the front side of a substrate, and sequentially applying an etch stopper layer and a photoresist layer over the resulting structure, the backside exposure is performed by exposing from the back side of the substrate. A portion of photoresist is shielded by the active region from exposure so that an etch stopper structure having a shape similar to the shape of the active region is formed without any photo-masking and lithographic procedure. Therefore, the above self-aligned effect allows one masking step to be reduced so as to simplify the process.
Abstract:
A method for fabricating a capacitor electrode on a semiconductor substrate includes the steps of: forming a conducting layer over the semiconductor substrate; forming a photoresist layer over the conducting layer; pattering the photoresist layer through an interfering exposure step; and pattering the conducting layer using the patterned photoresist layer as a mask, thereby forming a capacitor electrode.
Abstract:
An ion repulsion structure for a fuse window is provided. The ion repulsion structure includes multi-level metallic layers and a P-type silicon semiconductor substrate having a plurality of wells. The P-type silicon semiconductor substrate includes an N-type well, a P-type well formed in the N-type well and a plurality of P+ type diffusion regions formed in the P-type well. A fuse element is formed on the P-type silicon semiconductor substrate. A fuse window layer is formed over the fuse element. Multi-level metallic layers surrounding the fuse window are formed. A plurality of contact plugs is electrically connected between the P+ type diffusion regions of the semiconductor substrate and the lowest metallic layer. A plurality of via plugs electrically connect the multi-level metallic layers to each other.
Abstract:
A method of fabricating a rugged capacitor structure of high density Dynamic Random Access Memory (DRAM) cells is disclosed. First, MOSFETs, wordlines and bitlines are formed on a semiconductor silicon substrate. Next, a dielectric layer and a doped polysilicon layer are sequentially deposited over the entire silicon substrate. The dielectric layer and doped polysilicon layer are then partially etched to open source contact windows. Then, a polysilicon layer is deposited overlaying the doped polysilicon layer and filling into the source contact windows. Next, the polysilicon layer and doped polysilicon layers are partially etched to define bottom electrodes of the capacitors. Next, tilt angle implantation is performed to implant impurities into top surface and four sidewalls of the polysilicon layer and doped polysilicon layer. Next, a rugged polysilicon layer is deposited overlaying the polysilicon, doped polysilicon and third dielectric layers. Next, the polysilicon layer is anisotropically etched by using the rugged polysilicon layer as an etching mask to transfer rugged surface profile from the rugged polysilicon layer to the polysilicon layer. Finally, an interelectrode dielectric layer and a third polysilicon layer as top electrodes of the capacitors are sequentially formed to complete the rugged capacitor for high density DRAM applications.