摘要:
EMI filter 20 includes input terminal Vin, output terminal Vout, resistor component R1 and diodes D1 and D2. Resistor component R1 is composed of polycrystalline resistor component Rp and ring resistor components R11 and R12. Polycrystalline resistor component Rp is connected between input and output terminals Vin and Vout. Ring resistor components R11 and R12 are provided on one and the other sides of polycrystalline resistor component at a prescribed distance, respectively. Further, diode D1 has cathode and anode electrodes connected to input terminal Vin and reference potential Vss, respectively. Likewise, diode D2 has cathode and anode electrodes connected to output terminal Vout and reference potential Vss, respectively. Ring resistor components R11 and R12 are rectangular in shape to electromagnetically couple to polycrystalline resistor component Rp. When a high frequency signal is applied to input terminal Vin, an electric current flowing through polycrystalline resistor component Rp generates magnetic fields so that ring resistor components R11 and R12 electro-magnetically induce an electric current.
摘要:
An ESD protection device includes: a semiconductor substrate of a first conductivity type having a first major surface and a second major surface; a signal input electrode formed on the first major surface of the semiconductor substrate; a base region of a second conductivity type formed on a surface region of the second major surface of the semiconductor substrate; a diffusion region of the first conductivity type; a resistor layer formed on the second major surface of the semiconductor substrate of the first conductivity type; a signal output electrode electrically connected to the diffusion region of the first conductivity type; and a ground electrode electrically connected to the resistor layer. The diffusion region is selectively formed on a surface region of the base region of the second conductivity type in the semiconductor substrate of the first conductivity type. The resistor layer is electrically connected to the diffusion region of the first conductivity type.
摘要:
A solid-state image sensing device provided with photoelectric conversion films stacked above a semiconductor substrate, comprising: first impurity regions as defined herein; second impurity regions as defined herein; signal charge reading regions as defined herein; and third impurity regions as defined herein.
摘要:
The connector clip for verifying complete connection integrally includes a clip body of U-shape in cross-section to receive a tubular holding portion and a connection verifying portion of U-shape in cross-section to receive an opposite axial side of an annular verification projection with respect to the pipe. The connection verifying portion has a verifying body and a snap-fit portion. The clip body and the verifying body are connected via a connection part, while the verifying body and the snap-fit portion are connected via a joint part. Reinforcement ribs are formed along an entire circumference of outer surface of the verifying body.
摘要:
A high breakdown voltage semiconductor device includes an active area and a surrounding region. In the active area, a second semiconductor layer of a second conductivity type is formed in a first semiconductor layer of a first conductivity type. A third semiconductor layer of the first conductivity type is formed in the second semiconductor layer. A gate electrode faces through a gate insulating film the second semiconductor layer. A first main electrode is connected to the second and third semiconductor layers. A ring layer of the second conductivity type surrounds the active area at a position in the surrounding region. A first low-resistivity layer is formed in the ring layer and has a resistivity lower than that of the ring layer. The first low-resistivity layer is connected to the first main electrode.
摘要:
A resin tube 9 inserted and fixed to one end of a female connector 10 and a corresponding pipe 11 connected by snap in to the other end of a female connector 10 are fixed by a first holding means 17 and a second holding means 18 of a holder member 16 respectively. Holding portion of either the resin tube 9 and the corresponding pipe 11 is located off the common axis L as securely held by the holder member 16. Either the resin tube 9 or the corresponding pipe 11 is turned about the female connector 10 so as to connect with either the first holding means 17 or the second holding means 18.
摘要:
A semiconductor device is disclosed, which comprises a first main electrode, a second main electrode, a high-resistance semiconductor layer of first conductivity type interposed between the first main electrode and the second main electrode, and at least a buried layer of second conductivity type selectively formed in the semiconductor layer, extending at substantially right angles to a line connecting the first and second main electrodes, comprising a plurality strips functioning as current paths and set at a potential different from a potential of any other electrode when a depletion layer extending from a region near the first main electrode reaches the buried layer.
摘要:
An insulated-gate semiconductor device comprises a P type emitter layer, an N.sup.- high-resistive base layer formed on the P type emitter layer, and a P type base layer contacting the N.sup.- high-resistive base layer. A plurality of trenches are formed having a depth to reach into the N.sup.- high-resistive base layer from the P type base layer. A gate electrode covered with a gate insulation film is buried in each trench. An N type source layer to be connected to a cathode electrode is formed in the surface of the P type base layer in a channel region between some trenches, thereby forming an N channel MOS transistor for turn-on operation. A P channel MOS transistor connected to the P base layer is formed in a channel region between other trenches so as to discharge the holes outside the device upon turn-off operation.
摘要:
An insulated-gate semiconductor device comprises a p type emitter layer, an N.sup.- high-resistive base layer formed on the P type emitter layer, and a P type base layer contacting the N.sup.- high-resistive base layer. A plurality of trenches are formed having a depth to reach into the N.sup.- high-resistive base layer from the P type base layer. A gate electrode covered with a gate insulation film is buried in each trench. An N type source layer to be connected to a cathode electrode is formed in the surface of the P type base layer in a channel region between some trenches, thereby forming an N channel MOS transistor for turn-on operation. A P channel MOS transistor connected to the P base layer is formed in a channel region between other trenches so as to discharge the holes outside the device upon turn-off operation.
摘要:
An insulated-gate semiconductor device comprises a P type emitter layer, an N.sup.- high-resistive base layer formed on the P type emitter layer, and a P type base layer contacting the N.sup.- high-resistive base layer. A plurality of trenches are formed having a depth to reach into the N.sup.- high-resistive base layer from the P type base layer. A gate electrode covered with a gate insulation film is buried in each trench. An N type source layer to be connected to a cathode electrode is formed in the surface of the P type base layer in a channel region between some trenches, thereby-forming an N channel MOS transistor for turn-on operation. A P channel MOS transistor connected to the P base layer is formed in a channel region between other trenches so as to discharge the holes outside the device upon turn-off operation.