公开(公告)号：US07348516B2

公开(公告)日：2008-03-25

申请号：US10921481

申请日：2004-08-18

Applicant: Yunlong Sun ,  Richard Harris ,  Ho Wai Lo ,  Brian Baird ,  Jay Johnson ,  Robert F. Hainsey

Inventor： Yunlong Sun ,  Richard Harris ,  Ho Wai Lo ,  Brian Baird ,  Jay Johnson ,  Robert F. Hainsey

IPC: B23K26/00 ,  B23K26/14 ,  B23K26/16

CPC classification number: H01L23/5258 ,  B23K26/0613 ,  B23K26/0622 ,  B23K2101/40 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A laser pulse with a specially tailored temporal power profile, instead of a conventional temporal shape or substantially square shape, severs an IC link. The specially tailored laser pulse preferably has either an overshoot at the beginning of the laser pulse or a spike peak within the duration of the laser pulse. The timing of the spike peak is preferably set ahead of the time when the link is mostly removed. A specially tailored laser pulse power profile allows the use of a wider laser pulse energy range and shorter laser wavelengths, such as the green and UV, to sever the links without appreciable damage to the substrate and passivation structure material located on either side of and underlying the links.

Abstract translation: 具有特别定制的时间功率分布的激光脉冲代替传统的时间形状或基本上正方形的形状来切断IC连接。 特别定制的激光脉冲优选地在激光脉冲的开始处具有过冲，或者在激光脉冲的持续时间内具有尖峰​​。 尖峰的定时优先设置在链路被大部分去除的时间之前。 特别定制的激光脉冲功率轮廓允许使用更宽的激光脉冲能量范围和更短的激光波长（例如绿色和紫外线）来切断连接，而不会对基板和钝化结构材料的任何一侧和底层 链接。

公开(公告)号：US07289549B2

公开(公告)日：2007-10-30

申请号：US11067470

申请日：2005-02-25

Applicant: Yunlong Sun ,  Lei Sun

Inventor： Yunlong Sun ,  Lei Sun

IPC: H01S3/082

CPC classification number: H01S3/082 ,  B23K26/0622 ,  H01S3/07 ,  H01S3/0805 ,  H01S3/08086 ,  H01S3/083 ,  H01S3/10038 ,  H01S3/10046 ,  H01S3/109 ,  H01S3/117 ,  H01S3/127 ,  H01S3/1611

Abstract: A plurality of subresonators (12, 14), having different design configurations, share a common resonator section (18) such that the lasing action can be substantially synchronized to provide coherent laser pulses that merge the different respective pulse energy profile and/or pulse width characteristics imparted by the configurations of the subresonators (12, 14). The subresonators (12, 14) may share a laser medium (42) in the common section, or each distinct subresonator section (28, 36) may have its own laser medium (42). Exemplary long and short subresonators (12, 14) generate specially tailored laser pulses having a short rise time and a long pulse width at one wavelength or two different wavelengths that may be beneficial for a variety of laser and micromachining applications including memory link processing.

Abstract translation: 具有不同设计配置的多个子共振器（12,14）共享公共谐振器部分（18），使得激光作用可以基本上同步，以提供合并不同的相应脉冲能量分布和/或脉冲宽度的相干激光脉冲 通过子共振器（12,14）的构造赋予的特性。 子共振器（12,14）可以在公共部分中共享激光介质（42），或者每个不同的子谐振器部分（28,36）可以具有其自己的激光介质（42）。 示例性的长和短子谐振器（12,14）产生特定定制的激光脉冲，其具有在一个波长或两个不同波长处具有短的上升时间和长脉冲宽度，这可能对于包括存储器链路处理的各种激光和微加工应用有利。

公开(公告)号：US20070153841A1

公开(公告)日：2007-07-05

申请号：US11603969

申请日：2006-11-21

Applicant: Yunlong Sun

Inventor： Yunlong Sun

IPC: H01S3/11 ,  H01S3/10

CPC classification number: H01S3/109 ,  H01S3/005 ,  H01S3/07 ,  H01S3/0813 ,  H01S3/09415 ,  H01S3/117

Abstract: A solid-state laser (10) has a laser resonator (20) with output ports (22) at both ends to provide two separate laser micromachining beams (42). A set of wavelength converters (26) can be employed to convert the laser machining beams (42) to harmonic wavelength outputs, thus reducing the risk of damage to the wavelength converters and enabling higher total average harmonic power to be generated from a single laser. The laser machining beams (42) can be different to perform different laser operations independently or can be adapted to have substantially identical parameters to permit simultaneous parallel high-quality laser operations on substantially identical workpieces (54), or the laser machining beams (42) can be combined to provide a single laser system output (42e). The two laser machining beams (42) can be further split or multiplexed to suit particular applications.

Abstract translation: 固体激光器（10）具有在两端具有输出端口（22）的激光谐振器（20），以提供两个单独的激光微加工光束（42）。 可以使用一组波长转换器（26）将激光加工光束（42）转换成谐波波长输出，从而降低损坏波长转换器的风险，并且能够从单个激光器产生更高的总平均谐波功率。 激光加工光束（42）可以不同，以独立地执行不同的激光操作，或者可以适于具有基本上相同的参数，以允许在基本上相同的工件（54）上的同时并行的高质量激光操作或激光加工光束（42） 可以组合提供单个激光系统输出（42e）。 两个激光加工光束（42）可进一步分割或多路复用以适合特定应用。

公开(公告)号：US20060285571A1

公开(公告)日：2006-12-21

申请号：US11157271

申请日：2005-06-20

Applicant: Yunlong Sun ,  Brian Baird

Inventor： Yunlong Sun ,  Brian Baird

IPC: H01S3/04 ,  H01S3/16 ,  H01S3/091

CPC classification number: H01S3/0941 ,  H01S3/0405 ,  H01S3/042 ,  H01S3/0604 ,  H01S3/0612 ,  H01S3/0627 ,  H01S3/07 ,  H01S3/094084 ,  H01S3/1611 ,  H01S3/1673

Abstract: A chip-shaped laser medium (12) is side pumped to improve mode matching between the pumping energy (50) and lasing mode volume (36). The chip thickness (44) and laser medium doping level can be designed and controlled to ensure adequate pumping coupling efficiency. The chip shape can also be employed to provide greater chip surface areas (22) for cooling the laser medium (12). The laser pumping package (70), gain module (101), and chip-shaped design can be scalable to offer higher pumping power and high output power. Different orientations of the gain modules (101) with respect to each other can be used to provide better lasing mode quality.

Abstract translation: 侧面泵浦芯片状激光介质（12）以改善泵送能量（50）和激光模式体积（36）之间的模式匹配。 可以设计和控制芯片厚度（44）和激光介质掺杂水平，以确保足够的泵浦耦合效率。 也可以使用芯片形状来提供用于冷却激光介质（12）的更大的芯片表面积（22）。 激光泵浦封装（70），增益模块（10 1 1）和芯片形设计可以是可扩展的，以提供更高的泵浦功率和高输出功率。 可以使用增益模块（10 SUB）相对于彼此的不同取向来提供更好的激光模式质量。

公开(公告)号：US07139294B2

公开(公告)日：2006-11-21

申请号：US10893148

申请日：2004-07-16

Applicant: Yunlong Sun

Inventor： Yunlong Sun

IPC: H01S3/11 ,  H01S3/10 ,  B23K26/00

CPC classification number: H01S3/109 ,  H01S3/005 ,  H01S3/07 ,  H01S3/0813 ,  H01S3/09415 ,  H01S3/117

Abstract: A solid-state laser (10) has a laser resonator (20) with output ports (22) at both ends to provide two separate laser micromachining beams (42). A set of wavelength converters (26) can be employed to convert the laser machining beams (42) to harmonic wavelength outputs, thus reducing the risk of damage to the wavelength converters and enabling higher total average harmonic power to be generated from a single laser. The laser machining beams (42) can be different to perform different laser operations independently or can be adapted to have substantially identical parameters to permit simultaneous parallel high-quality laser operations on substantially identical workpieces (54), or the laser machining beams (42) can be combined to provide a single laser system output (42e). The two laser machining beams (42) can be further split or multiplexed to suit particular applications.

Abstract translation: 固体激光器（10）具有在两端具有输出端口（22）的激光谐振器（20），以提供两个单独的激光微加工光束（42）。 可以使用一组波长转换器（26）将激光加工光束（42）转换成谐波波长输出，从而降低了损坏波长转换器的风险，并且使得能够从单个激光器产生更高的总平均谐波功率。 激光加工光束（42）可以不同，以独立地执行不同的激光操作，或者可以适于具有基本上相同的参数，以允许在基本上相同的工件（54）上的同时并行的高质量激光操作或激光加工光束（42） 可以组合提供单个激光系统输出（42e）。 两个激光加工光束（42）可进一步分割或多路复用以适合特定应用。

公开(公告)号：US20060141681A1

公开(公告)日：2006-06-29

申请号：US11360965

申请日：2006-02-22

Applicant: Yunlong Sun ,  Edward Swenson ,  Richard Harris

Inventor： Yunlong Sun ,  Edward Swenson ,  Richard Harris

IPC: H01L21/82

CPC classification number: H01S3/2383 ,  B23K26/04 ,  B23K26/0604 ,  B23K26/0613 ,  B23K26/0622 ,  B23K26/0624 ,  B23K26/067 ,  B23K26/361 ,  G03F7/70041 ,  G03F7/70725 ,  H01L21/76894 ,  H01L23/5254 ,  H01L23/5258 ,  H01L2924/0002 ,  H01S3/005 ,  H01S3/0057 ,  H01S3/0085 ,  H01S3/0092 ,  H01S3/1118 ,  H01S5/4012 ,  H01L2924/00

Abstract: A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.

公开(公告)号：US20060140230A1

公开(公告)日：2006-06-29

申请号：US11359215

申请日：2006-02-21

Applicant: Yunlong Sun ,  Edward Swenson ,  Richard Harris

Inventor： Yunlong Sun ,  Edward Swenson ,  Richard Harris

IPC: H01S3/10

CPC classification number: B23K26/04 ,  B23K26/0604 ,  B23K26/0613 ,  B23K26/0622 ,  B23K26/0624 ,  B23K26/067 ,  B23K26/361 ,  G03F7/70041 ,  G03F7/70725 ,  H01L21/76894 ,  H01L23/5258 ,  H01L2924/0002 ,  H01S3/005 ,  H01S3/0057 ,  H01S3/0085 ,  H01S3/0092 ,  H01S3/1118 ,  H01S3/2383 ,  H01S5/4012 ,  Y10S438/94 ,  H01L2924/00

Abstract: A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.

公开(公告)号：US20060138109A1

公开(公告)日：2006-06-29

申请号：US11360962

申请日：2006-02-22

Applicant: Yunlong Sun ,  Edward Swenson ,  Richard Harris

Inventor： Yunlong Sun ,  Edward Swenson ,  Richard Harris

IPC: B23K26/16

CPC classification number: B23K26/04 ,  B23K26/0604 ,  B23K26/0613 ,  B23K26/0622 ,  B23K26/0624 ,  B23K26/067 ,  B23K26/361 ,  G03F7/70041 ,  G03F7/70725 ,  H01L21/76894 ,  H01L23/5258 ,  H01L2924/0002 ,  H01S3/005 ,  H01S3/0057 ,  H01S3/0085 ,  H01S3/0092 ,  H01S3/1118 ,  H01S3/2383 ,  H01S5/4012 ,  Y10S438/94 ,  H01L2924/00

Abstract: A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.

公开(公告)号：US20060134838A1

公开(公告)日：2006-06-22

申请号：US11286305

申请日：2005-11-23

Applicant: Yunlong Sun ,  Edward Swenson ,  Richard Harris

Inventor： Yunlong Sun ,  Edward Swenson ,  Richard Harris

IPC: H01L21/82

CPC classification number: B23K26/04 ,  B23K26/0604 ,  B23K26/0613 ,  B23K26/0622 ,  B23K26/0624 ,  B23K26/067 ,  B23K26/361 ,  G03F7/70041 ,  G03F7/70725 ,  H01L21/76894 ,  H01L23/5258 ,  H01L2924/0002 ,  H01S3/005 ,  H01S3/0057 ,  H01S3/0085 ,  H01S3/0092 ,  H01S3/1118 ,  H01S3/2383 ,  H01S5/4012 ,  Y10S438/94 ,  H01L2924/00

Abstract: A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.

公开(公告)号：US20060114948A1

公开(公告)日：2006-06-01

申请号：US11000330

申请日：2004-11-29

Applicant: Ho Lo ,  Yunlong Sun ,  Richard Harris ,  Brian Baird

Inventor： Ho Lo ,  Yunlong Sun ,  Richard Harris ,  Brian Baird

IPC: H01S3/10 ,  H01S3/08

CPC classification number: B23K26/067 ,  B23K26/0673

Abstract: A workpiece processing system employs a common modular imaged optics assembly and an optional variable beam expander for optically processing multiple laser beams. In one embodiment, a laser and a fixed beam expander cooperate to produce a laser beam that propagates through a beam switching device to produce multiple laser beams that propagate along separate propagation path portions and subsequently merge into a common path portion through an imaged optics assembly and optional variable expander. The beam expander sets the shape of the laser beams in the form of a Gaussian spatial distribution of light energy. The imaged optics assembly shapes the Gaussian spatial distribution of the laser beams to form output beams of uniform spatial distribution. In an alternative embodiment, the beam switching device is removed and the laser beams propagate from separate laser sources associated with separate optional beam expanders.

Abstract translation: 工件处理系统采用通用的模块化成像光学组件和用于光学处理多个激光束的可选可变光束扩展器。 在一个实施例中，激光器和固定光束扩展器协作以产生通过光束切换装置传播的激光束，以产生沿分离的传播路径部分传播并随后通过成像的光学组件并入公共路径部分的多个激光束， 可选扩展器。 光束扩展器以光能的高斯空间分布的形式设置激光束的形状。 成像光学组件对激光束的高斯空间分布进行整形，形成均匀空间分布的输出光束。 在替代实施例中，去除光束切换装置，并且激光束从与单独的可选光束扩展器相关联的分离的激光源传播。