Abstract:
The disclosure relates to a trusted interface unit and a method of making and using the same. According to one embodiment of the present invention, a method of transmitting data on a network may include receiving data from a partition within a node on the network. This node may be configured to transmit data associated with a number of sensitivity levels. According to one embodiment of the invention, these sensitivity levels may be classification levels. One method of transmission of data may include determining the identity of the partition that originated the data within the node. Furthermore, a label may be added to the data received from within the node and the data may be encrypted with a key that may be uniquely associated with the label on the data. After encryption, the data may be transmitted on the network. Additional methods including the reception of data are disclosed. Various node and network architectures are disclosed implementing the methods and apparatus of the present invention.
Abstract:
A system for and method of processing complex signals encoded into quantum states is presented. According to an embodiment of the invention, polarized components of a pump laser beam are separated and respectively modulated with first and second signals. The modulated polarized components are directed to adjacent non-linear crystals with optical axes aligned at right angles to each-other. Information regarding at least one of the first and second signals is then derived from measurements of coincidence events.
Abstract:
Provided are two-dimensional autofocus methods in a synthetic aperture radar (SAR) system which include: (1) two-dimensional pulse pair product algorithm including shear PGA, eigenvector phase history (“EPH”), shear PGA/EPH); (2) two-dimensional optimization algorithms including parametric one-dimensional estimate/two-dimensional correction, parametric two dimensional estimate/two-dimensional correction, unconstrained two-dimensional nonparametric and constrained two-dimensional nonparametric methods; (3) a two-dimensional geometry filter algorithm; (4) a two-dimensional prominent point processing algorithm; (5) a one-dimensional phase estimate of higher order two dimensional phase errors; and, (6) a fast SHARP parametric autofocus algorithm.
Abstract:
The present invention is directed to an optical grating sensor configured to detect a phase change in light passing though the system due to a binding event caused by an analyte. The grating sensor may include a light source that may be, for example, a coherent light source. The invention may also include a first diffraction grating having a first period. A micro-electrical mechanical system (MEMS) may be displaced from the first diffraction grating and may be configured to modulate the light received form the coherent light source. An analyte recognition material may be disposed on the surface of the first grating. A detector may be configured to receive light form the coherent light source after the light has been diffracted from the first diffraction grating and modulated by the MEMS. In another embodiment of the present invention, the grating sensor may be configured to operate in two modes. The first mode may be a mode the detect a phase change in the light due to a binding event. The second mode may include the detection of fluorescence due to a binding event and may employ tagging of the analytes.
Abstract:
An embodiment of the present invention relates to the protection of electronic displays and includes a guard configured to protect a lighting means while providing an expanded field of view. The guard may include a first element and a second element each having at least a top surface and a wall. The lighting means may be positionable substantially between the first element and the second element such that the top surface of the lighting means is below the first top surface and the second top surface to protect the lighting means from incidental impact. A gap between the first and second elements provides a field of view. The field of view may include a substantially orthogonal line of sight to one side surface of the lighting means.
Abstract:
A connector system is provided. The system includes a substantially circular interconnecting hub, and a plurality of circuit board bays configured substantially radially around the substantially circular interconnecting hub. Each circuit board bay has a plurality of aligned connectors configured to receive a circuit board. The interconnecting circuit hub has, for each individual circuit board bay, a direct data pathway connecting the individual circuit board bay to all remaining circuit board bays of the plurality of circuit board bays. Each of the plurality of circuit board bays can directly communicate through the interconnecting hub with each of the remaining circuit boards bays.
Abstract:
A system for connecting circuit boards is provided. A plurality of overlapping spaced apart circuit boards have a plurality of conductive pins passing through holes in the circuit boards. A connector includes a flexible sheet insulator and a plurality of conductive surfaces separated and supported by the flexible insulator. At least one of the conductive surfaces has a hole there through and a bent compliant lead extending there from. The hole engages one of the pins, and the complaint lead connects to one of the circuit boards.
Abstract:
The present invention provides a number of techniques for laminating and interconnecting multiple substrates to form a multilayer package or other circuit component. A solder bump may be formed on the conductive pad of at least one of two or more substrates. The solder bump preferably is formed from an application of solder paste to the conductive pad(s). Adhesive films may be positioned between the surfaces of the substrates having the conductive pads, where the adhesive films include apertures located substantially over the conductive pads such that the conductive pads and/or solder bumps confront each other through the aperture. The two or more substrates then may be pressed together to mechanically bond the two or more substrates via the adhesive films. The solder bump(s) may be reflowed during or after the lamination to create a solder segment that provides an electrical connection between the conductive pads through the aperture in the adhesive films.
Abstract:
An electronic device according to an embodiment of the present invention may include a chassis configured to house electronics. The chassis of an electronic device may include a first rail and a second rail substantially parallel to the first rail. The first rail and the second rail may be coupled to the chassis. The first rail may have a first cutout and a second cutout. The second rail may include a third cutout and a fourth cutout. The invention according may also include a housing. This housing may be configured to be removably coupled to the chassis. The housing may include a first side having a first protrusion and a second protrusion. The housing may also include a second side having a third protrusion and a fourth protrusion. The first recess may be configured to receive one of the first protrusion and the second protrusion. The second recess may be configured to receive one of the third protrusion and the fourth protrusion. Thus the housing may be slidable in a substantially lateral motion under the first rail and the second rail.
Abstract:
A system for connecting circuit boards is provided. A plurality of overlapping spaced apart circuit boards have a plurality of conductive pins passing through holes in the circuit boards. A connector includes a flexible sheet insulator and a plurality of conductive surfaces separated and supported by the flexible insulator. At least one of the conductive surfaces has a hole there through and a bent compliant lead extending there from. The hole engages one of the pins, and the complaint lead connects to one of the circuit boards.