利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

161 条记录 (耗时 0.023 秒)

    Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces
    71.
    发明授权
    Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces 有权
    用于监测用于抛光微器件工件的抛光垫特性的系统和方法

    公开(公告)号：US07258596B2

    公开(公告)日：2007-08-21

    申请号：US11449128

    申请日：2006-06-07

    申请人： Jason B. Elledge ,  Nagasubramaniyan Chandrasekaran

    发明人： Jason B. Elledge ,  Nagasubramaniyan Chandrasekaran

    IPC分类号： B24B49/00

    CPC分类号： B24B37/20 ,  B24B1/04 ,  B24B37/005 ,  B24B49/003 ,  B24B49/18 ,  B24B53/017

    摘要： Systems and methods for monitoring characteristics of a polishing pad used in polishing a micro-device workpiece are disclosed herein. In one embodiment, a method for monitoring a characteristic of a polishing pad includes applying ultrasonic energy to the polishing pad and determining a status of the characteristic based on a measurement of the ultrasonic energy applied to the polishing pad. In one aspect of this embodiment, applying ultrasonic energy includes applying ultrasonic energy from a transducer. The transducer can be carried by a conditioner, a fluid arm, a micro-device workpiece carrier, or a table. In another aspect of this embodiment, determining the status of the characteristic includes determining a thickness, density, surface contour, roughness, or texture of the polishing pad.

    摘要翻译： 本文公开了用于监测在微装置工件的研磨中使用的抛光垫的特性的系统和方法。 在一个实施例中，一种用于监测抛光垫的特性的方法包括：将超声能量施加到抛光垫上，并基于施加到抛光垫的超声波能量的测量来确定该特性的状态。 在该实施例的一个方面中，施加超声能量包括从换能器施加超声波能量。 传感器可由调节器，流体臂，微器件工件载体或工作台承载。 在该实施例的另一方面，确定特性的状态包括确定抛光垫的厚度，密度，表面轮廓，粗糙度或纹理。

    Energy enhanced surface planarization
    72.
    发明授权
    Energy enhanced surface planarization 有权
    能量增强表面平坦化

    公开(公告)号：US07156947B2

    公开(公告)日：2007-01-02

    申请号：US10883396

    申请日：2004-06-30

    申请人： Reza M. Golzarian

    发明人： Reza M. Golzarian

    IPC分类号： C23F1/00 ,  B44C1/22

    CPC分类号： B24B37/013 ,  B24B49/003 ,  C25F7/00

    摘要： A substrate processing apparatus equipped to employ an energy directed at a process side of a substrate to enhance and control material removal is provided.

    摘要翻译： 提供了一种衬底处理设备，其被设置为采用指向衬底的工艺侧的能量来增强和控制材料去除。

    Method of determining state variables and changes in state variables
    73.
    发明申请
    Method of determining state variables and changes in state variables 审中-公开

    公开(公告)号：US20060210986A1

    公开(公告)日：2006-09-21

    申请号：US10552806

    申请日：2004-04-15

    申请人： Bernhard Gleich

    发明人： Bernhard Gleich

    IPC分类号： C12Q1/68 ,  C12M1/34

    CPC分类号： A61B5/05 ,  A61B5/0515 ,  A61K49/1887 ,  B24B49/003 ,  G06F19/00 ,  G06F19/30 ,  G06F19/32

    摘要： The present invention relates to a method of determining physical, chemical and/or biological state variables, particularly substance concentrations, temperature, pH and/or physical fields, and/or the change in these state variables in an examination area of an examination object by determining the change in the spatial distribution of magnetic particles in this examination area as a function of the effect of influencing variables on at least a partarea and/or in the conditions in at least a part-area of the examination area, by means of the following steps: a) introducing magnetic particles into at least part of the examination area in a first state in which in the examination area or in parts thereof at least some of the magnetic particles that are to be examined are agglomerated and/or coupled to one another in pairs or more, or introducing magnetic particles into at least part of the examination area in a second state in which the particles are deagglomerated and/or decoupled and can be agglomerated and/or coupled, b) generating a magnetic field with a spatial profile of the magnetic field strength such that there is produced in the examination area a first part-area having a low magnetic field strength and a second part-area having a higher magnetic field strength, c) changing the, in particularrelative, spatial position of the two part-areas in the examination area or changing the magnetic field strength in the first part-area so that the magnetization of the particles is locally changed, d) detecting signals that depend on the magnetization in the examination area that is influenced by this change, and e) evaluating the signals so as to obtain information about the change in the spatial distribution of the magnetic particles and/or about physical, chemical and/or biological state variables or the change therein in the examination area. The invention further relates to magnetic particle compositions, in particular functionalised magnetic particle compositions and their use in a method according to the invention. The invention further also relates to an apparatus for the measurement of state variables in the examination area.

    Measuring apparatus
    75.
    发明授权
    Measuring apparatus 失效
    测量装置

    公开(公告)号：US06935935B2

    公开(公告)日：2005-08-30

    申请号：US10835059

    申请日：2004-04-30

    申请人： Mitsuo Tada ,  Yasunari Suto

    发明人： Mitsuo Tada ,  Yasunari Suto

    IPC分类号： G01N25/16 ,  B24B37/015 ,  B24B49/00 ,  B24B49/04 ,  B24B49/10 ,  B24B49/14 ,  G01B11/06 ,  G01B17/02 ,  H01L21/304 ,  H01L21/66

    CPC分类号： B24B37/015 ,  B24B49/003 ,  B24B49/04 ,  B24B49/10 ,  G01B11/0666

    摘要： A measuring apparatus includes a heating unit for applying heat to a first point within a workpiece or on a surface of a workpiece and propagating the heat to a second point within the workpiece or on the surface of the workpiece. The measuring apparatus further includes a measuring unit for measuring a displacement of the surface of the workpiece at the second point to which the heat has been propagated, and an analyzing unit for analyzing a structure of the workpiece based on the displacement measured by the measuring unit in consideration of a distance between the first point and the second point.

    摘要翻译： 测量装置包括加热单元，用于将热量加热到工件内的第一点或工件的表面上，并将热量传播到工件内或工件的表面上的第二点。 测量装置还包括测量单元，用于测量在传播热量的第二点处的工件表面的位移;以及分析单元，用于基于由测量单元测量的位移来分析工件的结构 考虑到第一点和第二点之间的距离。

    SYSTEMS AND METHODS FOR MONITORING CHARACTERISTICS OF A POLISHING PAD USED IN POLISHING MICRO-DEVICE WORKPIECES
    78.
    发明申请
    SYSTEMS AND METHODS FOR MONITORING CHARACTERISTICS OF A POLISHING PAD USED IN POLISHING MICRO-DEVICE WORKPIECES 失效
    用于监测抛光微型器件工件使用的抛光垫的特性的系统和方法

    公开(公告)号：US20040176018A1

    公开(公告)日：2004-09-09

    申请号：US10379035

    申请日：2003-03-03

    发明人： Jason B. Elledge ,  Nagasubramaniyan Chandrasekaran

    IPC分类号： B24B001/00

    CPC分类号： B24B37/20 ,  B24B1/04 ,  B24B37/005 ,  B24B49/003 ,  B24B49/18 ,  B24B53/017

    摘要： Systems and methods for monitoring characteristics of a polishing pad used in polishing a micro-device workpiece are disclosed herein. In one embodiment, a method for monitoring a characteristic of a polishing pad includes applying ultrasonic energy to the polishing pad and determining a status of the characteristic based on a measurement of the ultrasonic energy applied to the polishing pad. In one aspect of this embodiment, applying ultrasonic energy includes applying ultrasonic energy from a transducer. The transducer can be carried by a conditioner, a fluid arm, a micro-device workpiece carrier, or a table. In another aspect of this embodiment, determining the status of the characteristic includes determining a thickness, density, surface contour, roughness, or texture of the polishing pad.

    摘要翻译： 本文公开了用于监测在微装置工件的研磨中使用的抛光垫的特性的系统和方法。 在一个实施例中，一种用于监测抛光垫的特性的方法包括：将超声波能量施加到抛光垫，并基于施加到抛光垫的超声波能量的测量来确定该特性的状态。 在该实施例的一个方面中，施加超声能量包括从换能器施加超声波能量。 传感器可由调节器，流体臂，微器件工件载体或工作台承载。 在该实施例的另一方面，确定特性的状态包括确定抛光垫的厚度，密度，表面轮廓，粗糙度或纹理。

    Methods and apparatus for polishing control
    79.
    发明申请
    Methods and apparatus for polishing control 有权
    抛光控制方法和装置

    公开(公告)号：US20040166685A1

    公开(公告)日：2004-08-26

    申请号：US10721769

    申请日：2003-11-24

    发明人： Manoocher Birang ,  Konstantin Y. Smekalin ,  David A. Chan

    IPC分类号： H01L021/461

    CPC分类号： B24B37/013 ,  B24B37/042 ,  B24B49/003 ,  B24B49/12

    摘要： A CMP station can be closed loop controlled by using data obtained by an inline metrology station from a first polished wafer to affect the processing of subsequent polished wafers. The first wafer is polished and measured by the inline metrology station. The metrology station measures at various points the array dielectric thickness, field dielectric thickness, barrier residue thickness and metal residue thickness. The data is then inputted into an algorithm and polishing parameter outputs are calculated. The outputs are sent to the CMP station and used to supplement or replace the previous polishing parameters. Subsequent wafers are polished on the CMP station using the revised polishing parameters.

    摘要翻译： CMP站可以通过使用由第一抛光晶片的在线计量站获得的数据来闭环控制，以影响后续抛光晶片的处理。 第一个晶片经过内联计量站的抛光和测量。 测量站在各点测量阵列电介质厚度，场介电厚度，阻挡残留厚度和金属残留厚度。 然后将数据输入算法，并计算抛光参数输出。 输出被发送到CMP站，用于补充或替换以前的抛光参数。 随后的晶片在CMP站上使用修改的抛光参数进行研磨。

    Measuring the surface properties of polishing pads using ultrasonic reflectance
    80.
    发明授权
    Measuring the surface properties of polishing pads using ultrasonic reflectance 失效
    使用超声反射测量抛光垫的表面性能

    公开(公告)号：US06684704B1

    公开(公告)日：2004-02-03

    申请号：US10241985

    申请日：2002-09-12

    申请人： Yaw S. Obeng

    发明人： Yaw S. Obeng

    IPC分类号： G01N2910

    CPC分类号： B24B37/005 ,  B24B49/003 ,  G01N29/12 ,  G01N29/46 ,  G01N2291/0231 ,  G01N2291/0238 ,  G01N2291/044

    摘要： The present invention provides a system and method for measuring the surface properties of polishing pads using noncontact ultrasonic reflectance. An ultrasonic probe is located over the polishing surface and configured to both transmit an ultrasonic signal to the polishing surface and receive a modified ultrasonic signal from the polishing surface without contacting the polishing surface. A subsystem coupled to the ultrasonic probe is configured to determine a surface property of the polishing pad from the modified signal.

    摘要翻译： 本发明提供一种使用非接触式超声反射测量抛光垫的表面特性的系统和方法。 超声波探头位于抛光表面上方，并配置成将超声波信号传送到抛光表面，并从抛光表面接收经修改的超声信号，而不接触抛光表面。 耦合到超声波探头的子系统被配置为根据修改的信号确定抛光垫的表面特性。