公开(公告)号：US06827135B1

公开(公告)日：2004-12-07

申请号：US10460547

申请日：2003-06-12

Applicant: Gary W. Kramer ,  Richard S. Frankel

Inventor： Gary W. Kramer ,  Richard S. Frankel

IPC: F28D1500

CPC classification number: H05K7/20345 ,  F28D15/0266 ,  H01L23/4735 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A cooling system for apparatus powered by electricity, that generates a substantial amount of heat during operation, and the heat must be dissipated to avoid failure of electrical and/or electronic components, such as semiconductor devices and integrated circuits, comprising the electrical apparatus. The cooling system employs water impinged on a heat sink thermally coupled with electrical apparatus, at subatmospheric pressure. The attendant phase change of the water to steam at a reduced temperature due to the subatmospheric pressure improves removal of waste heat to prevent failure of the electrical apparatus.

Abstract translation: 用于由电力供电的设备的冷却系统，其在运行期间产生大量的热量，并且必须消散热量，以避免包括电气设备的电气和/或电子部件（例如半导体器件和集成电路）的故障。 冷却系统采用水冲击在与电气设备热耦合的散热器，低于大气压。 由于低于大气压力，在降低温度下水的蒸汽相变会改善废热的去除以防止电气设备的故障。

公开(公告)号：US06646879B2

公开(公告)日：2003-11-11

申请号：US09860038

申请日：2001-05-16

Applicant: Gregory W. Pautsch

Inventor： Gregory W. Pautsch

IPC: H05K720

CPC classification number: H05K7/20345 ,  H01L23/4735 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  Y10T29/4935 ,  H01L2924/00

Abstract: A system and method for cooling electronic components. A liquid is heated to a temperature near its boiling point and directed against electronic components such that a portion of the heated liquid vaporizes, forming a mixed phase fluid. The mixed phase fluid is drawn away from the electronic components and the vapor is condensed back into a liquid.

公开(公告)号：US06552901B2

公开(公告)日：2003-04-22

申请号：US09974335

申请日：2001-10-10

Applicant: James Hildebrandt

Inventor： James Hildebrandt

IPC: H05K720

CPC classification number: H05K7/20345 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/49179 ,  Y10T29/49181 ,  H01L2924/00

Abstract: Apparatus and systems for cooling heat sinks, integrated circuit boards, and electronic components by providing internal passageways in the heat sinks, circuit boards, and electronic components that connect to a fluid manifold. The internal passageways connect to the surface of the heat sinks, circuit boards and electronic components. A cooling fluid capable of phase change is supplied to the internal passageways to conductively cool the interior of the heat sink, circuit board, and component and to cool the surface of the heat sink, circuit board, and/or component at least partially by evaporative cooling. A plurality of circuit boards, components, and/or heat sinks may be placed back to back with the fluid manifold therebetween. The heat sinks, circuit boards, and/or components are in an enclosed space so that cooling fluid can be contained, condensed and recycled to the fluid manifold.

公开(公告)号：US20020172007A1

公开(公告)日：2002-11-21

申请号：US09860038

申请日：2001-05-16

Inventor： Gregory W. Pautsch

IPC: H05K007/20

CPC classification number: H05K7/20345 ,  H01L23/4735 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  Y10T29/4935 ,  H01L2924/00

Abstract: A system and method for cooling electronic components. A liquid is heated to a temperature near its boiling point and directed against electronic components such that a portion of the heated liquid vaporizes, forming a mixed phase fluid. The mixed phase fluid is drawn away from the electronic components and the vapor is condensed back into a liquid.

Abstract translation: 一种用于冷却电子部件的系统和方法。 将液体加热到接近其沸点的温度并且对准电子部件，使得一部分加热的液体蒸发，形成混合相流体。 将混合相流体从电子部件中抽出，蒸气冷凝回液体。

公开(公告)号：US06457321B1

公开(公告)日：2002-10-01

申请号：US10025650

申请日：2001-12-19

Applicant: Chandrakant D. Patel ,  Cullen Bash

Inventor： Chandrakant D. Patel ,  Cullen Bash

IPC: F25D2312

CPC classification number: H01L23/4735 ,  F25B39/02 ,  F25B39/04 ,  F25B2339/021 ,  H01L2924/0002 ,  H05K7/20345 ,  H01L2924/00

Abstract: A spray cooling system for semiconductor devices. An ink-jet type spray device sprays droplets of a cooling fluid onto the semiconductor devices. The devices vaporize the liquid, which gets passed through a roll bond panel, or other heat exchanger, and is pumped into a spring loaded reservoir that feeds the spray device.

公开(公告)号：US06377453B1

公开(公告)日：2002-04-23

申请号：US09535090

申请日：2000-03-24

Applicant: Christian L Belady

Inventor： Christian L Belady

IPC: H05K714

CPC classification number: H05K9/0007 ,  H05K7/20345 ,  H05K7/2039

Abstract: A self-contained field replaceable module that is adapted for low thermal resistance slideable contact with a heat sink that does not require interface pressure to ensure the contact and that is tolerant of misalignment is presented. The invention includes an interdigitated arrangement of the heat sink and field replaceable module. The field replaceable module includes a lid which forms a sealed cavity around at least one electronic component on the printed circuit board of the field replaceable module. The lid provides spray cooling or conduction cooling to the sealed electronic components. The lid includes a major surface having digit members extending longitudinally therefrom. The heat sink includes a major surface having digit members extending longitudinally therefrom. The digit members of the heat sink and field replaceable module are arranged in interdigitated arrangement for transferring heat from the field replaceable module to the heat sink. The digit members of the field replaceable module are particularly adapted and arranged for slideable contact with the digit members of the heat sink, so as to provide for ease of maintainability and exchangeability of the field replaceable module.

Abstract translation: 提供了一种独立的现场可更换模块，适用于低热阻与散热器的滑动接触，不需要界面压力来确保接触并且容许不对准。 本发明包括散热器和现场可更换模块的交叉排列。 现场可更换模块包括盖，该盖围绕现场可更换模块的印刷电路板上的至少一个电子部件形成密封空腔。 盖子向密封的电子部件提供喷雾冷却或传导冷却。 盖子包括具有从其纵向延伸的数位构件的主表面。 散热器包括具有从其纵向延伸的数位构件的主表面。 散热器和现场可更换模块的数字部件以交错布置布置，用于将热量从现场可更换模块传递到散热器。 现场可更换模块的数字部件特别适用于和布置成可与散热片的数字部件滑动接触，以便于现场可更换模块的易维护性和可更换性。

公开(公告)号：US06349554B2

公开(公告)日：2002-02-26

申请号：US09735415

申请日：2000-12-11

Applicant: Chandrakant D. Patel ,  Cullen E. Bash

Inventor： Chandrakant D. Patel ,  Cullen E. Bash

IPC: F25D2312

CPC classification number: H01L23/4735 ,  F25B39/02 ,  F25B39/04 ,  F25B2339/021 ,  H01L2924/0002 ,  H05K7/20345 ,  H01L2924/00

Abstract: A spray cooling system for semiconductor devices. An ink-jet type spray device sprays droplets of a cooling fluid onto the semiconductor devices. The devices vaporize the liquid, which gets passed through a roll bond panel, or other heat exchanger, and is pumped into a spring loaded reservoir that feeds the spray device.

Abstract translation: 一种用于半导体器件的喷雾冷却系统。 喷墨式喷射装置将冷却流体的液滴喷射到半导体装置上。 这些装置使流过辊接合面板或其他热交换器的液体蒸发，并且被泵入进料喷射装置的弹簧加载的储存器中。

公开(公告)号：US06345665B1

公开(公告)日：2002-02-12

申请号：US09248323

申请日：1999-02-11

Applicant: Jurgen Schulz-Harder

Inventor： Jurgen Schulz-Harder

IPC: H05K720

CPC classification number: H05K7/20345 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The invention pertains to a new type of cooling system for cooling of heat sources, especially for cooling of electric components, with a cooler comprising, on a housing through which a coolant can flow, at least one first cooling surface that can be splashed with the coolant and at least one second cooling surface for flange-mounting of the heat source.

Abstract translation: 本发明涉及用于冷却热源的新型冷却系统，特别是用于冷却电气部件的冷却系统，冷却器包括在冷却剂可以流过的壳体上的至少一个第一冷却表面，该第一冷却表面可以与 冷却剂和用于法兰安装热源的至少一个第二冷却表面。

公开(公告)号：US20010002541A1

公开(公告)日：2001-06-07

申请号：US09735415

申请日：2000-12-11

Inventor： Chandrakant D. Patel ,  Cullen E. Bash

IPC: F25D023/12

CPC classification number: H01L23/4735 ,  F25B39/02 ,  F25B39/04 ,  F25B2339/021 ,  H01L2924/0002 ,  H05K7/20345 ,  H01L2924/00

Abstract: A spray cooling system for semiconductor devices. An ink-jet type spray device sprays droplets of a cooling fluid onto the semiconductor devices. The devices vaporize the liquid, which gets passed through a roll bond panel, or other heat exchanger, and is pumped into a spring loaded reservoir that feeds the spray device.

Abstract translation: 一种用于半导体器件的喷雾冷却系统。 喷墨式喷射装置将冷却流体的液滴喷射到半导体装置上。 这些装置使流过辊接合面板或其他热交换器的液体蒸发，并且被泵入进料喷射装置的弹簧加载的储存器中。

公开(公告)号：US5999404A

公开(公告)日：1999-12-07

申请号：US172443

申请日：1998-10-14

Applicant: Vince P. Hileman

Inventor： Vince P. Hileman

IPC: F25D9/00 ,  F25D7/00 ,  H01L23/473 ,  H05K7/20

CPC classification number: H05K7/20345 ,  H01L23/4735 ,  H01L2924/0002

Abstract: An electronic system that may include an electronic card sub-module that is electrically connected to, and in fluid communication with, an electronic card module. The electronic card module can be mated with a motherboard and coupled to a manifold of a cooling system that provides a cooling fluid to the modules. The cooling fluid can flow directly onto integrated circuits or integrated circuit packages located within the modules. Each module may have an electrical connector and a fluid connector that allows the sub-module to be plugged into the module, and the module to be plugged into the motherboard and manifold without using any tools or hardware.

Abstract translation: 一种电子系统，其可以包括电子卡子模块，该电子卡子模块电连接到电子卡模块并与电子卡模块流体通信。 电子卡模块可以与母板配合并且耦合到向模块提供冷却流体的冷却系统的歧管。 冷却流体可以直接流到位于模块内的集成电路或集成电路封装。 每个模块可以具有电连接器和允许子模块插入模块的流体连接器，并且模块将被插入到主板和歧管中，而不使用任何工具或硬件。