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公开(公告)号：US20200161088A1
公开(公告)日：2020-05-21
申请号：US16631837
申请日：2018-06-28
发明人： Na LI , Dongdong HU , Kaidong XU
IPC分类号： H01J37/305 , H01J37/04 , H01L21/67
摘要： An ion beam etching system includes an etching cavity, an etching electrode, and an electrode displacement apparatus used for enabling the electrode to change a working position in the etching cavity. The electrode displacement apparatus includes a dynamic sealing mechanism, a dynamic electrode balance counterweight mechanism, an electrode displacement transmission mechanism, and an electrode displacement driving mechanism. The etching cavity includes a cavity and a cavity cover connected with the cavity. The cavity is of an irregular shape. The cavity includes a partial cylindrical body, a side plate, a tapered transition portion, and a bottom plate. The partial cylindrical body is laterally sealed by means of the side plate. The bottom plate is connected to an end of the partial cylindrical body by means of the tapered transition portion and seals the end of the partial cylindrical body.
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公开(公告)号：US20200139620A1
公开(公告)日：2020-05-07
申请号：US16179546
申请日：2018-11-02
发明人： Aaron Sauers , Robert Kephart
IPC分类号： B29C64/135 , H01J37/305 , H01J37/06 , H01J37/147 , E01C23/14 , E01C11/00 , B29C64/264 , B33Y10/00
摘要： A method and system for in situ cross-linking of polymers, Bitumen, and other materials to produce arbitrary functional or ornamental three-dimensional features using electron beams provided by mobile accelerators comprises defining a desired pattern for imparting on a target area, mapping the target area, defining at least one discrete voxel in the target area according to the desired pattern to be imparted on the target area, assigning an irradiation value to each of the at least one discrete voxels, and delivering a dose of irradiation to each of the at least one discrete voxels according to the assigned irradiation value.
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公开(公告)号：US10593514B2
公开(公告)日：2020-03-17
申请号：US15574280
申请日：2016-06-07
申请人： NIKON CORPORATION
发明人： Yuichi Shibazaki
IPC分类号： H01J37/30 , H01L21/027 , H01L21/68 , H01L21/687 , H01L21/768 , H01J37/305 , G03F7/20
摘要： An electron beam irradiation apparatus which exposes a wafer coated with an electron beam resist with an electron beam is equipped with: a stage that can be moved holding the wafer; an electron beam optical system that irradiates the wafer with an electron beam; and, an opening member, placed facing the wafer via a predetermined gap on the wafer side in the optical arrangement direction of the electron beam optical system, and having an opening through which the electron beam from the electron beam optical system passes.
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公开(公告)号：US10515777B2
公开(公告)日：2019-12-24
申请号：US14901506
申请日：2014-07-11
发明人： Atsushi Kamino , Hisayuki Takasu , Hirobumi Muto
IPC分类号： H01J37/08 , H01J37/16 , H01J37/18 , H01J37/20 , H01J37/305
摘要： This ion milling device is provided with a vacuum chamber (105), an exhaust device (101) for evacuating the interior of the vacuum chamber, a sample stage (103) for supporting a sample (102) to be irradiated inside the vacuum chamber, a heater (107) for heating the interior of the vacuum chamber, a gas source (106) for introducing into the vacuum chamber a gas serving as a heating medium, and a controller (110) for controlling the gas source, the controller controlling the gas source so that the vacuum chamber internal pressure is in a predetermined state during heating by the heater. This enables the control in a short time of the temperature for suppressing condensation, or the like, occurring at atmospheric release after cooling and ion milling a sample.
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公开(公告)号：US20190326088A1
公开(公告)日：2019-10-24
申请号：US16364654
申请日：2019-03-26
申请人： Comadur S.A.
摘要： A method for structuring a decorative or technical pattern in the thickness of an object made of an at least partially transparent amorphous, semi-crystalline or crystalline material, wherein the object is made of an at least partially transparent material including a top surface and a bottom surface which extends away from the top surface. The top or bottom surfaces is provided with a mask defining an opening whose outline corresponds to the profile of the pattern to be structured, the mask covering the top or bottom surface at the positions which are not to be structured. The pattern is structured with a mono- or multicharged ion beam through the opening of the mask, wherein the mechanical properties of the mask are sufficient to prevent the ions of the ion beam from etching the top or bottom surface at the positions where this top or bottom surface is covered by the mask.
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公开(公告)号：US20190304744A1
公开(公告)日：2019-10-03
申请号：US15984581
申请日：2018-05-21
IPC分类号： H01J37/305
摘要： A method of preparing a sample of a semiconductor device that includes placing a wafer on a support surface, milling an initial lamella within the wafer using a focused ion beam, lifting the initial lamella out of the wafer, placing the initial lamella on an upper surface of the wafer on a lateral side of the initial lamella, milling a planar lamella out of a portion of the initial lamella and the wafer beneath the initial lamella, lifting the planar lamella out of the wafer; and placing the planar lamella on a carbon grid. A method further includes milling a window within an upper portion of the initial lamella exposing internal structures of the initial lamella; and based at least partially on the exposed internal structures of the initial lamella, aligning the initial lamella on the upper surface of the wafer.
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公开(公告)号：US20190287755A1
公开(公告)日：2019-09-19
申请号：US16299632
申请日：2019-03-12
申请人： JEOL Ltd.
发明人： Shogo Kataoka , Toru Kagawa
IPC分类号： H01J37/20 , H01J37/305 , H01J37/26
摘要： There is provided an ion milling apparatus and sample holder permitting one to observe a sample, which has been milled, with an electron microscope without transferring the sample to a different holding member. The ion milling apparatus has an ion source, a sample holder, and a sample stage. The sample holder includes: a holder body having a sample holding portion for holding the sample; and a cover member detachably mounted to the holder body and hermetically sealing the sample held on the sample holding portion. The holder body has a shield plate and a field-correcting plate for correcting electric fields around the sample held on the sample holding portion.
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78.发明申请公开(公告)号：US20190279843A1
公开(公告)日：2019-09-12
申请号：US16294543
申请日：2019-03-06
发明人： Xin MAN , Tatsuya ASAHATA , Makoto SATO
IPC分类号： H01J37/304 , H01J37/244 , H01J37/28 , H01J37/22 , H01J37/305
摘要： An apparatus for processing and observing a cross-section includes: a sample bed holding a sample; a focused ion beam column radiating a focused ion beam to the sample; an electron beam column radiating an electron beam to the sample, perpendicularly to the focused ion beam; an electron detector detecting secondary electrons or reflection electrons generated from the sample; a irradiation position controller controlling irradiation positions of the focused ion beam and the electron beam based on target irradiation position information showing target irradiation positions of beams on the sample; a process controller controlling a cross-section-exposing process that exposes a cross-section of the sample by radiating the focused ion beam to the sample and a cross-section image-obtaining process that obtains a cross-section image of the cross-section by radiating the electron beam to the cross-section; and an image quality corrector correcting image quality of the cross-section image obtained.
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公开(公告)号：US10410829B1
公开(公告)日：2019-09-10
申请号：US15984581
申请日：2018-05-21
IPC分类号： H01J37/305 , H01J37/285 , H01J37/28
摘要： A method of preparing a sample of a semiconductor device that includes placing a wafer on a support surface, milling an initial lamella within the wafer using a focused ion beam, lifting the initial lamella out of the wafer, placing the initial lamella on an upper surface of the wafer on a lateral side of the initial lamella, milling a planar lamella out of a portion of the initial lamella and the wafer beneath the initial lamella, lifting the planar lamella out of the wafer; and placing the planar lamella on a carbon grid. A method further includes milling a window within an upper portion of the initial lamella exposing internal structures of the initial lamella; and based at least partially on the exposed internal structures of the initial lamella, aligning the initial lamella on the upper surface of the wafer.
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公开(公告)号：US20190259575A1
公开(公告)日：2019-08-22
申请号：US16277572
申请日：2019-02-15
发明人： Yanko Sarov , Jan Horn , Ulrich Bihr , Christof Riedesel , Erik Essers
IPC分类号： H01J37/317 , H01J37/24 , H01J37/34 , H01J37/305
摘要： A multi-beam particle beam system includes a multi-aperture plate having a multiplicity of apertures. During operation, one particle beam of the plurality of particle beams passes through each of the apertures. A multiplicity of electrodes are insulated from the second multi-aperture plate to influence the particle beam passing through the aperture. A voltage supply system for the electrodes includes: a signal a generator to generate a serial sequence of digital signals; a D/A converter to convert the digital signals into a sequence of voltages between an output of the D/A converter and the multi-aperture plate; and a controllable changeover system, which feeds the sequence of voltages successively to different electrodes.
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