Interferometric device for position measurement and coordinate measuring machine
    82.
    发明授权
    Interferometric device for position measurement and coordinate measuring machine 有权
    位置测量和坐标测量机的干涉仪

    公开(公告)号:US08351049B2

    公开(公告)日:2013-01-08

    申请号:US12459751

    申请日:2009-07-07

    IPC分类号: G01B11/02

    摘要: An interferometric device for position measurement of an element moveable in a plane is disclosed. A laser light source measures the position of the moveable element and emits the required measuring light. A beam splitter splits the measuring light into a first partial beam path and a second partial beam path, which each impinge on a reflecting surface of the moveable element via an interferometer. Herein, at least the beam splitter, which splits the measuring light into a first partial beam path and a second partial beam path, and the beam splitter, which directs the third partial beam path onto an etalon via an interferometer, have a respective beam trap associated with them, which traps the light returning from the respective interferometers.

    摘要翻译: 公开了一种用于在平面中可移动的元件的位置测量的干涉测量装置。 激光源测量可移动元件的位置并发射所需的测量光。 分束器将测量光分成第一部分光束路径和第二局部光束路径,每个光束路径经由干涉仪撞击可移动元件的反射表面。 这里,至少将测量光分成第一部分光束路径和第二部分光束路径的分束器以及将第三部分光束路径经由干涉仪引导到标准具上的分束器具有相应的光束捕获器 与它们相关联,其捕获从各个干涉仪返回的光。

    Method and apparatus for processing the image data of the surface of a wafer recorded by at least one camera
    83.
    发明授权
    Method and apparatus for processing the image data of the surface of a wafer recorded by at least one camera 有权
    用于处理由至少一个照相机记录的晶片的表面的图像数据的方法和装置

    公开(公告)号:US08264534B2

    公开(公告)日:2012-09-11

    申请号:US12315589

    申请日:2008-12-04

    申请人: Detlef Michelsson

    发明人: Detlef Michelsson

    IPC分类号: H04N7/18

    摘要: A method for processing the image data of the surface of a wafer (2) recorded by at least one camera (5) is disclosed, wherein an image field (15) is defined for each camera (5) in such a way that the recorded image content is repeated after N recorded images. In an evaluation electronics (18) M utility programs (19) are determined, wherein M is equal to the number of recorded images after which the image content is repeated. The number M of utility programs (19) is adapted to the number N of images. Each of the M utility programs (19) of the plurality of recorded images is only fed with images having the same image contents in order to detect defects on the basis of the image contents of the images of the surface of the wafer. The results of the M utility programs (19) are respectively forwarded to a central program (20) in a sequential manner, which compiles a distribution of the defects present on the surface of the wafer (2) from the individual results of the M utility programs (19).

    摘要翻译: 公开了一种用于处理由至少一个相机(5)记录的晶片(2)的表面的图像数据的方法,其中为每个相机(5)定义图像场(15),使得记录 N记录图像后重复图像内容。 在评估电子设备(18)中,确定M个应用程序(19),其中M等于重复图像内容的记录图像的数量。 实用程序(19)的数量M适用于数量N的图像。 为了根据晶片表面的图像的图像内容检测缺陷,多个记录图像中的M个实用程序(19)中的每一个仅供给具有相同图像内容的图像。 M实用程序(19)的结果分别以顺序方式转发到中央程序(20),其从M实用程序的各个结果编译存在于晶片(2)的表面上的缺陷的分布 节目(19)。

    Method for inspecting a surface of a wafer with regions of different detection sensitivity
    84.
    发明授权
    Method for inspecting a surface of a wafer with regions of different detection sensitivity 有权
    用不同检测灵敏度检测晶片表面的方法

    公开(公告)号:US08200004B2

    公开(公告)日:2012-06-12

    申请号:US12316117

    申请日:2008-12-09

    CPC分类号: G01N21/9501 G01N21/9503

    摘要: The invention relates to a method for inspecting a surface of a wafer with regions of different detection sensitivity. For this purpose, an image of the selected surface of the wafer is acquired using a detector. At least one region handled with a different detection sensitivity than the rest of the wafer may be defined on the surface of the wafer by means of an input unit. The detection sensitivity set for the regions is a percentage less than the detection sensitivity for the surface of the wafer without the regions with the different detection sensitivity.

    摘要翻译: 本发明涉及用不同检测灵敏度的区域检查晶片表面的方法。 为此,使用检测器获取晶片的选定表面的图像。 可以通过输入单元在晶片的表面上限定以与晶片的其余部分不同的检测灵敏度处理的至少一个区域。 对于区域设置的检测灵敏度小于具有不同检测灵敏度的区域的晶片表面的检测灵敏度的百分比。

    Method for the optical inspection and visualization of optical measuring values obtained from disk-like objects
    85.
    发明授权

    公开(公告)号:US08200003B2

    公开(公告)日:2012-06-12

    申请号:US12228582

    申请日:2008-08-14

    申请人: Detlef Michelsson

    发明人: Detlef Michelsson

    IPC分类号: G06K9/00

    CPC分类号: G01N21/9501

    摘要: The present invention relates to a method for optically inspecting and visualizing optical measuring values from at least one image of a disk-like object, including the steps of recording said at least one image of said at least one disk-like object, wherein a plurality of optical measuring values are produced from said at least one recorded image; generating a resulting image, wherein an area of the surface of said disk-like object having optical measuring values within a predetermined interval, is associated with a color or brightness value selected from a predetermined range; and varying at least one imaging parameter as a function of the detected and evaluated optical measuring values and/or as a function of a visual inspection of the resulting image by an operator.

    摘要翻译: 本发明涉及一种用于从盘状物体的至少一个图像光学检查和可视化光学测量值的方法,包括记录所述至少一个盘状物体的至少一个图像的步骤,其中多个 从所述至少一个记录图像产生光学测量值; 生成所得到的图像,其中在预定间隔内具有光学测量值的所述盘状物体的表面的区域与从预定范围中选择的颜色或亮度值相关联; 以及根据检测和评估的光学测量值和/或作为操作者对所得到的图像的目视检查的函数来改变至少一个成像参数。

    Apparatus and method for inspecting micro-structured devices on a semiconductor substrate
    86.
    发明授权
    Apparatus and method for inspecting micro-structured devices on a semiconductor substrate 有权
    用于检查半导体衬底上的微结构器件的装置和方法

    公开(公告)号:US08154718B2

    公开(公告)日:2012-04-10

    申请号:US11568949

    申请日:2005-05-23

    IPC分类号: G01N21/00

    摘要: Previously used examination devices and methods mostly operate with reflected visible or UV light to analyze microstructured samples of a wafer (38), for example. The aim of the invention is to increase the possible uses of said devices, i.e. particularly in order to represent structural details, e.g. of wafers that are structured on both sides, which are not visible in VIS or UV because coatings or intermediate materials are not transparent. Said aim is achieved by using IR light as reflected light while creating transillumination (52) which significantly improves contrast in the IR image, among other things, thus allowing the sample to be simultaneously represented in reflected or transmitted IR light and in reflected visible light.

    摘要翻译: 以前使用的检查装置和方法大多以反射的可见光或UV光来操作,以分析例如晶片(38)的微结构样品。 本发明的目的是增加所述装置的可能用途,即特别是为了表示结构细节,例如, 的两面结构的晶片,其在VIS或UV中不可见,因为涂层或中间材料不透明。 所述目的通过使用IR光作为反射光来实现,同时产生透光(52),其显着地改善了IR图像中的对比度,从而允许样品在反射或透射的IR光和反射的可见光中同时被表示。

    Device and method for evaluating defects in the edge area of a wafer and use of the device in inspection system for wafers
    87.
    发明授权
    Device and method for evaluating defects in the edge area of a wafer and use of the device in inspection system for wafers 有权
    用于评估晶片边缘区域中的缺陷并在晶片检查系统中使用该装置的装置和方法

    公开(公告)号:US08089622B2

    公开(公告)日:2012-01-03

    申请号:US12039047

    申请日:2008-02-28

    IPC分类号: G01N21/00 G06K9/62

    CPC分类号: G01N21/9503

    摘要: A device for evaluating defects in the edge area of a wafer (6) is disclosed. The evaluation may also be performed automatically. In particular, the device includes three cameras (25, 26, 27), each provided with an objective (30), wherein a first camera (25) is arranged such that the first camera (25) is opposite to an edge area on the upper surface (6a) of the wafer (6), wherein a second camera (26) is arranged such that the second camera (26) is opposite to a front surface (6b) of the wafer (6), and wherein a third camera (27) is arranged such that the third camera (27) is opposite to an edge area on the lower surface (6c) of the wafer (6).

    摘要翻译: 公开了一种用于评估晶片(6)的边缘区域中的缺陷的装置。 评价也可以自动进行。 特别地,该装置包括三个相机(25,26,27),每个相机设置有物镜(30),其中第一相机(25)布置成使得第一相机(25)与第一相机 晶片(6)的上表面(6a),其中第二相机(26)布置成使得第二相机(26)与晶片(6)的前表面(6b)相对,并且其中第三相机 (27)被布置成使得第三相机(27)与晶片(6)的下表面(6c)上的边缘区域相对。

    Coordinate measuring machine and method for structured illumination of substrates
    88.
    发明授权
    Coordinate measuring machine and method for structured illumination of substrates 有权
    坐标测量机和基板结构照明方法

    公开(公告)号:US07889338B2

    公开(公告)日:2011-02-15

    申请号:US12154826

    申请日:2008-05-27

    申请人: Michael Heiden

    发明人: Michael Heiden

    IPC分类号: G01J4/00

    CPC分类号: G01B11/2513

    摘要: A coordinate measuring machine for the structured illumination of substrates is disclosed. The incident light illumination means and/or the transmitted light illumination means have a pupil access via which at least one optical element is positionable in the optical illumination path. The size and/or type and/or the polarization of the pupil illumination may be manipulated such that the structured illumination of the substrate in the coordinate measuring machine corresponds to the structured illumination of this substrate in the exposure process with a stepper.

    摘要翻译: 公开了一种用于基板结构照明的坐标测量机。 入射光照明装置和/或透射光照明装置具有光瞳通路,至少一个光学元件可通过该光瞳访问在光学照明路径中。 可以操纵瞳孔照明的尺寸和/或类型和/或偏振,使得坐标测量机中的基底的结构照明对应于具有步进器的曝光过程中该基底的结构照明。

    Method for eliminating sources of error in the system correction of a coordinate measuring machine
    89.
    发明授权
    Method for eliminating sources of error in the system correction of a coordinate measuring machine 有权
    一种消除坐标测量机系统校正误差的方法

    公开(公告)号:US07694426B2

    公开(公告)日:2010-04-13

    申请号:US12023230

    申请日:2008-01-31

    IPC分类号: G01B5/004 G01B21/04 G06F19/00

    CPC分类号: G01B11/03 G01B21/045

    摘要: A method is disclosed for eliminating sources of error in the system correction of a coordinate measuring machine. Herein, a number j of reference structures 33 on a rigid reference object 30 are measured in a starting orientation k=0, and the starting coordinates and the reference coordinates of the reference structures 33 on the reference object 30 are determined in a number k≧3 of mutually different orientations.

    摘要翻译: 公开了一种用于消除坐标测量机的系统校正中的误差源的方法。 这里,以起始方向k = 0来测量刚性参考对象30上的参考结构33的数量j,并且确定参考对象30上的参考结构33的起始坐标和参考坐标数k≥ 3相互不同的方向。

    Method for improving the reproducibility of a coordinate measuring apparatus and its accuracy
    90.
    发明授权
    Method for improving the reproducibility of a coordinate measuring apparatus and its accuracy 有权
    提高坐标测量装置再现性及其精度的方法

    公开(公告)号:US07654007B2

    公开(公告)日:2010-02-02

    申请号:US12154785

    申请日:2008-05-27

    IPC分类号: G01B11/03 G01B11/27

    CPC分类号: G01B21/042 G01B11/03

    摘要: A method for improving the reproducibility of a coordinate measuring machine and its accuracy is disclosed. Using at least one measuring field of a camera, a plurality of images of at least one structure on the substrate are recorded. The substrate is placed on a measuring stage traversable in the X coordinate direction and the Y coordinate direction, the position of which is determined during imaging using a displacement measuring system. The measuring field is displaced by the amount of the deviation determined.

    摘要翻译: 公开了一种用于提高坐标测量机的再现性及其精度的方法。 使用相机的至少一个测量场,记录基板上的至少一个结构的多个图像。 将基板放置在可在X坐标方向和Y坐标方向上横穿的测量台上,其位置在使用位移测量系统的成像期间确定。 测量场被偏移确定的偏差量。