摘要:
A nonvolatile memory device includes an active region defined by a device isolation layer in a semiconductor substrate, a word line passing over the active region and a charge storage region defined by a crossing of the active region and the word line and disposed between the active region and the word line. The charge storage region is disposed at an oblique angle with respect to the word line.
摘要:
A method of forming a semiconductor device can include forming a plurality of gate structure patterns including gates and first mask patterns stacked on a semiconductor substrate, the gate structure patterns being spaced apart from each other and extending in a first direction, forming a first interlayer insulating layer covering the gate structure patterns, forming a plurality of second mask patterns extending in a second direction crossing the first direction and spaced apart from each other, and etching the first interlayer insulating layer to form a contact hole, self-aligned to the first and second mask patterns, in at least one contact region defined by a neighboring pair of the first mask patterns and a neighboring pair of the second mask patterns. Related devices are also disclosed.
摘要:
A method for fabricating a nonvolatile memory device comprises providing a substrate, forming an insulating layer and a conductive layer on the substrate, forming an electrical connection path out of a portion of the conductive layer, through which the conductive layer is electrically connected to the substrate, and gate patterning the insulating layer and the conductive layer.
摘要:
Example embodiments are directed to a method of forming a nonvolatile memory structure and a nonvolatile memory structure including a plurality of charge storage patterns, wherein an electrical coupling distance (Lc) between adjacent charge storage patterns is larger than a direct geometric distance (Ls) between adjacent charge storage patterns.
摘要:
The present invention provides a semiconductor device in which the gate is self-aligned to the device isolation film and a fabricating method thereof. A device isolation film restricting an active region is disposed on a portion of a semiconductor substrate, and a word line is across over the device isolation film. A gate pattern is disposed between the word line and the active region, and a tunnel oxide film is disposed between the gate pattern and the active region. The gate pattern comprises a floating gate pattern, a gate interlayer dielectric film pattern and a control gate electrode pattern deposited in the respective order, and has a sidewall self-aligned to the device isolation film. To form the gate pattern having the sidewall self-aligned to the device isolation film, a gate insulation film and a gate material film are formed in the respective order on the semiconductor substrate.
摘要:
A gate-contact structure and a method for forming the same are provided. The structure includes a device isolation layer pattern formed at a semiconductor substrate to define an active region; and a gate electrode and a capping pattern, which are sequentially stacked on the semiconductor substrate across the device isolation layer pattern. The capping pattern includes a first gate contact hole that exposes a top surface of the gate electrode. An interlayer insulation layer pattern including a second gate contact hole is disposed to cover an entire surface of the semiconductor substrate including the gate electrode and the capping pattern. The second gate contact hole penetrates the first gate contact hole to expose the top surface of the gate electrode. A gate contact plug is disposed to be connected to the top surface of the gate electrode through the second gate contact hole. Accordingly, the interlayer insulation layer pattern is intervened between the gate contact plug and a sidewall of the capping pattern.
摘要:
Disclosed is a method for fabricating a NOR flash memory device where a buried common source line made of an impurity diffusion layer has an even surface or a lower step difference. The method includes forming adjacent isolation layers that define an active region there between within a semiconductor substrate. Then, a floating gate pattern is formed overlying the active region. An inter-gate dielectric film and a control gate film are sequentially formed overlying the floating gate pattern. The control gate film, the inter-gate dielectric film, and the floating gate pattern are sequentially patterned, thereby forming a plurality of word lines extending across the active region. The active region between the adjacent isolation layers and the isolation layers are removed, adjacent to one sidewall of the word lines, thereby forming a common source line region. Next, impurities are implanted into the common source line region, thereby forming a common source line made of an impurity diffusion layer.
摘要:
A NOR-type mask ROM includes a semiconductor substrate of a first conductivity type. A plurality of buried diffusion regions of a second conductivity type opposite to the first conductivity type are arranged in parallel on the substrate to serve as sources and drains. A plurality of channel regions are defined between the buried diffusion regions and a plurality of gate insulating layers are formed on the channel regions. A plurality of gate regions are formed in parallel on the gate insulating layers, intersecting the buried diffusion regions, and overlapping with the channel regions, to be provided as word lines. An insulating layer is deposited on the overall surface of the substrate, covering the gate regions, and a plurality of sub-gate regions are formed into spacers on the sidewalls of the insulating layer, in parallel with the gate regions, for increasing a cell current.