公开(公告)号：US07614766B2

公开(公告)日：2009-11-10

申请号：US11476579

申请日：2006-06-29

Applicant: Bily Wang ,  Hui-Chung Lin ,  Shih-Yu Wu

Inventor： Bily Wang ,  Hui-Chung Lin ,  Shih-Yu Wu

IPC: F21V21/26

CPC classification number: F21V21/30 ,  F21V14/02 ,  F21V14/04 ,  F21Y2105/10 ,  F21Y2113/00 ,  F21Y2115/10

Abstract: A modular illumination device with adjustable illumination modules includes a substrate, a rotating element, a reflective element, an adjustable element, and a light-emitting element. The rotating element is rotatably disposed on the substrate and rotates corresponding to the substrate. The reflective element pivots on the rotating element and pivots corresponding to the substrate. The adjustable element is moveably disposed on the substrate and is moved corresponding to the reflective element. The light-emitting element is disposed on the adjustable element. The modular illumination device can be adjusted to shine light at any angle or in any direction. Furthermore, a plurality of illumination modules are combined to form the modular illumination device. By adjusting the lighting range and direction of the illumination modules respectively, the illumination device has different illumination ranges.

Abstract translation: 具有可调节照明模块的模块化照明装置包括基板，旋转元件，反射元件，可调节元件和发光元件。 旋转元件可旋转地设置在基板上并对应于基板旋转。 反射元件在旋转元件上枢转并且对应于基板枢转。 可调节元件可移动地设置在基板上并且相应于反射元件移动。 发光元件设置在可调元件上。 可以调整模块化照明装置，以任何角度或任何方向照射光。 此外，组合多个照明模块以形成模块化照明装置。 通过分别调整照明模块的照明范围和方向，照明装置具有不同的照明范围。

公开(公告)号：US20090224266A1

公开(公告)日：2009-09-10

申请号：US12232930

申请日：2008-09-26

Applicant: Bily Wang ,  Shih-Yu Wu ,  Wen-Kuei Wu

Inventor： Bily Wang ,  Shih-Yu Wu ,  Wen-Kuei Wu

IPC: H01L33/00 ,  H01L21/50

CPC classification number: G02B6/0073 ,  F21K9/00 ,  F21K9/20 ,  F21Y2103/10 ,  F21Y2115/10 ,  G02B6/0068 ,  G02B6/0083 ,  G02F1/133603 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: An LED chip package structure applied to a backlight module includes a substrate unit, a light-emitting unit, a package body unit and an opaque unit. The light-emitting unit has a plurality of LED chips electrically arranged on the substrate unit. The package body unit has a plurality of package bodies respectively covering the LED chips. The opaque unit has a plurality of opaque frame bodies formed on the substrate unit, and two opaque frame bodies are respectively formed on two lateral sides of each package body.

Abstract translation: 应用于背光模块的LED芯片封装结构包括基板单元，发光单元，封装体单元和不透明单元。 发光单元具有电子地布置在基板单元上的多个LED芯片。 封装体单元具有分别覆盖LED芯片的多个封装体。 不透明单元具有形成在基板单元上的多个不透明框架体，并且两个不透明框架体分别形成在每个封装主体的两个侧面上。

公开(公告)号：US07329028B2

公开(公告)日：2008-02-12

申请号：US11471560

申请日：2006-06-21

Applicant: Bily Wang ,  Chih-Ming Wang ,  Kuei-Pao Chen

Inventor： Bily Wang ,  Chih-Ming Wang ,  Kuei-Pao Chen

IPC: F21V33/00

CPC classification number: G02B26/02 ,  G01J1/42 ,  G01J2001/0481 ,  G01J2001/4247 ,  G02B5/005 ,  Y10S362/809

Abstract: A uniform light generating system for adjusting output brightness, including a light-generating unit, a light-transmitting unit, a hollow spheroid unit, a light-sensing unit, and a control unit. The light-generating unit has a light-emitting element for generating light beams and a brightness control element for adjusting the luminous flux of the light beam. The hollow spheroid unit is communicated with the other side of the light-transmitting unit for guiding the light beams into an external casing of the hollow spheroid unit. The light-sensing unit detects electric power values in the external casing. The control unit is electrically connected to the light-generating unit and the light-sensing unit. Thereby a user can obtain a real illumination value via adjusting the illumination values of the light beams that are projected from the hollow spheroid unit.

Abstract translation: 用于调节输出亮度的均匀光产生系统，包括发光单元，发光单元，中空球体单元，光感测单元和控制单元。 光产生单元具有用于产生光束的发光元件和用于调节光束的光通量的亮度控制元件。 空心球体单元与光透射单元的另一侧连通，用于将光束引导到中空球体单元的外壳中。 光检测单元检测外壳中的电功率值。 控制单元电连接到发光单元和光感测单元。 由此，用户可以通过调节从中空球体单元突出的光束的照明值来获得实际照明值。

公开(公告)号：US20080024962A1

公开(公告)日：2008-01-31

申请号：US11878339

申请日：2007-07-24

Applicant: Bily Wang ,  Chun-Tsai Pan

Inventor： Bily Wang ,  Chun-Tsai Pan

IPC: H05K5/02

CPC classification number: H05K5/061 ,  G01S19/35

Abstract: An electronic device shell providing waterproofing and non-screw functions includes a first shell, a second shell, and a waterproof ring. The first shell covers the second shell via the waterproof ring. Via the fixing structure of the fist shell and the second shell, the waterproof ring is pressed tightly against the fist shell and the second shell. Thus, waterproofing and non-screw functions are provided.

Abstract translation: 提供防水和非螺丝功能的电子设备壳体包括第一壳体，第二壳体和防水环。 第一个外壳通过防水环覆盖第二个外壳。 通过第一壳和第二壳的固定结构，防水环紧紧地压靠在拳头壳和第二壳上。 因此，提供防水和非螺丝功能。

公开(公告)号：US20080002017A1

公开(公告)日：2008-01-03

申请号：US11476120

申请日：2006-06-28

Applicant: Bily Wang ,  Hui-Chung Lin

Inventor： Bily Wang ,  Hui-Chung Lin

IPC: B41J2/435

CPC classification number: G09G3/14 ,  G09G2320/0233 ,  G09G2320/0626

Abstract: The present invention relates to an LED driving circuit and a serial LED illumination system. The LED driving circuit compares a data signal with a voltage threshold via a comparator to output a mode selection signal. The register unit includes an instruction register and a data register. The register unit is coupled to the comparator unit and controlled by the mode selection signal to perform an instruction or data transmission mode. The instruction register stores the instruction data under the instruction mode. The data register stores the illumination display data under the data transmission mode. When the data register is full, the register unit outputs a secondary data signal. The driving unit is controlled by the instruction data and drives an LED module according to the illumination display data. The serial LED illumination system includes a controller that is connected with at least one LED driving circuit in serial.

Abstract translation: 本发明涉及LED驱动电路和串联LED照明系统。 LED驱动电路通过比较器将数据信号与电压阈值进行比较，以输出模式选择信号。 寄存器单元包括指令寄存器和数据寄存器。 寄存器单元耦合到比较器单元并由模式选择信号控制，以执行指令或数据传输模式。 指令寄存器将指令数据存储在指令模式下。 数据寄存器将照明显示数据存储在数据传输模式下。 当数据寄存器满时，寄存器单元输出辅助数据信号。 驱动单元由指令数据控制，并根据照明显示数据驱动LED模块。 串联LED照明系统包括与至少一个LED驱动电路串联连接的控制器。

公开(公告)号：US07255463B2

公开(公告)日：2007-08-14

申请号：US11108800

申请日：2005-04-19

Applicant: Bily Wang ,  Jonnie Chuang ,  Chun-Cheng Weng

Inventor： Bily Wang ,  Jonnie Chuang ,  Chun-Cheng Weng

IPC: B60Q1/06

CPC classification number: F21V29/70 ,  F21K9/00 ,  H01L33/64 ,  Y10S362/80

Abstract: A light module includes a lighting unit, a heat-dissipation plate and an insulative plate. The lighting unit has a leading contact. The heat-dissipation plate contacts the lighting module closely and has a channel corresponding to the leading contact. The insulative plate is disposed under the heat-dissipation plate, and has a predetermined conductive pattern arranged thereon and a through hole corresponding to the channel. The leading contact of the lighting unit penetrates through the channel of the heat-dissipation plate and the through hole of the insulative plate to electrically connect with the predetermined conductive pattern of the insulative plate.

Abstract translation: 光模块包括照明单元，散热板和绝缘板。 照明单元有一个领先的接触。 散热板与照明模块紧密接触，并具有与引导触点对应的通道。 绝缘板设置在散热板下方，并且具有布置在其上的预定导电图案和与通道对应的通孔。 照明单元的前导触头穿过绝热板的散热板的通道和通孔，以与绝缘板的预定导电图案电连接。

公开(公告)号：US07154155B2

公开(公告)日：2006-12-26

申请号：US10261062

申请日：2002-11-22

Applicant: Bily Wang ,  Bill Chang

Inventor： Bily Wang ,  Bill Chang

IPC: H01L31/00

CPC classification number: H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12041 ,  H05K3/3426 ,  Y02P70/613 ,  H01L2924/00014

Abstract: A surface mounted LED package includes a pair of metal contact plates, an LED mounted to one (or both) metal contact plates, and glue encapsulating the LED and holding the LED and both metal contact plates together to form a LED package to be soldered to a motherboard. The contact plates have side notches and bottom recesses of various shapes and dimensions, as well as through holes extending through the entire width of the contact plates to facilitate the glue flow for filling out the side notches and bottom recesses for improved solidifying of the LED package. The contact plates have portions uncovered by the glue to provide extended areas for soldering to a motherboard.

Abstract translation: 表面安装的LED封装包括一对金属接触板，安装到一个（或两个）金属接触板的LED，以及胶水封装LED并且将LED和两个金属接触板保持在一起以形成待封装的LED封装 一个主板。 接触板具有各种形状和尺寸的侧凹口和底部凹槽，以及延伸穿过接触板的整个宽度的通孔，以便于粘合流动以填充侧凹口和底部凹槽，以改善LED封装的固化 。 接触板具有由胶水覆盖的部分，以提供用于焊接到母板的延伸区域。

公开(公告)号：US07140753B2

公开(公告)日：2006-11-28

申请号：US10915539

申请日：2004-08-11

Applicant: Bily Wang ,  Jonnie Chuang ,  Heng-Yen Lee

Inventor： Bily Wang ,  Jonnie Chuang ,  Heng-Yen Lee

IPC: F21V29/00

CPC classification number: F21V29/76 ,  F21K9/00 ,  F21V29/74 ,  F21Y2105/10 ,  F21Y2115/10

Abstract: A water-cooling heat dissipation device adopted for a lighting module that includes a plurality of LEDs modulized together, and includes a heat dissipation plate, at least one curved canal recessed inside the heat dissipation plate, at least one inlet formed on one of the sides of the heat dissipation plate selectively, and at least one outlet formed on one of the sides of the heat dissipation plate selectively. The curved canal created as a part of the heat dissipation plate runs laterally and includes at least one bending portion arranged thereon. The inlet and the outlet communicate with the bending portion and a free end of the curved canal in alternative manners, respectively. The lighting module contacts a top of the heat dissipation device directly.

公开(公告)号：US20060258031A1

公开(公告)日：2006-11-16

申请号：US11488764

申请日：2006-07-19

Applicant: Bily Wang ,  Jonnie Chuang ,  Chuan-Fa Lin ,  Chi-Wen Hung

Inventor： Bily Wang ,  Jonnie Chuang ,  Chuan-Fa Lin ,  Chi-Wen Hung

IPC: H01L21/00

CPC classification number: H01L23/544 ,  H01L23/60 ,  H01L24/48 ,  H01L25/167 ,  H01L27/0248 ,  H01L2223/54493 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A wafer-level electro-optical semiconductor manufacture fabrication method improves upon traditional electro-optical semiconductor grain packaging methods. The present invention electrically connects semiconductor grains to the grains on a top surface of a wafer. This is done by either screen-printing or steel board-printing solder or silver paste onto the wafer. After that, the wafer is processed using the following steps: processing the devices, bonding with wire, packaging the wafer and finally cutting the wafer. Using this method raises the production yield while production times and costs are reduced. The wafer-level electro-optical semiconductor fabrication mechanism comprises: a wafer, an electro-optical semiconductor grain and conductive materials.

Abstract translation: 晶圆级电光半导体制造方法改进了传统的电光半导体晶粒封装方法。 本发明将半导体晶粒与晶片的顶表面上的晶粒电连接。 这是通过丝网印刷或钢板印刷焊料或银浆到晶片上完成的。 之后，使用以下步骤处理晶片：处理器件，用导线接合，封装晶片并最终切割晶片。 使用这种方法提高了生产率，同时降低了生产时间和成本。 晶片级电光半导体制造机构包括：晶片，电光半导体晶粒和导电材料。

公开(公告)号：US20060249656A1

公开(公告)日：2006-11-09

申请号：US11416156

申请日：2006-05-03

Applicant: Bily Wang ,  John Lin ,  Shih-Yu Wu

Inventor： Bily Wang ,  John Lin ,  Shih-Yu Wu

IPC: H01L27/00

CPC classification number: H01L31/0203 ,  H01L25/167 ,  H01L2224/48227 ,  H01L2924/01322 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A manufacturing method for a photoelectric package structure having a two-layered substrate and a control chip is proposed. The photoelectric package structure provided in the present invention is easy for installing chips and concentrates light emitted therefrom and prevents external light interference. The package structure of the present invention is superior to the conventional ones and the installation of the control chip doesn t degrade the light-emitting intensity. The major innovation of the present invention is disposing a control chip and a photoelectric chip (or multiple photoelectric chips) on the front surfaces of two semi-finished substrates respectively and then combining with the rear surfaces of the semi-finished substrates to form a substrate. Thus, the present invention is more convenient for installing the chips. In addition, the present invention also disposes an external frame or optical gratings to prevent external light interference.

Abstract translation: 提出了具有双层基板和控制芯片的光电封装结构的制造方法。 本发明提供的光电封装结构容易安装芯片并集中从其发射的光并防止外部光干扰。 本发明的封装结构优于传统的封装结构，并且控制芯片的安装不会降低发光强度。 本发明的主要创新之处在于分别在两个半成品基板的前表面上配置控制芯片和光电芯片（或多个光电芯片），然后与半成品基板的后表面组合形成基板 。 因此，本发明对于安装芯片更为方便。 此外，本发明还配置外部框架或光栅以防止外部光干扰。