Process for manufacturing a top spin valve
    81.
    发明授权
    Process for manufacturing a top spin valve 失效
    制造顶部自旋阀的方法

    公开(公告)号:US07060321B2

    公开(公告)日:2006-06-13

    申请号:US11011994

    申请日:2004-12-14

    IPC分类号: B05D5/12 G11B5/84

    摘要: Currently, the shield-to-shield separation of a spin valve head cannot be below about 800 Å, mainly due to sensor-to-lead shorting problems. This problem has now been overcome by inserting a high permeability, high resistivity, thin film shield on the top or bottom (or both) sides of the spin valve sensor. A permeability greater than about 500 is required together with a resistivity about 5 times greater than that of the free layer and an MrT value for the thin film shield that is 4 times greater than that of the free layer. Five embodiments of the invention are described.

    摘要翻译: 目前,自旋阀头的屏蔽到屏蔽分离不能低于约800,这主要是由于传感器到引线短路问题。 现在已经通过在自旋阀传感器的顶部或底部(或两个)侧上插入高磁导率,高电阻率的薄膜屏蔽来克服这个问题。 需要大于约500的磁导率,其电阻率大约为自由层的电阻率的约5倍,薄膜屏蔽层的电阻值大于自由层的4倍 层。 描述本发明的五个实施例。