公开(公告)号：US07187124B2

公开(公告)日：2007-03-06

申请号：US10781212

申请日：2004-02-17

申请人： Timothy F. Myers ,  John Chen ,  Chien-Hua Chen

发明人： Timothy F. Myers ,  John Chen ,  Chien-Hua Chen

IPC分类号： H01J1/62 ,  H01J63/04

CPC分类号： H01J1/312 ,  B82Y10/00 ,  H01J9/022 ,  H01J31/123

摘要： A photonic assisted emitter including an at least partially transparent electron source layer, a thin metal layer; and a tunneling layer disposed between said at least partially transparent electron source layer and said thin metal layer.

摘要翻译： 一种光子辅助发射器，包括至少部分透明的电子源层，薄金属层; 以及设置在所述至少部分透明的电子源层和所述薄金属层之间的隧道层。

公开(公告)号：US20070023850A1

公开(公告)日：2007-02-01

申请号：US11194036

申请日：2005-07-30

申请人： Chien-Hua Chen ,  Charles Haluzak ,  Tracy Forrest

发明人： Chien-Hua Chen ,  Charles Haluzak ,  Tracy Forrest

IPC分类号： H01L31/00 ,  H01L21/46

CPC分类号： H01L21/187

摘要： A first surface is bonded to a second surface. The first surface and the second surface are plasma treated. Only the first surface is wet treated. The first surface and the second surface are joined together to bond the first surface to the second surface.

摘要翻译： 第一表面结合到第二表面。 第一表面和第二表面是等离子体处理的。 只有第一个表面被湿处理。 第一表面和第二表面连接在一起以将第一表面粘合到第二表面。

公开(公告)号：US20070015353A1

公开(公告)日：2007-01-18

申请号：US11181479

申请日：2005-07-14

申请人： David Craig ,  Chien-Hua Chen

发明人： David Craig ,  Chien-Hua Chen

IPC分类号： H01L21/44

CPC分类号： H01L24/85 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/80 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/48471 ,  H01L2224/48475 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/8518 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01054 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10161 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/4554 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A substrate is electrically connected with an electrical device mounted on the substrate. A ball bond is formed between a first end of a wire and a bonding pad of the substrate. A reverse-motion loop is formed within the wire. A bond is formed between a second end of the wire and a bonding pad of the electrical device.

摘要翻译： 基板与安装在基板上的电气装置电连接。 在导线的第一端和基板的焊盘之间形成球接合。 线内形成反向运动回路。 在电线的第二端和电气装置的接合焊盘之间形成接合。

公开(公告)号：USD526282S1

公开(公告)日：2006-08-08

申请号：US29221826

申请日：2005-01-20

申请人： Chien-Hua Chen

设计人： Chien-Hua Chen

公开(公告)号：US07087134B2

公开(公告)日：2006-08-08

申请号：US10816509

申请日：2004-03-31

申请人： Chien-Hua Chen ,  Charles C. Haluzak

发明人： Chien-Hua Chen ,  Charles C. Haluzak

IPC分类号： B32B37/00

CPC分类号： B81B7/0067 ,  B81C2203/036

摘要： A method of bonding substrates and devices having bonded substrates are disclosed. The method of bonding substrates includes depositing a layer of bonding substrate material onto a bonding surface of a first substrate. A bonding site density of at least one of the layer of bonding substrate material or a bonding surface of a second substrate is increased, and the bonding surface of the first substrate having the layer of bonding substrate material is bonded to the bonding surface of the second substrate.

摘要翻译： 公开了一种接合具有接合基片的基片和器件的方法。 接合基板的方法包括将接合基板材料层沉积到第一基板的接合表面上。 粘接基板材料层或第二基板的接合面中的至少一方的接合位置密度增加，具有接合基板材料层的第一基板的接合面与第二基板材料的接合面接合 基质。

公开(公告)号：US07026189B2

公开(公告)日：2006-04-11

申请号：US10776084

申请日：2004-02-11

申请人： Chien-Hua Chen ,  Bradley C. John ,  Charlotte R. Lanig ,  Melissa A. Workman

发明人： Chien-Hua Chen ,  Bradley C. John ,  Charlotte R. Lanig ,  Melissa A. Workman

IPC分类号： H01L21/44

CPC分类号： B81B7/0077 ,  B81C1/00873 ,  B81C2203/0118

摘要： A method for packaging and singulating a wafer having a plurality of micro devices includes providing a multi-lid substrate having a trench having intersection portions and non-intersection portions formed on a first side of the multi-lid substrate. The multi-lid substrate is coupled to the wafer such that the intersection portions of the trench pattern extend adjacent to at least three micro devices. Portions of the multi-lid substrate between a second side of the multi-lid substrate and the trench pattern are removed while the multi-lid substrate is coupled to the wafer.

摘要翻译： 一种用于封装和分离具有多个微器件的晶片的方法包括提供具有沟槽的多盖基板，所述沟槽具有形成在所述多盖基板的第一侧上的交叉部分和非交叉部分。 多盖基板耦合到晶片，使得沟槽图案的相交部分相邻于至少三个微器件延伸。 在多盖基板与晶片连接的同时，多盖基板的多盖基板的第二面与沟槽图案之间的部分被去除。

公开(公告)号：US06981759B2

公开(公告)日：2006-01-03

申请号：US10135236

申请日：2002-04-30

申请人： Chien-Hua Chen ,  Donald W. Schulte ,  Terry E. McMahon

发明人： Chien-Hua Chen ,  Donald W. Schulte ,  Terry E. McMahon

IPC分类号： B41J2/05

CPC分类号： B41J2/1603 ,  B41J2/14145 ,  B41J2/1607 ,  B41J2/1628 ,  B41J2/1631 ,  B41J2202/15 ,  G11B5/3103 ,  G11B5/313 ,  G11B5/3163

摘要： A method of forming an opening through a substrate having a first side and a second side opposite the first side includes forming spaced etch stops in the first side of the substrate, etching into the substrate from the second side toward the first side to the spaced etch stops, and etching into the substrate between the spaced etch stops from the second side. Etching into the substrate to the spaced etch stops includes forming a first portion of the opening and etching into the substrate between the spaced etch stops includes forming a second portion of the opening.

公开(公告)号：US06979585B2

公开(公告)日：2005-12-27

申请号：US10683909

申请日：2003-10-10

申请人： Eric L. Nikkel ,  Stephen J Potochnik ,  Charles C Haluzak ,  Chien-Hua Chen ,  Mickey Szepesi

发明人： Eric L. Nikkel ,  Stephen J Potochnik ,  Charles C Haluzak ,  Chien-Hua Chen ,  Mickey Szepesi

IPC分类号： B81B7/00 ,  H01L21/00 ,  H01L23/12

CPC分类号： B81C1/00269 ,  B81C2203/0109 ,  B81C2203/019

摘要： A microelectromechanical system (MEMS) device is created by forming mechanical structures supported by a substrate having a bond ring area laterally spaced from the mechanical structures and having a sacrificial layer surrounding the mechanical structures. A bond ring material is formed on top of the sacrificial layer and the bond ring area. Some of the bond ring material is then removed to create a bond ring.

摘要翻译： 微机电系统（MEMS）装置通过形成由衬底支撑的机械结构而形成，该衬底具有与机械结构横向间隔开的结合环区域并且具有围绕机械结构的牺牲层。 在牺牲层和结合环区域的顶部上形成结合环材料。 然后去除一些粘结环材料以形成粘结环。

公开(公告)号：US20050282331A1

公开(公告)日：2005-12-22

申请号：US11211390

申请日：2005-08-25

申请人： Chien-Hua Chen ,  Donald Schulte ,  Terry McMahon

发明人： Chien-Hua Chen ,  Donald Schulte ,  Terry McMahon

IPC分类号： G11B5/31 ,  H01L21/8238

CPC分类号： B41J2/1603 ,  B41J2/14145 ,  B41J2/1607 ,  B41J2/1628 ,  B41J2/1631 ,  B41J2202/15 ,  G11B5/3103 ,  G11B5/313 ,  G11B5/3163

摘要： A method of forming an opening through a substrate having a first side and a second side opposite the first side includes forming spaced etch stops in the first side of the substrate, etching into the substrate from the second side toward the first side to the spaced etch stops, and etching into the substrate between the spaced etch stops from the second side. Etching into the substrate to the spaced etch stops includes forming a first portion of the opening and etching into the substrate between the spaced etch stops includes forming a second portion of the opening.

摘要翻译： 通过具有第一侧和与第一侧相对的第二侧的衬底形成开口的方法包括在衬底的第一侧中形成间隔开的蚀刻停止层，从第二侧朝向第一侧蚀刻到衬底中至间隔蚀刻 停止并在第二侧的间隔的蚀刻停止之间蚀刻到衬底中。 蚀刻到衬底到间隔的蚀刻停止件包括形成开口的第一部分并且在间隔开的蚀刻停止之间蚀刻到衬底中，包括形成开口的第二部分。

公开(公告)号：US20050224155A1

公开(公告)日：2005-10-13

申请号：US10816509

申请日：2004-03-31

申请人： Chien-Hua Chen ,  Charles Haluzak

发明人： Chien-Hua Chen ,  Charles Haluzak

IPC分类号： B81B7/00 ,  B81C1/00 ,  B32B31/16 ,  B01D15/08 ,  H01L21/30

CPC分类号： B81B7/0067 ,  B81C2203/036

摘要： A method of bonding substrates and devices having bonded substrates are disclosed. The method of bonding substrates includes depositing a layer of bonding substrate material onto a bonding surface of a first substrate. A bonding site density of at least one of the layer of bonding substrate material or a bonding surface of a second substrate is increased, and the bonding surface of the first substrate having the layer of bonding substrate material is bonded to the bonding surface of the second substrate.

摘要翻译： 公开了一种接合具有接合基片的基片和器件的方法。 接合基板的方法包括将接合基板材料层沉积到第一基板的接合表面上。 粘接基板材料层或第二基板的接合面中的至少一个的接合位置密度增加，具有接合基板材料层的第一基板的接合面与第二基板材料的接合面接合 基质。