SELF-ALIGNED CONTACTS
    81.
    发明申请
    SELF-ALIGNED CONTACTS 审中-公开
    自对准联系人

    公开(公告)号:US20120299125A1

    公开(公告)日:2012-11-29

    申请号:US13568832

    申请日:2012-08-07

    IPC分类号: H01L29/78

    摘要: A method of forming a gate structure with a self-aligned contact is provided and includes sequentially depositing a sacrificial layer and a secondary layer onto poly-Si disposed at a location of the gate structure, encapsulating the sacrificial layer, the secondary layer and the poly-Si, removing the sacrificial layer through openings formed in the secondary layer and forming silicide within at least the space formally occupied by the sacrificial layer.

    摘要翻译: 提供了一种形成具有自对准接触的栅极结构的方法,并且包括将牺牲层和次级层顺序地沉积到设置在栅极结构的位置处的多晶硅上,封装牺牲层,第二层和聚 -Si,通过形成在次级层中的开口去除牺牲层,并在至少由牺牲层正式占据的空间内形成硅化物。

    Multiple threshold voltages in field effect transistor devices
    84.
    发明授权
    Multiple threshold voltages in field effect transistor devices 失效
    场效应晶体管器件中的多个阈值电压

    公开(公告)号:US08268689B2

    公开(公告)日:2012-09-18

    申请号:US12860979

    申请日:2010-08-23

    IPC分类号: H01L27/088

    摘要: A method for fabricating a field effect transistor device includes forming a first conducting channel and a second conducting channel, forming a first gate stack on the first conducting channel to partially define a first device, forming second gate stack on the second conducting channel to partially define a second device, implanting ions to form a source region and a drain region connected to the first conducting channel and the second conducting channel, forming a masking layer over second device, a portion of the source region and a portion of the drain region, performing a first annealing process operative to change a threshold voltage of the first device, removing a portion of the masking layer to expose the second device, and performing a second annealing process operative to change the threshold voltage of the first device and a threshold voltage of the second device.

    摘要翻译: 一种用于制造场效应晶体管器件的方法包括形成第一导电沟道和第二导电沟道,在第一导电沟道上形成第一栅极叠层以部分地限定第一器件,在第二导电沟道上形成第二栅极堆叠以部分地限定 第二装置,注入离子以形成连接到第一导电沟道和第二导电沟道的源极区域和漏极区域,在第二器件上形成掩模层,源极区域的一部分和漏极区域的一部分,执行 第一退火处理,其可操作以改变第一器件的阈值电压,去除掩模层的一部分以暴露第二器件,以及执行可操作以改变第一器件的阈值电压的第二退火处理和第二器件的阈值电压 第二设备

    Replacement-gate-compatible programmable electrical antifuse
    85.
    发明授权
    Replacement-gate-compatible programmable electrical antifuse 有权
    替换门兼容可编程电气反熔丝

    公开(公告)号:US08237457B2

    公开(公告)日:2012-08-07

    申请号:US12503116

    申请日:2009-07-15

    IPC分类号: G01R27/08 H01L23/52 H01L29/10

    摘要: After planarization of a gate level dielectric layer, a dummy structure is removed to form a recess. A first conductive material layer and an amorphous metal oxide are deposited into the recess area. A second conduct material layer fills the recess. After planarization, an electrical antifuse is formed within the filled recess area, which includes a first conductive material portion, an amorphous metal oxide portion, and a second conductive material portion. To program the electrical antifuse, current is passed between the two terminals in the pair of the conductive contacts to transform the amorphous metal oxide portion into a crystallized metal oxide portion, which has a lower resistance. A sensing circuit determines whether the metal oxide portion is in an amorphous state (high resistance state) or in a crystalline state (low resistance state).

    摘要翻译: 在栅极级介电层平坦化之后,去除虚拟结构以形成凹陷。 第一导电材料层和无定形金属氧化物沉积到凹陷区域中。 第二导电材料层填充凹部。 在平坦化之后,在填充的凹陷区域内形成电反熔丝,其包括第一导电材料部分,非晶金属氧化物部分和第二导电材料部分。 为了编程电反熔丝,电流在一对导电触头中的两个端子之间通过,以将非晶金属氧化物部分转变成具有较低电阻的结晶化金属氧化物部分。 感测电路确定金属氧化物部分是非晶态(高电阻状态)还是结晶态(低电阻状态)。

    ULTRATHIN SPACER FORMATION FOR CARBON-BASED FET
    86.
    发明申请
    ULTRATHIN SPACER FORMATION FOR CARBON-BASED FET 有权
    基于碳的FET的超声波分离器形成

    公开(公告)号:US20120146001A1

    公开(公告)日:2012-06-14

    申请号:US13401967

    申请日:2012-02-22

    IPC分类号: H01L29/78 B82Y99/00

    摘要: A carbon-based field effect transistor (FET) includes a substrate; a carbon layer located on the substrate, the carbon layer comprising a channel region, and source and drain regions located on either side of the channel region; a gate electrode located on the channel region in the carbon layer, the gate electrode comprising a first dielectric layer, a gate metal layer located on the first dielectric layer, and a nitride layer located on the gate metal layer; and a spacer comprising a second dielectric layer located adjacent to the gate electrode, wherein the spacer is not located on the carbon layer.

    摘要翻译: 碳基场效应晶体管(FET)包括基板; 位于所述基板上的碳层,所述碳层包括沟道区,以及位于所述沟道区两侧的源区和漏区; 位于所述碳层中的沟道区上的栅电极,所述栅电极包括第一电介质层,位于所述第一电介质层上的栅极金属层和位于所述栅极金属层上的氮化物层; 以及间隔件,其包括邻近所述栅电极的第二电介质层,其中所述间隔物不位于所述碳层上。

    Ultrathin spacer formation for carbon-based FET
    87.
    发明授权
    Ultrathin spacer formation for carbon-based FET 有权
    碳基FET的超薄间隔物形成

    公开(公告)号:US08193032B2

    公开(公告)日:2012-06-05

    申请号:US12826221

    申请日:2010-06-29

    IPC分类号: H01L21/00

    摘要: A method for formation of a carbon-based field effect transistor (FET) includes depositing a first dielectric layer on a carbon layer located on a substrate; forming a gate electrode on the first dielectric layer; etching an exposed portion of the first dielectric layer to expose a portion of the carbon layer; depositing a second dielectric layer over the gate electrode to form a spacer, wherein the second dielectric layer is deposited by atomic layer deposition (ALD), and wherein the second dielectric layer does not form on the exposed portion of the carbon layer; forming source and drain contacts on the carbon layer and forming a gate contact on the gate electrode to form the carbon-based FET.

    摘要翻译: 一种用于形成碳基场效应晶体管(FET)的方法包括:在位于衬底上的碳层上沉积第一介电层; 在所述第一电介质层上形成栅电极; 蚀刻第一介电层的暴露部分以暴露碳层的一部分; 在所述栅电极上沉积第二电介质层以形成间隔物,其中所述第二电介质层通过原子层沉积(ALD)沉积,并且其中所述第二电介质层不在所述碳层的暴露部分上形成; 在碳层上形成源极和漏极接触,并在栅电极上形成栅极接触以形成碳基FET。

    GRAPHENE SENSOR
    88.
    发明申请
    GRAPHENE SENSOR 审中-公开
    石墨传感器

    公开(公告)号:US20110227043A1

    公开(公告)日:2011-09-22

    申请号:US12727434

    申请日:2010-03-19

    IPC分类号: H01L29/786 H01L21/336

    摘要: A method for forming a sensor includes forming a channel in substrate, forming a sacrificial layer in the channel, forming a sensor having a first dielectric layer disposed on the substrate, a graphene layer disposed on the first dielectric layer, and a second dielectric layer disposed on the graphene layer, a source region, a drain region, and a gate region, wherein the gate region is disposed on the sacrificial layer removing the sacrificial layer from the channel.

    摘要翻译: 一种用于形成传感器的方法,包括在衬底中形成通道,在通道中形成牺牲层,形成具有设置在衬底上的第一介电层的传感器,设置在第一电介质层上的石墨烯层,以及设置在第二电介质层 在石墨烯层上,源区域,漏极区域和栅极区域,其中栅极区域设置在牺牲层上,从沟道去除牺牲层。

    MOSFET ON SILICON-ON-INSULATOR REDX WITH ASYMMETRIC SOURCE-DRAIN CONTACTS
    89.
    发明申请
    MOSFET ON SILICON-ON-INSULATOR REDX WITH ASYMMETRIC SOURCE-DRAIN CONTACTS 有权
    具有非对称源 - 漏联系的硅绝缘子红外线MOSFET

    公开(公告)号:US20110049624A1

    公开(公告)日:2011-03-03

    申请号:US12548005

    申请日:2009-08-26

    IPC分类号: H01L29/786 H01L21/336

    摘要: A semiconductor device is disclosed that includes a silicon-on-insulator substrate including a buried insulator layer and an overlying semiconductor layer. Source extension and drain extension regions are formed in the semiconductor layer. A deep drain region and a deep source region are formed in the semiconductor layer. A first metal-semiconductor alloy contact layer is formed using tilted metal formation at an angle tilted towards the source extension region, such that the source extension region has a metal-semiconductor alloy contact that abuts the substrate from the source side, as a Schottky contact therebetween and the gate shields metal deposition from abutting the deep drain region. A second metal-semiconductor alloy contact is formed located on the first metal-semiconductor layer on each of the source extension region and drain extension region.

    摘要翻译: 公开了一种半导体器件,其包括绝缘体上硅衬底,其包括掩埋绝缘体层和上覆半导体层。 在半导体层中形成源延伸和漏扩展区。 在半导体层中形成深漏极区域和深源极区域。 第一金属 - 半导体合金接触层使用倾斜的金属形成,以朝向源延伸区域倾斜的角度形成,使得源极延伸区域具有金属 - 半导体合金接触件,其从源极侧邻接衬底,作为肖特基接触 并且栅极屏蔽金属沉积物抵靠深漏极区域。 在源极延伸区域和漏极延伸区域中的每一个上,在第一金属 - 半导体层上形成第二金属 - 半导体合金接触。

    INTEGRATION OF PASSIVE DEVICE STRUCTURES WITH METAL GATE LAYERS
    90.
    发明申请
    INTEGRATION OF PASSIVE DEVICE STRUCTURES WITH METAL GATE LAYERS 有权
    被动设备结构与金属盖层的集成

    公开(公告)号:US20110042786A1

    公开(公告)日:2011-02-24

    申请号:US12543544

    申请日:2009-08-19

    IPC分类号: H01L29/86 H01L21/02

    摘要: A passive device structure includes an unpatterned metal gate layer formed in a passive device region of a semiconductor device; an insulator layer formed upon the unpatterned metal gate layer; a semiconductor layer formed upon the insulator layer; and one or more metal contact regions formed in the semiconductor layer; wherein the insulator layer prevents the metal gate layer as serving as a leakage current path for current flowing through a passive device defined by the semiconductor layer and the one or more metal contact regions.

    摘要翻译: 无源器件结构包括形成在半导体器件的无源器件区域中的未图案化的金属栅极层; 形成在未图案化的金属栅极层上的绝缘体层; 形成在所述绝缘体层上的半导体层; 以及形成在所述半导体层中的一个或多个金属接触区域; 其中所述绝缘体层防止所述金属栅极层用作流过由所述半导体层和所述一个或多个金属接触区限定的无源器件的电流的漏电流路径。