Abstract:
A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side. A substantially closed pore, fritless and substantially pure platinum fill is disposed within the via hole forming a platinum filled via electrically conductive between the body fluid side and the device side. A hermetic seal is between the platinum fill and the alumina dielectric substrate, wherein the hermetic seal comprises a tortuous and mutually conformal interface between the alumina dielectric substrate and the platinum fill.
Abstract:
A circuit board for an active implantable medical device (AIMD) has a circuit board land connected to at least one electrical circuit. A hermetic feedthrough terminal pin connector for the AIMD includes an electrical insulator hermetically sealed to an opening of an electrically conductive ferrule. A terminal pin of the feedthrough extends outwardly beyond the insulator. A terminal pin connector has an electrically conductive connector housing that is connected to the circuit board land by an electrical connection material. At least one electrically conductive prong supported by the connector housing contacts and compresses against the feedthrough terminal pin to thereby make a removable electrical connection between the circuit board and the terminal pin. An insulative material loaded with electrically insulative nanoparticles coats at least a portion of the sidewall of the connector housing and the electrical connection material connecting the connector housing to the circuit board land.
Abstract:
A method for manufacturing a singulated feedthrough insulator for a hermetic seal of an active implantable medical device (AIMD) is described. The method begins with forming a green-state ceramic bar with a via hole filled with a conductive paste. The green-state ceramic bar is dried to convert the paste to an electrically conductive material filling via hole and then subjected to a pressing step. Following pressing, a green-state insulator is singulated from the green-state ceramic bar. The singulated green-state insulator in next sintered to form an insulator that is sized and shaped for hermetically sealing to close a ferrule opening. The thusly produced feedthrough is suitable installation in an opening in the housing of an active implantable medical device.
Abstract:
An enhanced RF switchable filtered feedthrough for real-time identification of the electrical and physical integrity of an implanted AIMD lead includes a DOUBLE POLE RF switch disposed on the device side. Additionally, the RF switchable filtered feedthrough can optionally include transient voltage suppressors (TVS) and an MRI mode. In an embodiment, a DOUBLE POLE RF switch selectively disconnects EMI filter capacitors so that an RF test/interrogation signal is sent from the AIMD down into an implanted lead(s). The reflected RF signal is then analyzed to assess implanted lead integrity including lead body anomalies, lead insulation defects, and/or lead conductor defects. The Double Pole switch is configured to be controlled by an AIMD control signal to switch between FIRST and SECOND THROW positions. In the FIRST THROW position a conductive leadwire hermetically sealed to and disposed through an insulator is electrically connected to a filter capacitor, which is then electrically connected to the ferrule of a hermetic feedthrough of an AIMD. In the FIRST THROW position, EMI energy imparted to a body fluid side implanted lead can be diverted to the housing of the AIMD. In the SECOND THROW position the conductive leadwire is electrically connected to an RF source disposed on the device side of the housing of the AIMD. While in the SECOND THROW position, a reflective return signal from the RF source is measured and analyzed to determine if the implanted AIMD lead exhibits any life-threatening performance issues, such as lead body anomalies, lead insulation defects or changes, or even defective, fractured or dislodged lead conductors. In another embodiment, a SINGLE POLE RF switch is configured to disconnect filter capacitors during the delivery of a high-voltage cardioversion shock from an implantable cardioverter defibrillator. Dis-connection of the filter capacitor either reduces or eliminates filter capacitor pulse inrush currents, which allows for the use of standard low-voltage filter capacitors instead of larger and more expensive high-voltage pulse rated filter capacitors. Dis-connection of the filter capacitor also allows for an RF interrogation pulse to be applied to the implanted lead in real-time (for example, pre-set intervals throughout the day).
Abstract:
A miniature electrochemical cell having a volume of less than 0.5 cc includes a casing having a header assembly comprising a ceramic plate formed by co-firing a metallic-containing paste in first and second via holes extending through a green-state ceramic. The ceramic plate is joined to a metal ring by a gold-braze to form the header assembly that is secured to an open-ended metal container by a weld to provide the casing. The fill material resulting from sintering the metallic-containing paste provides a first conductive pathway to the anode current collector contacting an anode active material and a second conductive pathway to a cathode current collector contacting a cathode active material. A solid electrolyte activates the anode and cathode while also serving as a separator. Outer surfaces of the first and second conductive pathways are configured for electrical connection to a load.
Abstract:
A miniature electrochemical cell having a total volume that is less than 0.5 cc is described. The casing enclosure consists of a lower plate supporting a cylindrically-shaped can having an open upper end closed with a cover. The can is selectively coated with a dielectric material to provide electrical isolation of the to-be-housed active materials from the can sidewall. A glass-to-metal seal electrically isolates the lower plate from the can. An electrode assembly comprising a sandwich of cathode active material/separator/anode active material is housed in the casing. That way, the lower plate contacting the cathode active material is the positive terminal and the closing cover connected to the can and contacted to the anode active material serves as the negative cell terminal. An electrolyte filled into the casing activates the electrode assembly and the fill opening is sealed with a plug. The cell can be of either a primary or a secondary chemistry.
Abstract:
A filter feedthrough for an AIMD includes ferrule with an insulator hermetically sealing a ferrule opening, both cooperatively separating a body fluid side from a device side. A first conductive pathway is hermetically sealed to and disposed through the insulator. A feedthrough capacitor is disposed on the device side and includes at least one active electrode plate disposed parallel and spaced from at least one ground electrode plate within a capacitor dielectric. A capacitor active metallization is electrically connected to the active electrode plate and is in non-electrically conductive relation with the ground electrode plate. A capacitor ground metallization is electrically connected to the ground electrode plate and is in non-electrically conductive relation with the active electrode plate. An anisotropic conductive layer is disposed on the device side. The anisotropic conductive layer electrically connects the capacitor active metallization to the first conductive pathway.
Abstract:
A method for making a dielectric substrate configured for incorporation into a hermetically sealed feedthrough is described. The method includes forming a via hole through a green-state dielectric substrate. A platinum-containing paste is filled into at least 90% of the volume of the via hole. The green-state dielectric substrate is then subjected to a heating protocol including: a binder bake-out heating portion performed at a temperature ranging from about 400° C. to about 700° C. for a minimum of 4 hours; a sintering heating portion performed at a temperature ranging from about 1,400° C. to about 1,900° C. for up to 6 hours; and a cool down portion at a rate of up to 5°/minute from a maximum sintering temperature down to about 1,000° C., then naturally to room temperature. The thusly manufacture dielectric substrate is then positioned in an opening in a ferrule that is configured to be attached to a metal housing of an active implantable medical device. The dielectric substrate is hermetically sealed to the ferrule with the sintered platinum material in the via hole providing a conductive pathway from a body fluid side to a device side of the ferrule.
Abstract:
A miniature electrochemical cell having a total volume that is less than 0.5 cc is described. The cell casing is formed by joining two ceramic casing halves together. One or both casing halves are machined from ceramic to provide a recess that is sized and shaped to contain the electrode assembly. The opposite polarity terminals are electrically conductive feedthroughs or pathways, such as of gold, and are formed by brazing gold into tapered via holes machined into one or both ceramic casing halves. The two ceramic casing halves are separated from each other by a metal interlayer, such as of gold, bonded to a thin film metallization layer, such as of titanium, that contacts an edge periphery of each ceramic casing half. A solid electrolyte of LiPON (LixPOyNz) is used to activate the electrode assembly.
Abstract:
A hermetically sealed filtered feedthrough assembly attachable to an AIMD includes an insulator hermetically sealing a ferrule opening of an electrically conductive ferrule with a gold braze. A co-fired and electrically conductive sintered paste is disposed within and hermetically seals at least one via hole extending in the insulator. At least one capacitor is disposed on the device side. An active electrical connection electrically connects a capacitor active metallization and the sintered paste. A ground electrical connection electrically connects the gold braze to a capacitor ground metallization, wherein at least a portion of the ground electrical connection physically contacts the gold braze. The dielectric of the capacitor may be less than 1000 k. The ferrule may include an integrally formed peninsula portion extending into the ferrule opening spatially aligned with a ground passageway and metallization of an internally grounded feedthrough capacitor. The sintered paste may be of substantially pure platinum.