摘要:
A method and apparatus for providing a temporary utility zone in a disk drive. A disk surface has a write head associated therewith. The write head is used to write spiral servo information and a propagation state indicator onto the disk surface. The spiral servo information and propagation state indicator are used to perform a self-servo write operation on the disk surface.
摘要:
A method for determining embedded runout correction (ERC) values using iteration and variable gain in a disk drive. A disk has a track written thereon, an ERC value is determined for a servo sector on the track using variable gain, and the variable gain decreases based on the number of revolutions of the disk.
摘要:
A method of fabricating a memory device having a core region of double-bit memory cells and a periphery region of logic circuitry includes forming a dielectric stack over the core and periphery areas of a semiconductor substrate and removing the dielectric stack from the periphery region. A gate dielectric is formed over the periphery area, followed by a first conductive layer over the core and periphery areas. After the formation and thermal processing of the gate dielectric, bitlines, which serve as source and drain regions, are implanted into the core area. Formation of the bitlines after the gate dielectric layer reduces lateral bitline diffusion and reduces short channel effects.
摘要:
A method and apparatus for compensating for non-linearities due to pivot bearing friction when determining embedded runout correction values during partial self-servo write of a disk drive is disclosed. In one embodiment, the disk drive includes a disk surface having a track written thereon and the track has some written-in runout. The written-in runout that is associated with high-frequencies is determined using a first technique. The written-in runout for the track that is associated with low frequencies is determined using a second technique. Results from the two techniques are combined in order to determine embedded runout correction values for the track when partial self-servo writing, in order to reduce error propagation when writing additional tracks.
摘要:
Compensation for disk mode disturbances during self-writing of servo data is provided in a manner that accounts for differences in orientation between the disk surface from which position information is derived and the disk surface on which servo data is written. Microactuators corresponding to upper surfaces of disks may have a wiring polarity that is out of phase with the wiring polarity of microactuators corresponding to upper surfaces of disks so that disk mode compensation signals supplied to the microactuators produce motion in opposite directions. The servo control system may supply signals to microactuators individually and select the polarities of those signals to account for differences in orientation between the disk surface from which position information is derived and the disk surface on which servo data is written.
摘要:
A disk drive includes a data storage disk, a transducer, a micro actuator, a coarse actuator, and a controller. The micro actuator is configured to position the transducer relative to the disk over a first range of movement. The coarse actuator is configured to position the micro actuator relative to the disk over a second range of movement that is larger than the first range of movement. The controller is configured to control positioning of the transducer by the coarse actuator and the micro actuator in a track following operation, and in a seek operation responsive to a seek command. The controller is also configured to calibrate its positioning of the transducer by the micro actuator responsive to receipt of the seek command and prior to seeking the transducer from an initial track to a target track.
摘要:
Methods and arrangements are provided for significantly reducing electron trapping in semiconductor devices having a polysilicon feature and an overlying dielectric layer. The methods and arrangements employ a nitrogen-rich region within the polysilicon feature near the interface to the overlying dielectric layer. The methods include selectively implanting nitrogen ions through at least a portion of the overlying dielectric layer and into the polysilicon feature to form an initial nitrogen concentration profile within the polysilicon feature. Next, the temperature within the polysilicon feature is raised to an adequately high temperature, for example using rapid thermal anneal (RTA) techniques, which cause the initial nitrogen concentration profile to change due to the migration of the majority of the nitrogen towards either the interface with the overlying dielectric layer or the interface with an underlying layer. Consequently, the polysilicon feature has a first nitrogen-rich region near the interface to the overlying dielectric layer and a second nitrogen-rich region near the interface to the underlying layer. The migration of nitrogen further forms a contiguous reduced-nitrogen region located between the first nitrogen-rich region and the second nitrogen-rich region. The contiguous reduced-nitrogen region has a lower concentration of nitrogen than does the first nitrogen-rich region and the second nitrogen-rich region. The first nitrogen-rich region has been found to reduce electron trapping within the polysilicon feature. Thus, for example, in a non-volatile memory device wherein the polysilicon feature is a floating gate, false programming of the memory device can be significantly avoided by reducing the number of trapped electrons in the floating gate.
摘要:
According to one exemplary embodiment, a floating gate memory cell comprises a stacked gate structure situated on a substrate and situated over a channel region in the substrate. The floating gate memory cell further comprises a recess formed in the substrate adjacent to the stacked gate structure, where the recess has a sidewall, a bottom, and a depth. According to this exemplary embodiment, the floating gate memory cell further comprises a source situated adjacent to the sidewall of the recess and under the stacked gate structure. The floating gate memory cell further comprises a Vss connection region situated under the bottom of the recess and under the source, where the Vss connection region is connected to the source. The Vss connection region being situated under the bottom of the recess causes the source to have a reduced lateral diffusion in the channel region.
摘要:
A method and system for providing a semiconductor device are described. The semiconductor device includes a substrate, a core and a periphery. The core includes a plurality of core gate stacks having a first plurality of edges, while the periphery a plurality of periphery gate stacks having a second plurality of edges. The method and system include providing a plurality of core spacers, a plurality of periphery spacers, a plurality of core sources and a plurality of conductive regions. The core spacers reside at the first plurality of edges and have a thickness. The periphery spacers reside at the second plurality of edges and have a second thickness greater than the first thickness. The core sources reside between the plurality of core gate stacks. The conductive regions are on the plurality of core sources. This method allows different thicknesses of the spacers to be formed in the core and the periphery so that the spacers can be tailored to the different requirements of the core and periphery.
摘要:
A method for forming a semiconductor device that includes a line and space pattern with variable pitch and critical dimensions in a layer on a substrate. The substrate includes a first region (e.g., a core region) and a second region (e.g., a periphery region). A first sub-line and space pattern in the first region comprises a space of a dimension (A) less than achievable by lithographic processes alone. Further, a second sub-line and space pattern in the second region comprises at least one line including a second critical dimension (B) achievable by lithography. The method uses two critical masking steps to form a hard mask that includes in the core region a critical dimension (A) less than achievable at a resolution limit of lithography. Further, the method uses a single etch step to transfer the pattern of the hard mask to the layer.