摘要:
The present invention relates to a method for treating liver cancer or oral cancer through photodynamic therapy, comprising administrating a subject in need thereof an effective amount of formula I, formula □, formula III or formula IV, which could release reactive oxygen species to inhibit the growth of cancer cells, which comprise with formulas as described in the specification, wherein R1 is an alkyl or an aldehyde with carbon atoms no more than 2; the cancer is liver cancer or oral cancer.
摘要:
Within a local oxidation of silicon (LOCOS) method for forming a silicon oxide isolation region, there is first amorphized areally completely at least a surface sub-layer portion of a silicon layer within an isolation region location within the silicon layer defined by an oxidation mask layer formed over the silicon layer, to form an amorphized silicon region within the isolation region location. Thus, when thermally oxidizing the silicon layer having formed thereover the oxidation mask layer to form at least in part from the amorphized silicon region a silicon oxide isolation region, the silicon oxide isolation region is formed with an attenuated bird's beak extension.
摘要:
A measuring system and method of detecting an object distance by transmission media with different wave velocities are described. The measuring system has a computer, a primary detector and a secondary detector. The primary detector is connected to the computer through bus communication and the secondary detector connected to the primary one through two different transmission media. The primary detector is able to receive separately a first signal and a second signal emitted simultaneously from the secondary detector through the transmission media. Moreover, the first signal has light-speed and the second signal has sound-speed. To calculate the distance between the objects which the primary and the secondary detector are attached respectively. The delay time of second signal and the wave velocity of the supersonic media are multiplied.
摘要:
A method for fabricating an integrated device is disclosed. A polysilicon gate electrode layer is provided on a substrate. In an embodiment, a treatment is provided on the polysilicon gate electrode layer to introduce species in the gate electrode layer and form an electrically neutralized portion therein. Then, a hard mask layer with limited thickness is applied on the treated polysilicon gate electrode layer. A tilt angle ion implantation is thus performing on the substrate after patterning the hard mask layer and the treated polysilicon gate electrode to from a gate structure.
摘要:
Provided is a method of removing a nitride material from a semiconductor wafer. The method includes monitoring a silicon concentration level in a chemical solution. The chemical solution may include a phosphoric acid. The method includes adjusting the silicon concentration level in response to the monitoring. The method includes heating the chemical solution. The method includes applying the heated chemical solution to a wafer surface in a manner so that a temperature of the heated chemical solution is within a predefined temperature range throughout the wafer surface. The method includes etching a nitride material of the wafer using the heated chemical solution.
摘要:
A semiconductor furnace suitable for chemical vapor deposition processing of wafers. The furnace includes a thermal reaction chamber having a top, a bottom, a sidewall, and an internal cavity for removably holding a batch of vertically stacked wafers. A heating system is provided that includes a plurality of heaters arranged and operative to heat the chamber. The heating system includes at least one top heater; at least one bottom heater, and a plurality of sidewall heaters spaced along the height of the reaction chamber to control temperature variations within in the chamber and promote uniform film deposit thickness on the wafers.
摘要:
A method for fabricating a nitrided oxide layer. A plasma reactor including a pedestal for supporting a substrate is provided. A substrate having an oxide layer thereon is placed on the pedestal. Nitridation of the oxide layer is performed by exposing the substrate to decoupled nitrogen plasma, wherein a positive bias is applied to the pedestal during the nitridation to reduce a potential drop between the plasma and the substrate surface.
摘要:
An apparatus includes a process chamber configured to perform an ion implantation process. A cooling platen or electrostatic chuck is provided within the process chamber. The cooling platen or electrostatic chuck is configured to support a semiconductor wafer. The cooling platen or electrostatic chuck has a plurality of temperature zones. Each temperature zone includes at least one fluid conduit within or adjacent to the cooling platen or electrostatic chuck. At least two coolant sources are provided, each fluidly coupled to a respective one of the fluid conduits and configured to supply a respectively different coolant to a respective one of the plurality of temperature zones during the ion implantation process. The coolant sources include respectively different chilling or refrigeration units.
摘要:
A process of cleaning a semiconductor device fabrication equipment is provided. In one embodiment, the semiconductor device fabrication equipment is placed in a chamber; a fluid is introduced into the chamber; a pressure and temperature of the fluid is controlled to bring the fluid to a supercritical state; the semiconductor device fabrication equipment is cleaned by having the supercritical fluid contact the semiconductor device fabrication equipment; the supercritical fluid is removed from the chamber; and the semiconductor device fabrication equipment is removed from the chamber.
摘要:
A high voltage transformer for controlling inductance leakage used for a multiple lamp driving system includes at least one wire frame, a first winding, a second winding, a first magnetic unit, and a second magnetic unit. There is a receiving space in the wire frame for receiving the first magnetic unit, and a first region and a second region is formed on its surface. The first winding and the second winding are individually wound at the first region and the second region. The second magnetic unit is covered on the side of the wire frame. On an appropriate location of the bottom of the second magnetic unit, a transverse beam extends. Thereby, the transverse beam fully separates the low voltage magnetic flux path produced on the first magnetic unit by the first winding and the second winding and the high voltage magnetic flux path produced by the AC.