HEAT PUMP CYCLE
    81.
    发明申请
    HEAT PUMP CYCLE 失效
    热泵循环

    公开(公告)号:US20120266624A1

    公开(公告)日:2012-10-25

    申请号:US13450800

    申请日:2012-04-19

    IPC分类号: F25B13/00 F25B1/00

    摘要: A heat pump cycle includes a compressor having a suction port and a discharge port, a heating heat exchanger which heats air, a gas-liquid separator, and a cooling heat exchanger which cools air upstream of the heating heat exchanger in an air flow direction. The heat pump cycle further includes an intermediate pressure passage which guides gas refrigerant from the gas-liquid separator to the suction port. A variable open-close portion opens the intermediate pressure passage and decompresses the gas refrigerant in the intermediate pressure passage, so that the gas refrigerant is introduced into the suction port when a bypass dehumidifying-heating mode is selected as a dehumidifying-heating mode in which the air having been heated in the heating heat exchanger becomes equal to or higher than air in an air-conditioning target space in temperature.

    摘要翻译: 热泵循环包括具有吸入口和排出口的压缩机,加热空气的加热热交换器,气液分离器和在空气流动方向上冷却加热热交换器上游的空气的冷却热交换器。 热泵循环还包括将气体制冷剂从气 - 液分离器引导到吸入口的中间压力通道。 可变的开闭部分打开中间压力通道并对中间压力通道中的气体制冷剂进行减压,使得当选择旁路除湿加热模式作为除湿加热模式时,气体制冷剂被引入吸入口,其中 在加热热交换器中被加热的空气在空调目标温度的空间中变得等于或高于空气。

    SEMICONDUCTOR MEMORY DEVICE
    82.
    发明申请
    SEMICONDUCTOR MEMORY DEVICE 有权
    半导体存储器件

    公开(公告)号:US20110220876A1

    公开(公告)日:2011-09-15

    申请号:US12881593

    申请日:2010-09-14

    IPC分类号: H01L29/88 B82Y99/00

    摘要: According to an embodiment, a semiconductor memory device capable of stably operating even when an element is shrunk is provided. The semiconductor memory device of the embodiment includes: first and second diodes serially connected between power sources of two different potentials, formed by nanowires, and exhibiting negative differential resistances; and a select transistor connected between the first diode and the second diode. The nanowires are preferably silicon nanowires. The thickness of the silicon nanowires is preferably 8 nm or less.

    摘要翻译: 根据一个实施例,提供即使当元件收缩时也能够稳定地操作的半导体存储器件。 该实施例的半导体存储器件包括:串联连接在两个不同电位的电源之间的由纳米线形成并呈现负的差分电阻的第一和第二二极管; 以及连接在第一二极管和第二二极管之间的选择晶体管。 纳米线优选为硅纳米线。 硅纳米线的厚度优选为8nm以下。

    Flat panel speaker system with a coated diaphragm
    83.
    发明授权
    Flat panel speaker system with a coated diaphragm 失效
    平板扬声器系统带有涂层隔膜

    公开(公告)号:US07460679B2

    公开(公告)日:2008-12-02

    申请号:US10534272

    申请日:2004-10-01

    IPC分类号: H04R25/00 H04R1/00

    摘要: A speaker system having a structure in which the room surrounding the first diaphragm and the room adjacent to the second diaphragm are acoustically coupled. The second diaphragm has coating on a surface. Applying the coating to the second diaphragm enhances the reliability and performance of the speaker system. Besides, the diversely definable geometry of the diaphragm allows an electronic device employing the speaker system or the speaker module to have flexibility in design.

    摘要翻译: 具有这样的结构的扬声器系统,其中围绕第一隔膜的房间和与第二隔膜相邻的房间是声耦合的。 第二个隔膜在表面上有涂层。 将涂层施加到第二隔膜增强了扬声器系统的可靠性和性能。 此外,隔膜的不同定义的几何形状允许使用扬声器系统或扬声器模块的电子设备具有设计灵活性。

    Speaker, speaker module and electronic apparatus using this
    86.
    发明申请
    Speaker, speaker module and electronic apparatus using this 失效
    扬声器,扬声器模块和电子设备

    公开(公告)号:US20060042870A1

    公开(公告)日:2006-03-02

    申请号:US10534272

    申请日:2004-10-01

    IPC分类号: H05K5/00 H04R7/00

    摘要: A speaker system having a structure in which the room surrounding the first diaphragm and the room adjacent to the second diaphragm are acoustically coupled. The second diaphragm has coating on a surface. Applying the coating to the second diaphragm enhances the reliability and performance of the speaker system. Besides, the diversely definable geometry of the diaphragm allows an electronic device employing the speaker system or the speaker module to have flexibility in design.

    摘要翻译: 具有这样的结构的扬声器系统,其中围绕第一隔膜的房间和与第二隔膜相邻的房间是声耦合的。 第二个隔膜在表面上有涂层。 将涂层施加到第二隔膜增强了扬声器系统的可靠性和性能。 此外,隔膜的多种可定义的几何形状允许使用扬声器系统或扬声器模块的电子设备具有设计灵活性。