公开(公告)号：US11699621B2

公开(公告)日：2023-07-11

申请号：US17521374

申请日：2021-11-08

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Kun-Yu Lee ,  Huicheng Chang ,  Che-Hao Chang ,  Ching-Hwanq Su ,  Weng Chang ,  Xiong-Fei Yu

IPC: H01L21/8238 ,  H01L27/092 ,  H01L29/66 ,  H01L29/78 ,  H01L21/28 ,  H01L21/02 ,  H01L21/311 ,  H01L21/3115

CPC classification number: H01L21/823857 ,  H01L21/823821 ,  H01L27/0924 ,  H01L21/0228 ,  H01L21/02178 ,  H01L21/02192 ,  H01L21/28185 ,  H01L21/3115 ,  H01L21/31111

Abstract: Embodiments described herein relate to a method for patterning a doping layer, such as a lanthanum containing layer, used to dope a high-k dielectric layer in a gate stack of a FinFET device for threshold voltage tuning. A blocking layer may be formed between the doping layer and a hard mask layer used to pattern the doping layer. In an embodiment, the blocking layer may include or be aluminum oxide (AlOx). The blocking layer can prevent elements from the hard mask layer from diffusing into the doping layer, and thus, can improve reliability of the devices formed. The blocking layer can also improve a patterning process by reducing patterning induced defects.

公开(公告)号：US20230069421A1

公开(公告)日：2023-03-02

申请号：US17461139

申请日：2021-08-30

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hsin-Yi Lee ,  Weng Chang ,  Chi On Chui

IPC: H01L29/40 ,  H01L29/66 ,  H01L21/3115 ,  H01L27/092 ,  H01L21/8238

Abstract: Semiconductor devices and methods of manufacturing the semiconductor devices are disclosed herein. The methods include forming nanostructures in a multilayer stack of semiconductor materials. An interlayer dielectric is formed surrounding the nanostructures and a gate dielectric is formed surrounding the interlayer dielectric. A first work function layer is formed over the gate dielectric. Once the first work function layer has been formed, an annealing process is performed on the resulting structure and oxygen is diffused from the gate dielectric into the interlayer dielectric. After performing the annealing process, a second work function layer is formed adjacent the first work function layer. A gate electrode stack of a nano-FET device is formed over the nanostructures by depositing a conductive fill material over the second work function layer.

公开(公告)号：US20220238687A1

公开(公告)日：2022-07-28

申请号：US17220076

申请日：2021-04-01

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hsin-Yi Lee ,  Weng Chang ,  Chi On Chui

IPC: H01L29/49 ,  H01L27/092 ,  H01L29/06 ,  H01L29/423 ,  H01L29/786 ,  H01L21/02 ,  H01L21/28 ,  H01L21/8238 ,  H01L29/66

Abstract: In an embodiment, a device includes: a p-type transistor including: a first channel region; a first gate dielectric layer on the first channel region; a tungsten-containing work function tuning layer on the first gate dielectric layer; and a first fill layer on the tungsten-containing work function tuning layer; and an n-type transistor including: a second channel region; a second gate dielectric layer on the second channel region; a tungsten-free work function tuning layer on the second gate dielectric layer; and a second fill layer on the tungsten-free work function tuning layer.

公开(公告)号：US20220223594A1

公开(公告)日：2022-07-14

申请号：US17182733

申请日：2021-02-23

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hsin-Yi Lee ,  Weng Chang ,  Chi On Chui

IPC: H01L27/092 ,  H01L29/06 ,  H01L29/66 ,  H01L29/78 ,  H01L21/02

Abstract: In an embodiment, a device includes: a channel region; a gate dielectric layer on the channel region; a first work function tuning layer on the gate dielectric layer, the first work function tuning layer including a n-type work function metal; a barrier layer on the first work function tuning layer; a second work function tuning layer on the barrier layer, the second work function tuning layer including a p-type work function metal, the p-type work function metal different from the n-type work function metal; and a fill layer on the second work function tuning layer.

公开(公告)号：US20220140101A1

公开(公告)日：2022-05-05

申请号：US17577169

申请日：2022-01-17

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hsin-Yi Lee ,  Weng Chang ,  Chi On Chui

IPC: H01L29/49 ,  H01L29/06 ,  H01L29/423 ,  H01L29/66 ,  H01L21/02 ,  H01L21/28 ,  H01L29/786

Abstract: A semiconductor device includes a fin protruding above a substrate; source/drain regions over the fin; nanosheets between the source/drain regions; and a gate structure over the fin and between the source/drain regions. The gate structure includes: a gate dielectric material around each of the nanosheets; a first liner material around the gate dielectric material; a work function material around the first liner material; a second liner material around the work function material; and a gate electrode material around at least portions of the second liner material.

公开(公告)号：US20220059412A1

公开(公告)日：2022-02-24

申请号：US17521374

申请日：2021-11-08

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Kun-Yu Lee ,  Huicheng Chang ,  Che-Hao Chang ,  Ching-Hwanq Su ,  Weng Chang ,  Xiong-Fei Yu

IPC: H01L21/8238 ,  H01L27/092

Abstract: Embodiments described herein relate to a method for patterning a doping layer, such as a lanthanum containing layer, used to dope a high-k dielectric layer in a gate stack of a FinFET device for threshold voltage tuning. A blocking layer may be formed between the doping layer and a hard mask layer used to pattern the doping layer. In an embodiment, the blocking layer may include or be aluminum oxide (AlOx). The blocking layer can prevent elements from the hard mask layer from diffusing into the doping layer, and thus, can improve reliability of the devices formed. The blocking layer can also improve a patterning process by reducing patterning induced defects.

公开(公告)号：US20210399102A1

公开(公告)日：2021-12-23

申请号：US16909260

申请日：2020-06-23

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hsin-Yi Lee ,  Cheng-Lung Hung ,  Weng Chang ,  Chi On Chui

IPC: H01L29/417 ,  H01L29/78 ,  H01L29/66 ,  H01L21/8234

Abstract: Methods for tuning effective work functions of gate electrodes in semiconductor devices and semiconductor devices formed by the same are disclosed. In an embodiment, a semiconductor device includes a channel region over a semiconductor substrate; a gate dielectric layer over the channel region; and a gate electrode over the gate dielectric layer, the gate electrode including a first work function metal layer over the gate dielectric layer, the first work function metal layer including aluminum (Al); a first work function tuning layer over the first work function metal layer, the first work function tuning layer including aluminum tungsten (AlW); and a fill material over the first work function tuning layer.

公开(公告)号：US11171061B2

公开(公告)日：2021-11-09

申请号：US16569820

申请日：2019-09-13

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Kun-Yu Lee ,  Huicheng Chang ,  Che-Hao Chang ,  Ching-Hwanq Su ,  Weng Chang ,  Xiong-Fei Yu

IPC: H01L21/8238 ,  H01L27/092 ,  H01L29/66 ,  H01L29/78 ,  H01L21/28 ,  H01L21/02 ,  H01L21/311 ,  H01L21/3115

Abstract: Embodiments described herein relate to a method for patterning a doping layer, such as a lanthanum containing layer, used to dope a high-k dielectric layer in a gate stack of a FinFET device for threshold voltage tuning. A blocking layer may be formed between the doping layer and a hard mask layer used to pattern the doping layer. In an embodiment, the blocking layer may include or be aluminum oxide (AlOx). The blocking layer can prevent elements from the hard mask layer from diffusing into the doping layer, and thus, can improve reliability of the devices formed. The blocking layer can also improve a patterning process by reducing patterning induced defects.

公开(公告)号：US11164868B2

公开(公告)日：2021-11-02

申请号：US16777831

申请日：2020-01-30

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Hsin-Yi Lee ,  Cheng-Lung Hung ,  Weng Chang ,  Chi-On Chui

IPC: H01L27/088

Abstract: A semiconductor device may include a substrate, a first transistor disposed on the substrate, and a second transistor disposed on the substrate. The first gate structure of the first transistor may include a first high-k layer, a first capping layer and a first work function layer sequentially disposed on the substrate. A material of the first work function layer includes Ta. The second transistor includes a second gate structure. The second gate structure includes a second high-k layer, a second capping layer and a second work function layer sequentially disposed on the substrate. The first capping layer and the second capping layer are formed of the same layer, and a material of the second work function layer is different from the material of the first work function layer.

公开(公告)号：US20210134799A1

公开(公告)日：2021-05-06

申请号：US17120921

申请日：2020-12-14

Applicant: Taiwan Semiconductor Manufacturing Co. Ltd.

Inventor： Cheng-Yen Tsai ,  Ming-Chi Huang ,  Zoe Chen ,  Wei-Chin Lee ,  Cheng-Lung Hung ,  Da-Yuan Lee ,  Weng Chang ,  Ching-Hwanq Su

IPC: H01L27/092 ,  H01L21/324 ,  H01L29/66 ,  H01L29/51 ,  H01L29/78 ,  H01L29/08 ,  H01L21/768 ,  H01L21/28 ,  H01L21/8238 ,  H01L21/02 ,  H01L29/10 ,  H01L21/321 ,  H01L21/027

Abstract: In an embodiment, a method includes: forming a gate dielectric layer on an interface layer; forming a doping layer on the gate dielectric layer, the doping layer including a dipole-inducing element; annealing the doping layer to drive the dipole-inducing element through the gate dielectric layer to a first side of the gate dielectric layer adjacent the interface layer; removing the doping layer; forming a sacrificial layer on the gate dielectric layer, a material of the sacrificial layer reacting with residual dipole-inducing elements at a second side of the gate dielectric layer adjacent the sacrificial layer; removing the sacrificial layer; forming a capping layer on the gate dielectric layer; and forming a gate electrode layer on the capping layer.