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公开(公告)号:US20220392955A1
公开(公告)日:2022-12-08
申请号:US17369917
申请日:2021-07-07
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Hung-Chan Lin , Yu-Ping Wang
Abstract: A method for fabricating a semiconductor device includes the steps of: forming a magnetic tunneling junction (MTJ) on a substrate; forming a first spin orbit torque (SOT) layer on the MTJ; forming a passivation layer around the MTJ; forming a second SOT layer on the first SOT layer and the passivation layer; and patterning the second SOT layer and the passivation layer.
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公开(公告)号:US11456331B2
公开(公告)日:2022-09-27
申请号:US16857152
申请日:2020-04-23
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Jia-Rong Wu , I-Fan Chang , Rai-Min Huang , Ya-Huei Tsai , Yu-Ping Wang
IPC: H01L43/02 , H01L27/22 , G11C11/16 , H01F10/32 , H01F41/34 , H01L23/522 , H01L23/528 , H01L43/12 , H01L43/10
Abstract: A method for fabricating semiconductor device includes the steps of: providing a substrate having a logic region and a magnetoresistive random access memory (MRAM) region, forming a magnetic tunneling junction (MTJ) on the MRAM region, forming a metal interconnection on the MTJ, forming a dielectric layer on the metal interconnection, patterning the dielectric layer to form openings, and forming the blocking layer on the patterned dielectric layer and the metal interconnection and into the openings.
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公开(公告)号:US20220302374A1
公开(公告)日:2022-09-22
申请号:US17835986
申请日:2022-06-09
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Hui-Lin Wang , Chen-Yi Weng , Chin-Yang Hsieh , Yi-Hui Lee , Ying-Cheng Liu , Yi-An Shih , Jing-Yin Jhang , I-Ming Tseng , Yu-Ping Wang , Chien-Ting Lin , Kun-Chen Ho , Yi-Syun Chou , Chang-Min Li , Yi-Wei Tseng , Yu-Tsung Lai , JUN XIE
Abstract: A magnetoresistive random access memory (MRAM), including a bottom electrode layer on a substrate, a magnetic tunnel junction stack on the bottom electrode layer, a top electrode layer on the magnetic tunnel junction stack, and a hard mask layer on said top electrode layer, wherein the material of top electrode layer is titanium nitride, a material of said hard mask layer is tantalum or tantalum nitride, and the percentage of nitrogen in the titanium nitride gradually decreases from the top surface of top electrode layer to the bottom surface of top electrode layer.
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公开(公告)号:US11355700B2
公开(公告)日:2022-06-07
申请号:US16732359
申请日:2020-01-02
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Hui-Lin Wang , Po-Kai Hsu , Hung-Yueh Chen , Yu-Ping Wang
Abstract: A method for fabricating semiconductor device includes the steps of: forming a magnetic tunneling junction (MTJ) stack on a substrate; forming a top electrode on the MTJ stack; performing a first patterning process to remove the MTJ stack for forming a first MTJ; forming a first inter-metal dielectric (IMD) layer around the first MTJ; and performing a second patterning process to remove the first MTJ for forming a second MTJ and a third MTJ.
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公开(公告)号:US20210399209A1
公开(公告)日:2021-12-23
申请号:US17463541
申请日:2021-08-31
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Hui-Lin Wang , Yu-Ping Wang , Chen-Yi Weng , Chin-Yang Hsieh , Si-Han Tsai , Che-Wei Chang , Jing-Yin Jhang
Abstract: A semiconductor device includes: a substrate comprising a magnetic tunneling junction (MTJ) region and a logic region; a first MTJ on the MTJ region; a first metal interconnection on the logic region; and a cap layer extending from a sidewall of the first MTJ to a sidewall of the first metal interconnection. Preferably, the cap layer on the MTJ region and the cap layer on the logic region comprise different thicknesses.
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公开(公告)号:US20210389394A1
公开(公告)日:2021-12-16
申请号:US16927918
申请日:2020-07-13
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Hui-Lin Wang , Chen-Yi Weng , Che-Wei Chang , Si-Han Tsai , Ching-Hua Hsu , Jing-Yin Jhang , Yu-Ping Wang
Abstract: A method for fabricating semiconductor device includes the steps of first forming a magnetic tunneling junction (MTJ) stack on a substrate, in which the MTJ stack includes a pinned layer on the substrate, a barrier layer on the pinned layer, and a free layer on the barrier layer. Next, a top electrode is formed on the MTJ stack, the top electrode, the free layer, and the barrier layer are removed, a first cap layer is formed on the top electrode, the free layer, and the barrier layer, and the first cap layer and the pinned layer are removed to form a MTJ and a spacer adjacent to the MTJ.
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公开(公告)号:US20210225933A1
公开(公告)日:2021-07-22
申请号:US16792271
申请日:2020-02-16
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Ya-Huei Tsai , Rai-Min Huang , Yu-Ping Wang , Hung-Yueh Chen
IPC: H01L27/22 , H01L23/528 , H01L43/02
Abstract: A layout pattern for magnetoresistive random access memory (MRAM) includes a substrate having a first active region, a second active region, and a word line connecting region between the first active region and the second active region and a gate pattern extending from the first active region to the second active region, in which the gate pattern includes a H-shape according to a top view. Preferably, the gate pattern includes a first gate pattern extending along a first direction from the first active region to the second active region, a second gate pattern extending along the first direction from the first active region to the second active region, and a third gate pattern connecting the first gate pattern and the second gate pattern along a second direction.
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公开(公告)号:US20210225414A1
公开(公告)日:2021-07-22
申请号:US17224153
申请日:2021-04-07
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Po-Kai Hsu , Hung-Yueh Chen , Kun-I Chou , Jing-Yin Jhang , Hui-Lin Wang , Yu-Ping Wang
Abstract: A MRAM structure, which is provided with multiple source lines between active areas, each source line has multiple branches electrically connecting with the active areas at opposite sides in alternating arrangement. Multiple word lines traverse through the active areas to form transistors. Multiple storage units are disposed between the word lines on the active areas in staggered array arrangement, and multiple bit lines electrically connect with storage units on corresponding active areas, wherein each storage cell includes one of the storage unit, two of the transistors respectively at both sides of the storage unit, and two branches of the source line.
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公开(公告)号:US20210184104A1
公开(公告)日:2021-06-17
申请号:US17182146
申请日:2021-02-22
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Chung-Liang Chu , Jian-Cheng Chen , Yu-Ping Wang , Yu-Ruei Chen
Abstract: A semiconductor device includes a substrate having an array region defined thereon, a ring of magnetic tunneling junction (MTJ) region surrounding the array region, a gap between the array region and the ring of MTJ region, and metal interconnect patterns overlapping part of the ring of MTJ region. Preferably, the array region includes a magnetic random access memory (MRAM) region and a logic region and the ring of MTJ region further includes a first MTJ region and a second MTJ region extending along a first direction and a third MTJ region and a fourth MTJ region extending along a second direction.
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公开(公告)号:US20210111334A1
公开(公告)日:2021-04-15
申请号:US17131767
申请日:2020-12-23
Applicant: UNITED MICROELECTRONICS CORP.
Inventor: Hui-Lin Wang , Chen-Yi Weng , Chin-Yang Hsieh , Yi-Hui Lee , Ying-Cheng Liu , Yi-An Shih , Jing-Yin Jhang , I-Ming Tseng , Yu-Ping Wang , Chien-Ting Lin , Kun-Chen Ho , Yi-Syun Chou , Chang-Min Li , Yi-Wei Tseng , Yu-Tsung Lai , JUN XIE
Abstract: A magnetoresistive random access memory (MRAM), including a bottom electrode layer on a substrate, a magnetic tunnel junction stack on the bottom electrode layer, and a top electrode layer on the magnetic tunnel junction stack, wherein the material of top electrode layer is titanium nitride, and the percentage of nitrogen in the titanium nitride gradually decreases from the top surface of top electrode layer to the bottom surface of top electrode layer.
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