公开(公告)号：US08514353B2

公开(公告)日：2013-08-20

申请号：US13052726

申请日：2011-03-21

申请人： Naoyoshi Yamada ,  Ryuji Saneto ,  Junichi Ito ,  Shigekazu Suzuki

发明人： Naoyoshi Yamada ,  Ryuji Saneto ,  Junichi Ito ,  Shigekazu Suzuki

IPC分类号： G02F1/1335

CPC分类号： G02B5/201

摘要： A color filter including a red (R) pixel, a green (G) pixel and a blue (B) pixel, wherein at least one of the red (R) pixel, the green (G) pixel and the blue (B) pixel includes one or more kinds of dyes and one or more kinds of pigments and wherein areas of the red (R) pixel, the green (G) pixel and the blue (B) pixel are not the same.

摘要翻译： 一种包括红色（R）像素，绿色（G）像素和蓝色（B））像素的滤色器，其中红色（R）像素，绿色（G）像素和蓝色（B）像素中的至少一个 包括一种或多种染料和一种或多种颜料，并且其中红色（R）像素，绿色（G）像素和蓝色（B）像素的区域不相同。

公开(公告)号：US08385791B2

公开(公告)日：2013-02-26

申请号：US12659075

申请日：2010-02-24

申请人： Junichi Ito ,  Yukiyoshi Oda ,  Masahiro Kawano ,  Kazuhisa Fukamachi

发明人： Junichi Ito ,  Yukiyoshi Oda ,  Masahiro Kawano ,  Kazuhisa Fukamachi

IPC分类号： G03G15/08

CPC分类号： G03G15/0812

摘要： A developer regulating member regulates a thickness of a layer of a developer on a surface of a developer bearing body. The developer has a degree of circularity in a range from 0.94 to 0.97. The developer regulating member includes a resilient plate member composed of a metal material and having a bent portion. An outer surface of the bent portion contacts the surface of the developer bearing body so that a ridge line of the outer surface of the bent portion crosses a moving direction of the surface of the developer bearing body. A curvature radius R (μm) of the outer surface of the bent portion and a mean crystal grain diameter D (μm) of the metal material satisfy the relationship: 60×10−3×R−11≦D≦93.75×10−3×R−6.875.

摘要翻译： 显影剂调节构件调节显影剂承载体的表面上的显影剂层的厚度。 开发商的圆度在0.94至0.97之间。 显影剂调节构件包括由金属材料构成并具有弯曲部分的弹性板构件。 弯曲部的外表面与显影剂承载体的表面接触，使得弯曲部的外表面的脊线与显影剂承载体的表面的移动方向相交。 弯曲部分的外表面的曲率半径R（μm）和金属材料的平均晶粒直径D（μm）满足关系：60×10-3×R-11＆nlE; D＆nlE; 93.75×10-3 ×R-6.875。

公开(公告)号：US08318313B2

公开(公告)日：2012-11-27

申请号：US12678509

申请日：2008-09-18

申请人： Toru Imori ,  Yoshiyuki Hisumi ,  Junichi Ito ,  Tsukasa Torimoto ,  Kenichi Okazaki ,  Susumu Kuwabata

发明人： Toru Imori ,  Yoshiyuki Hisumi ,  Junichi Ito ,  Tsukasa Torimoto ,  Kenichi Okazaki ,  Susumu Kuwabata

IPC分类号： B32B15/02 ,  B05D1/36 ,  B05D5/00

CPC分类号： B22F1/0018 ,  B82Y30/00 ,  H01L21/288 ,  Y10T428/24917 ,  Y10T428/31663 ,  Y10T428/31667

摘要： A metal nano particle can be supported and immobilized on a substrate uniformly. Thus, disclosed is a method for supporting a nano metal particle, which comprises applying a silane coupling agent having at least one functional group capable of capturing a metal (e.g., an imidazole group, an amino group, a diamino group, a mercapto group, and a vinyl group) in its molecule on a substrate, and then contacting the silane coupling agent with a nano particle of a metal (e.g., gold, platinum, silver, copper, palladium, nickel, cobalt), wherein the silane coupling agent may be produced by the reaction between an azole compound with an epoxysilane compound, and wherein the metal nano particle to be contacted with the silane coupling agent is preferably coated with an ionic fluid. Also disclosed is a substrate having a metal nano particle supported thereon, which is produced by the method.

摘要翻译： 金属纳米颗粒可以均匀地负载并固定在基材上。 因此，公开了一种支撑纳米金属粒子的方法，其包括：将具有至少一个能够捕获金属的官能团的硅烷偶联剂（例如，咪唑基，氨基，二氨基，巯基， 和乙烯基），然后使硅烷偶联剂与金属（例如金，铂，银，铜，钯，镍，钴）的纳米颗粒接触，其中硅烷偶联剂可以 可以通过唑类化合物与环氧硅烷化合物的反应来制造，其中与硅烷偶联剂接触的金属纳米颗粒优选用离子液体包覆。 还公开了通过该方法制造的具有负载在其上的金属纳米粒子的基板。

公开(公告)号：US08283051B2

公开(公告)日：2012-10-09

申请号：US12737399

申请日：2009-07-13

申请人： Junichi Ito ,  Atsushi Yabe ,  Junnosuke Sekiguchi ,  Toru Imori ,  Yasuhiro Yamakoshi ,  Shinichiro Senda

发明人： Junichi Ito ,  Atsushi Yabe ,  Junnosuke Sekiguchi ,  Toru Imori ,  Yasuhiro Yamakoshi ,  Shinichiro Senda

IPC分类号： B32B15/08

CPC分类号： C23C18/54 ,  C23C18/1637 ,  C23C18/165 ,  C25D3/38 ,  H01L21/288 ,  H01L21/76843 ,  H01L21/76873 ,  H01L21/76874 ,  Y10T428/12431 ,  Y10T428/12438 ,  Y10T428/12493 ,  Y10T428/12569 ,  Y10T428/12826 ,  Y10T428/1284 ,  Y10T428/12854 ,  Y10T428/12903

摘要： A plated product made of a substrate having formed thereon an alloy barrier thin film for preventing copper diffusion contains metal B, which has barrier properties in relation to copper and enables displacement plating with the copper ions contained in an electroless copper plating solution, and metal A, which tends to have less ionization than metal B in an electroless copper plating solution at a pH of 10 or higher; the alloy barrier thin film for preventing copper diffusion has a composition wherein metal A constitutes between 15 and 35 at % of the atoms; and a copper thin film is formed on the alloy barrier thin film by electroless plating using an electroless copper plating solution at a pH of 10 or higher.

摘要翻译： 由其上形成有用于防止铜扩散的合金阻挡薄膜的基板制成的电镀产品包含金属B，该金属B具有与铜相关的阻挡性能，并且能够与无电镀铜溶液中包含的铜离子进行置换镀覆，并且金属A 在pH为10以上的化学镀铜溶液中倾向于具有比金属B更少的离子化; 用于防止铜扩散的合金阻挡薄膜具有其中金属A构成原子的15至35原子％的组成; 并且通过使用pH为10以上的化学镀铜溶液进行化学镀，在合金阻挡薄膜上形成铜薄膜。

公开(公告)号：US20120192758A1

公开(公告)日：2012-08-02

申请号：US13501139

申请日：2011-03-14

申请人： Toru Imori ,  Jun Suzuki ,  Ryu Murakami ,  Akihiro Aiba ,  Junichi Ito

发明人： Toru Imori ,  Jun Suzuki ,  Ryu Murakami ,  Akihiro Aiba ,  Junichi Ito

IPC分类号： C09D5/00 ,  B05D1/18 ,  B05D3/10

CPC分类号： C23C18/1608 ,  C23C18/1635 ,  C23C18/1879 ,  C23C18/1882 ,  C23C18/2066 ,  C23C18/30

摘要： It is an object of the present invention to provide an electroless plating pretreatment agent that can retain stably Pd(II) over a long period of time in an organic solvent, an electroless plating method using the same that is capable of forming an electroless plated film having excellent adhesion, and an electroless plated object. The object is achieved by an electroless plating pretreatment agent comprising an organic palladium compound and a coordination compound having a functional group with a metal-capturing capability dissolved in an organic solvent, the coordination compound being selected from the group consisting of the imidazole analogs, polyethyleneamines, ethyleneimines and polyethyleneimines.

摘要翻译： 本发明的目的是提供一种能够在有机溶剂中长期保持Pd（II）的化学镀预处理剂，使用该化学镀处理能够形成无电镀膜的化学镀方法 具有优异的粘附性，以及无电镀物。 该目的是通过包含有机钯化合物和具有溶解在有机溶剂中的具有金属捕获能力的官能团的配位化合物的化学镀预处理剂来实现的，该配位化合物选自咪唑类似物，聚乙烯胺 ，乙烯亚胺和聚乙烯亚胺。

公开(公告)号：US08199443B2

公开(公告)日：2012-06-12

申请号：US12073491

申请日：2008-03-06

申请人： Junichi Ito ,  Hideaki Fukuzawa ,  Hiromi Yuasa ,  Yoshihiro Fuji

发明人： Junichi Ito ,  Hideaki Fukuzawa ,  Hiromi Yuasa ,  Yoshihiro Fuji

IPC分类号： G11B5/39

CPC分类号： G01R33/093 ,  B82Y25/00 ,  G11B5/3932 ,  G11C11/16 ,  H01F10/3254 ,  H01F10/3272 ,  H01L43/08

摘要： A magneto-resistance effect element includes: a first magnetic layer of which a first magnetization is fixed in one direction; a second magnetic layer of which a second magnetization is fixed in one direction; a spacer layer located between the first magnetic layer and the second magnetic layer and made of at least one selected from the group consisting of an oxide, a nitride, an oxynitride and a metal; and a current bias generating portion, which is located adjacent to the spacer layer, for applying a bias magnetic field to the spacer layer.

摘要翻译： 磁阻效应元件包括：在一个方向上固定第一磁化的第一磁性层; 第二磁性层，其在一个方向上固定第二磁化强度; 位于第一磁性层和第二磁性层之间并由选自氧化物，氮化物，氧氮化物和金属中的至少一种构成的间隔层; 以及电位偏置产生部分，其位于与间隔层相邻的位置，用于向间隔层施加偏置磁场。

公开(公告)号：US20110129688A1

公开(公告)日：2011-06-02

申请号：US12737399

申请日：2009-07-13

申请人： Junichi Ito ,  Atsushi Yabe ,  Junnosuke Sekiguchi ,  Toru Imori ,  Yasuhiro Yamakoshi ,  Shinichiro Senda

发明人： Junichi Ito ,  Atsushi Yabe ,  Junnosuke Sekiguchi ,  Toru Imori ,  Yasuhiro Yamakoshi ,  Shinichiro Senda

IPC分类号： B32B15/20

CPC分类号： C23C18/54 ,  C23C18/1637 ,  C23C18/165 ,  C25D3/38 ,  H01L21/288 ,  H01L21/76843 ,  H01L21/76873 ,  H01L21/76874 ,  Y10T428/12431 ,  Y10T428/12438 ,  Y10T428/12493 ,  Y10T428/12569 ,  Y10T428/12826 ,  Y10T428/1284 ,  Y10T428/12854 ,  Y10T428/12903

摘要： An object of the present invention is to provide a plated object having a thin seed layer of uniform thickness that enables the fabrication of ultrafine wiring thereon in which, when the seed layer is formed by electroless copper plating, the uniformity and adherence thereof are improved over the aforementioned case in which electroless copper plating is performed on an elemental metal such as tungsten, molybdenum, etc., and the aforementioned complexity of forming two layers of a barrier layer and a catalyst metal layer before forming the copper seed layer is eliminated.A plated product comprising a substrate having formed thereon an alloy barrier thin film for preventing copper diffusion comprising metal B, which has barrier properties in relation to copper and enables displacement plating with the copper ions contained in an electroless copper plating solution, and metal A, which tends to have less ionization than metal B in an electroless copper plating solution at pH 10 or higher; the alloy barrier thin film for preventing copper diffusion has a composition wherein metal A constitutes between 15 and 35 at % of the atoms; and a copper thin film is formed on the alloy barrier thin film by electroless plating using an electroless copper plating solution at pH 10 or higher.

摘要翻译： 本发明的目的是提供一种具有均匀厚度的薄种子层的电镀物体，其能够在其上制造超细线，其中当通过无电镀铜形成种子层时，其均匀性和粘附性得到改善， 在形成铜籽晶层之前，对诸如钨，钼等的元素金属进行化学镀铜的上述情况以及形成两层阻挡层和催化剂金属层的上述复杂性被消除。 一种电镀产品，其包括在其上形成有用于防止铜扩散的合金阻挡薄膜的基板，其包含相对于铜具有阻挡性的金属B，并且能够与包含在无电镀铜溶液中的铜离子进行置换镀覆，以及金属A， 在pH为10以上的化学镀铜溶液中，其比金属B的离子化倾向更小; 用于防止铜扩散的合金阻挡薄膜具有其中金属A构成原子的15至35原子％的组成; 并且通过使用pH10或更高的化学镀铜溶液进行化学镀来在合金阻挡薄膜上形成铜薄膜。

公开(公告)号：US20100292412A1

公开(公告)日：2010-11-18

申请号：US12799950

申请日：2010-05-05

申请人： Masayuki Shibata ,  Yuichi Yanai ,  Takahiro Imai ,  Hiromichi Ueno ,  Yoshinori Konno ,  Junichi Ito ,  Takaaki Osanai ,  Michiei Nakamura

发明人： Masayuki Shibata ,  Yuichi Yanai ,  Takahiro Imai ,  Hiromichi Ueno ,  Yoshinori Konno ,  Junichi Ito ,  Takaaki Osanai ,  Michiei Nakamura

IPC分类号： C08L67/00 ,  B29C45/00

CPC分类号： C08L67/04 ,  B29C45/0001 ,  C08J3/226 ,  C08J2367/04 ,  C08J2467/00 ,  C08L2205/22 ,  C08L2666/18

摘要： This invention provides a process for producing a crystallized polyester resin molding. The process includes melting and injecting the below-described first or second compound (a) or (b) into a mold and holding the same in the mold, and then conducting cooling to crystallize a polyester resin of a resulting molding without using an inorganic nucleating agent: (a) a first compound of a crystallization-inducing crosslinked polyester resin, in at least a portion of which crosslinked points have been formed with a crosslink forming agent, and a first non-crosslinked polyester resin; or (b) a second compound of a crystallization-inducing master batch, which comprises the crosslinked polyester resin and a second non-crosslinked polyester resin and abundantly contains the crosslinked polyester resin, and the first non-crosslinked polyester resin. According to the present invention, a crystallized polyester resin molding free from impairment of translucency or transparency can be produced without using an inorganic nucleating agent that would produce haze in the molding.

摘要翻译： 本发明提供一种生产结晶聚酯树脂成型体的方法。 该方法包括将下述第一或第二化合物（a）或（b）熔融注入模具中并将其保持在模具中，然后进行冷却以使所得模制品的聚酯树脂结晶而不使用无机成核剂 试剂：（a）结晶诱导性交联聚酯树脂的第一种化合物，其至少一部分交联点已经形成交联形成剂，和第一非交联聚酯树脂; 或（b）结晶诱导母料的第二化合物，其包含交联聚酯树脂和第二非交联聚酯树脂，并且大量含有交联聚酯树脂和第一非交联聚酯树脂。 根据本发明，可以在不使用在成型中产生雾度的无机成核剂的情况下，制造不含半透明性或透明性的结晶性聚酯树脂成型体。

公开(公告)号：US07808544B2

公开(公告)日：2010-10-05

申请号：US11924527

申请日：2007-10-25

申请人： Junichi Ito

发明人： Junichi Ito

IPC分类号： G03B13/00 ,  H04N5/222

CPC分类号： H04N5/23293 ,  H04N5/23212

摘要： An electronic still camera includes a finder optical system for viewing a subject image. An imaging section obtains the subject image. A display section displays the subject image based on image data associated with the subject image obtained by the imaging section. A mode selecting section selects either a first mode in which the electronic still camera performs imaging operation using the imaging section while a user views the subject image through the finder optical system or a second mode in which the electronic still camera performs imaging operation using the imaging section while the user views the subject image on the display section. A first focus detection circuit performs a first focus detecting operation when the first mode is selected by the mode selecting section. A second focus detection circuit performs a second focus detecting operation when the second mode is selected by the mode selecting section.

摘要翻译： 电子静物照相机包括用于观看被摄体图像的取景器光学系统。 成像部分获得被摄体图像。 显示部分基于与由成像部分获得的被摄体图像相关联的图像数据来显示被摄体图像。 模式选择部分选择第一模式，其中电子静态照相机使用成像部分执行成像操作，而用户通过取景器光学系统观看被摄体图像或第二模式，其中电子静态照相机使用成像进行成像操作 部分，同时用户在显示部分查看主题图像。 当模式选择部选择第一模式时，第一焦点检测电路执行第一焦点检测操作。 当模式选择部选择第二模式时，第二焦点检测电路执行第二焦点检测操作。

公开(公告)号：US20100215410A1

公开(公告)日：2010-08-26

申请号：US12659075

申请日：2010-02-24

申请人： Junichi Ito ,  Yukiyoshi Oda ,  Masahiro Kawano ,  Kazuhisa Fukamachi

发明人： Junichi Ito ,  Yukiyoshi Oda ,  Masahiro Kawano ,  Kazuhisa Fukamachi

IPC分类号： G03G15/08

CPC分类号： G03G15/0812

摘要： A developer regulating member regulates a thickness of a layer of a developer on a surface of a developer bearing body. The developer has a degree of circularity in a range from 0.94 to 0.97. The developer regulating member includes a resilient plate member composed of a metal material and having a bent portion. An outer surface of the bent portion contacts the surface of the developer bearing body so that a ridge line of the outer surface of the bent portion crosses a moving direction of the surface of the developer bearing body. A curvature radius R (μm) of the outer surface of the bent portion and a mean crystal grain diameter D (μm) of the metal material satisfy the relationship: 60×10−3×R−11≦D≦93.75×10−3×R−6.875.

摘要翻译： 显影剂调节构件调节显影剂承载体的表面上的显影剂层的厚度。 开发商的圆度在0.94至0.97之间。 显影剂调节构件包括由金属材料构成并具有弯曲部分的弹性板构件。 弯曲部的外表面与显影剂承载体的表面接触，使得弯曲部的外表面的脊线与显影剂承载体的表面的移动方向相交。 弯曲部分的外表面的曲率半径R（μm）和金属材料的平均晶粒直径D（μm）满足关系：60×10-3×R-11＆nlE; D＆nlE; 93.75×10-3 ×R-6.875。