Abstract:
Micromechanical devices are provided that are capable of movement due to a flexible portion. The micromechanical device can have a flexible portion formed of an oxide of preferably an element from groups 3A to 6A of the periodic table (preferably from the first two rows of these groups) and a late transition metal (preferably from groups 8B or 1B of the periodic table). The micromechanical devices can be any device, particularly MEMS sensors or actuators preferably having a flexible portion such as an accelerometer, DC relay or RF switch, optical cross connect or optical switch, or a micromirror part of an array for direct view and projection displays. The flexible portion is preferably formed by sputtering a target having a group 8B or 1B element and a selected group 3A to 6A element, namely B, Al, In, Si, Ge, Sn, or Pb. The target can have other major constituents or impurities (e.g. additional group 3A to 6A element(s)). The target is reactively sputtered in a oxygen ambient so as to result in a sputtered hinge. It is possible to form both stiff and/or flexible portions of the micromechanical device in this way.
Abstract:
Micromechanical devices are provided that are capable of movement due to a flexible portion. The micromechanical device can have a flexible portion formed of a nitride of preferably an element from groups 3A to 6A of the periodic table (preferably from the first two rows of these groups) and a late transition metal (preferably from groups 8B or 1B of the periodic table). The micromechanical devices can be any device, particularly MEMS sensors or actuators preferably having a flexible portion such as an accelerometer, DC relay or RF switch, optical cross connect or optical switch, or a micromirror part of an array for direct view and projection displays. The flexible portion is preferably formed by sputtering a target having a group 8B or 1B element and a group 3A to 6A element. The target can have other major constituents or impurities (e.g. additional group 3A to 6A element(s)). The target is reactively sputtered in a nitrogen ambient so as to result in a sputtered hinge. It is possible to form both stiff and/or flexible portions of the micromechanical device in this way.
Abstract:
A microelectromechanical (MEM) apparatus is disclosed which includes one or more tensile-stressed actuators that are coupled through flexures to a stage on a substrate. The tensile-stressed actuators, which can be formed from tensile-stressed tungsten or silicon nitride, initially raise the stage above the substrate without any applied electrical voltage, and can then be used to control the height or tilt angle of the stage. An electrostatic actuator can also be used in combination with each tensile-stressed actuator. The MEM apparatus has applications for forming piston micromirrors or tiltable micromirrors and independently addressable arrays of such devices.
Abstract:
An array of magnetically actuated MEMS mirror devices is provided having stationary magnets configured to provide strong magnetic fields in the plane of the mirrors without any magnets or magnet-system components in the plane of the mirrors. Also, a magnetically actuated mirror device is provided that includes an improved actuation coil configuration that provides greater torque during mirror actuation. In addition, a mechanism is provided to detect the angular deflection of a moveable mirror. Also, an improved process is provided for manufacturing MEMS mirror devices.
Abstract:
A low-voltage electromechanical device including a tiltable microplatform, method of tilting same and array of such devices are provided. The tiltable or steerable microplatform utilizes a bent-beam actuator to achieve large tilting angles with low actuation voltages. Thin beams of the actuator are bent in such a way as to cause the microplatform to pivot around a dimple support that generates a torsional force leading to angular motion in suspension beams attached perpendicular to the thin beams and, in turn, leading to angular or tilting motion in the suspended microplatform. Some of the key features include (1) the low-voltage bent-beam actuator; (2) a dimple-supported microplatform with a hole underneath in the substrate to allow light to pass through and to allow unhindered tilting of the microplatform; and (3) a method for constructing a microprism on the tiltable transparent microplatform for color dispersion purposes in an adaptive vision system.
Abstract:
The movable part 21 is fastened to the substrate 11 via flexure parts 27a and 27b, and can move upward and downward with respect to the substrate 11. The substrate 11 also serves as a fixed electrode. The movable part 21 has second electrode parts 23a and 23b which can generate an electrostatic force between these electrode parts and the substrate 11 by means of a voltage that is applied across these electrode parts and the substrate 11, and a current path 25 which is disposed in a magnetic field, and which generates a Lorentz force when a current is passed through this current path. A mirror 12 which advances into and withdraws from the light path is disposed on the movable part 21. As a result, the mobility range of the movable part can be broadened, and the power consumption can be reduced, without applying a high voltage or sacrificing small size.
Abstract:
Methods of making microelectromechanical combdrive devices are disclosed. The device may optionally be formed using three device layers. A moveable element and flexure may be formed from a first device layer. The second device layer may be attached to the first and a first set of comb teeth are formed from the second device layer. One or more comb teeth in the first set extend from a major surface of the moveable element. A third device layer is attached to the second device layer and a second set of comb teeth are formed from the third device layer. An alignment target is formed in the first device layer. Corresponding alignment holes are formed in the second or third device layers.
Abstract:
An optical switch device includes a rolling shutter or membrane attached at one of its edges to a substrate near an optical port in the substrate. The rolling shutter can assume one of two states. In a first closed state, the membrane is uncoiled onto the substrate over the port such that light directed at the port impinges on the shutter. In a second open state, the membrane is rolled up away from the port such that light directed at the port impinges on the port. In one embodiment, a mirror is formed on the membrane such that when the membrane is in the closed state over the substrate, light directed at the port is reflected by the mirror. In one configuration, the optical port includes a hole or aperture such light passed through the port without interference. The device can include a latch electrode the far end of the membrane such that when it is rolled out, it can be held in position by a latching voltage applied across the latch electrode and the substrate. Slits can be formed in the membrane to keep the mirror flat by relieving strain in the membrane and to allow gases in proximity to the device to pass through the membrane as it is activated. The shutter can include dimples to minimize the area of contact between the membrane and the substrate to reduce the probability of the two sticking together. The attachment edge of the membrane can be made shorter than its width to reduce distortions in the membrane to keep the mirror flat. A raised annular rim can be provided around the port such that when the shutter is held down over the port it is pulled taut and flat over the rim. This feature is also used to maintain flatness in the mirror. The switch device can be used as part of an array of optical switches.
Abstract:
A method for manufacturing a micro-electro-mechanical device, which has supporting parts and operative parts, includes providing a first semiconductor wafer, having a first layer of semiconductor material and a second layer of semiconductor material arranged on top of the first layer, forming first supporting parts and first operative parts of the device in the second layer, forming temporary anchors in the first layer, and bonding the first wafer to a second wafer, with the second layer facing the second wafer. After bonding the first wafer and the second wafer together, second supporting parts and second operative parts of said device are formed in the first layer. The temporary anchors are removed from the first layer to free the operative parts formed therein.
Abstract:
In one embodiment, a micro device is formed by depositing a sacrificial layer over a metallic electrode, forming a moveable structure over the sacrificial layer, and then etching the sacrificial layer with a noble gas fluoride. Because the metallic electrode is comprised of a metallic material that also serves as an etch stop in the sacrificial layer etch, charge does not appreciably build up in the metallic electrode. This helps stabilize the driving characteristic of the moveable structure. In one embodiment, the moveable structure is a ribbon in a light modulator.