公开(公告)号：US4716568A

公开(公告)日：1987-12-29

申请号：US859058

申请日：1986-05-01

Applicant: Donald R. Scifres ,  Peter Cross ,  Gary L. Harnagel

Inventor： Donald R. Scifres ,  Peter Cross ,  Gary L. Harnagel

IPC: H01S5/022 ,  H01S5/024 ,  H01S5/40 ,  H01S3/04

CPC classification number: H01S5/02423 ,  H01S5/02236 ,  H01S5/4018 ,  H01S5/02252 ,  H01S5/02469 ,  H01S5/405

Abstract: A diode laser array assembly made from a plurality of linear diode laser array subassemblies stacked one above the other. Each subassembly is an array of individual laser beam emitters, such as a laser bar, mounted on a support plate. An electrically conductive path goes from one major surface of a support plate, through the linear laser array, to an opposite major surface of the support plate. Each subassembly is connected physically and electrically to adjacent subassemblies to form the final assembly. In one embodiment, the support plates are electrically insulating and partly coated or covered with conducting material. The plates are either rectangular with projections and directly connected, rectangular with metal plates between each other, or rectangular and connected in a staircase configuration. Alternatively, the support plates may be electrically conducting with an insulating layer and a conducting layer disposed in a sandwich configuration. The plates may also be made up of an electrically insulating support plate and an electrically conducting spacer plate.

Abstract translation: 由多个线性二极管激光器阵列组件制成的二极管激光器阵列组件，其一个堆叠在另一个之上。 每个子组件是安装在支撑板上的各个激光束发射器（例如激光棒）的阵列。 导电路径从支撑板的一个主表面通过线性激光器阵列移动到支撑板的相对主表面。 每个子组件物理和电连接到相邻的子组件以形成最终组件。 在一个实施例中，支撑板是电绝缘的并且部分地涂覆或用导电材料覆盖。 这些板是矩形的，具有突起并且直接连接，矩形，金属板彼此之间或矩形并且以阶梯结构连接。 或者，支撑板可以导电，绝缘层和以夹层结构设置的导电层。 板也可以由电绝缘支撑板和导电间隔板组成。

公开(公告)号：US4712609A

公开(公告)日：1987-12-15

申请号：US699429

申请日：1985-02-07

Applicant: Arthur H. Iversen

Inventor： Arthur H. Iversen

IPC: H01L23/473 ,  H01S3/04 ,  F28F3/06 ,  H01L23/36

CPC classification number: H01L23/473 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1301 ,  H01L2924/13091 ,  H01S3/0407 ,  H01S5/02423

Abstract: There is disclosed a novel high heat flux liquid cooled semi-conductor heat sink structure suitable for mounting semi-conductor chips such as IC's, hybrids, lasers, and power semi-conductors, said heat sink being made of metals, such as tungsten or Molybdenum; ceramics such as alumina, Beryllia, aluminum nitride, silicon carbide or variants thereof or other suitable material such as crystalline carbon, said semi-conductor heat sink structure including at least one surface suitable for bonding one or more semi-conductor chips in intimate thermal relationship thereto, and including a heat exchange surface on the interior surface thereof, said structure providing means for enclosing said heat exchange surface in a liquid tight manner and including means for providing a flow of coolant liquid to remove heat from said heat exchange surface by formation of nucleate vapor bubbles on said heat exchange surface, the improvement wherein said heat exchange surface includes: means disposed on said heat exchange surface for forming pressure gradients in said liquid having a component perpendicular to said heat exchange surface without substantially impeding the relative velocity between the anode heat exchange surface and said liquid, said component having a magnitude directly proportional to the square of the relative velocity between said anode heat exchange surface and said liquid, to facilitate removal of said nucleate bubbles.

Abstract translation: 公开了一种适用于安装诸如IC，混合动力，激光和功率半导体的半导体芯片的新型高热通量液冷半导体散热器结构，所述散热器由诸如钨或钼的金属制成 ; 陶瓷如氧化铝，铍，氮化铝，碳化硅或其变体，或其他合适的材料如结晶碳，所述半导体散热器结构包括至少一个表面，其适于粘合一个或多个半导体芯片，具有温和关系 并且在其内表面上包括热交换表面，所述结构提供装置用于以液密方式封闭所述热交换表面，并且包括用于提供冷却液流以从所述热交换表面除去热量的装置，以形成 在所述热交换表面上成核的蒸气泡，改进之处在于，所述热交换表面包括：设置在所述热交换表面上的装置，用于在所述液体中形成具有垂直于所述热交换表面的分量的压力梯度，而基本上不阻碍阳极之间的相对速度 热交换表面和所述液体，所述组分havi 具有与所述阳极热交换表面和所述液体之间的相对速度的平方成正比的大小，以便于去除所述核泡。

公开(公告)号：US4393393A

公开(公告)日：1983-07-12

申请号：US261832

申请日：1981-05-08

Applicant: Louis B. Allen, Jr. ,  Herbert G. Koenig, Jr. ,  Robert A. Stacy ,  Danny D. Meyer

Inventor： Louis B. Allen, Jr. ,  Herbert G. Koenig, Jr. ,  Robert A. Stacy ,  Danny D. Meyer

IPC: H01S5/022 ,  H01S5/024 ,  H01S5/40 ,  H01L23/02 ,  H01L23/48 ,  H01L29/44

CPC classification number: H01S5/02423 ,  H01L2924/0002 ,  H01S5/02272 ,  H01S5/4018 ,  H01S5/4025

Abstract: A laser diode is soldered between metal plates for intimate thermal and electrical contact. The plates are prefabricated and are provided with an insulative spacer therebetween. The two metal plates are held together in a preferred orientation by the spacer which is firmly adhered and sealed to the two plates during the diode soldering operation. The metal plates are constructed from material thin enough that they yield under thermal pressure of the diode to eliminate mechanical strain on the diode during thermal cycling. Backup plates are provided in contact with the diode mounting plates to feed electrical energy thereto.

Abstract translation: 激光二极管焊接在金属板之间，以实现热和电接触。 板是预制的并且在它们之间设置有绝缘间隔件。 两个金属板通过在二极管焊接操作期间牢固地粘附并密封到两个板的间隔件以优选的取向保持在一起。 金属板由足够薄的材料构成，使得它们在二极管的热压下产生，以消除热循环期间二极管的机械应变。 提供与二极管安装板接触的备用板以向其供电电能。

公开(公告)号：US3955176A

公开(公告)日：1976-05-04

申请号：US503196

申请日：1974-09-04

Applicant: Kenth Yngve Andersson

Inventor： Kenth Yngve Andersson

IPC: A61K31/135 ,  A61K31/137 ,  A61K31/47 ,  A61P25/24 ,  A61P25/26 ,  C07C67/00 ,  C07C209/00 ,  C07C209/34 ,  C07C209/62 ,  C07C211/49 ,  C07C211/52 ,  C07C211/53 ,  C07D215/06 ,  C07D215/12 ,  C07D215/14 ,  C07D215/18 ,  H01L33/64 ,  H01S5/00 ,  H01S5/024 ,  H01L23/02

CPC classification number: H01S5/02423 ,  C07D215/06 ,  C07D215/12 ,  C07D215/14 ,  C07D215/18 ,  H01L33/648 ,  H01S5/02208

Abstract: A laser diode is provided with a casing that encloses a light-emitting crystal. The casing includes a transparent member through which the light passes. A portion of the diode is positioned within a holder and means is provided for cooling the diode. To reduce condensation of moisture which is present within the holder, upon the transparent member, a sleeve formed of a thermally high conductor material such as copper is placed about the casing with close physical contact therebetween.

Abstract translation: 激光二极管设置有封装发光晶体的壳体。 壳体包括光通过的透明构件。 二极管的一部分位于保持器内，并提供用于冷却二极管的装置。 为了减少保持器内部存在的水分的冷凝，在透明构件上，由诸如铜的热高导体材料形成的套筒围绕壳体放置在它们之间的紧密的物理接触。

公开(公告)号：US3445786A

公开(公告)日：1969-05-20

申请号：US3445786D

申请日：1965-02-09

Applicant: PHILCO FORD CORP

Inventor： SNYDER CARL R ,  BINELLI WALTER D

IPC: H01S5/024 ,  H01S3/04 ,  F25B19/00 ,  H01J7/24

CPC classification number: H01S5/02423 ,  H01S5/02272

公开(公告)号：US12107389B2

公开(公告)日：2024-10-01

申请号：US17291826

申请日：2019-10-24

Applicant: Centre National De La Recherche Scientifique ,  UNIVERSITE DE BORDEAUX ,  COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

Inventor： Christophe Feral ,  Jérôme Lhermite ,  Jérémy Brandam ,  Denis Marion

IPC: H01S5/04 ,  H01S5/02208 ,  H01S5/024

CPC classification number: H01S5/041 ,  H01S5/02208 ,  H01S5/02423

Abstract: A laser amplifier head is provided. The laser amplifier head includes a plurality of plates of a solid-state laser active medium disposed in a housing, arranged parallel to one another with their main surfaces facing one another, the housing being provided with an inlet port and an outlet port for a cooling liquid, and also at least one window allowing a laser beam to pass through the laser active medium plates, wherein it also includes:



a mechanical connection device allowing a cyclic movement at least of the laser active medium plates in relation to the laser beam in a plane (xy) perpendicular to the direction (z) of their thickness; and
cooling liquid guide plates arranged in the extension of the laser active medium plates, between the latter and the inlet port of said liquid.

公开(公告)号：US11973313B2

公开(公告)日：2024-04-30

申请号：US17254625

申请日：2019-06-18

Applicant: TRUMPF Photonics, Inc.

Inventor： Stephan Strohmaier ,  Arne-Heike Meissner-Schenk ,  Gerald Urban ,  Gerd Hansen ,  Christian Carstens

IPC: H01S5/024 ,  H01S5/0237

CPC classification number: H01S5/02423 ,  H01S5/0237

Abstract: A diode laser arrangement includes at least one emitter, first and second cooling devices and a first connecting layer. The emitter is configured to emit a laser beam and is disposed between the first and second cooling devices. The first and second cooling devices are each configured for cooling the emitter. The emitter is connected to the first cooling device by the first connecting layer, and the first connecting layer has a connecting material or is composed of a connecting material selected from a group including gold, a gold alloy, silver, a silver alloy, a silver sintered material, copper, a copper alloy, nickel, a nickel alloy, palladium, a palladium alloy, platinum, a platinum alloy, rhodium, a rhodium alloy, iridium, an iridium alloy, germanium, a germanium alloy, tin, a tin alloy, aluminum, an aluminum alloy, indium, an indium alloy, lead and a lead alloy.

公开(公告)号：US11962129B2

公开(公告)日：2024-04-16

申请号：US17227132

申请日：2021-04-09

Applicant: Lawrence Livermore National Security, LLC ,  Colorado State University Research Foundation

Inventor： Jack Kotovsky ,  Salmaan H. Baxamusa ,  Clint D. Frye ,  Ian Seth Ladner ,  Thomas M. Spinka ,  Devin Joseph Funaro ,  David Ryan Hobby ,  Caleb Del Anderson ,  Todd Bandhauer

IPC: H01S5/40 ,  H01S5/024

CPC classification number: H01S5/4025 ,  H01S5/02423

Abstract: The present disclosure relates to a laser diode system. The system may have at least one laser diode emitter having a substrate, at least one laser diode supported on the substrate, and a facet which a laser beam generated by the laser diode is emitted. A cooling subsystem is included which is disposed in contact with the substrate of the laser diode emitter. The cooling subsystem includes a plurality of cooling fins forming a plurality of elongated channels for circulating a cooling fluid therethrough to cool the laser diode emitter. The cooling fluid also flows over the facet of the laser diode emitter.

公开(公告)号：US20240088620A1

公开(公告)日：2024-03-14

申请号：US18264257

申请日：2022-04-04

Applicant: Mitsubishi Electric Corporation

Inventor： Yuki OKAMOTO ,  Daisuke MORITA

IPC: H01S5/024 ,  B23K26/06 ,  B23K26/70 ,  H01S5/023 ,  H01S5/0233

CPC classification number: H01S5/02476 ,  B23K26/0604 ,  B23K26/703 ,  H01S5/023 ,  H01S5/0233 ,  H01S5/02423

Abstract: A semiconductor laser module includes a heat sink, a first electrode disposed in a first region of the heat sink, an electrically insulating layer disposed on the first electrode, a submount that is disposed in a second region of the heat sink and is electrically conductive and thermally conductive, a laser diode element that is disposed on the submount and emits a laser beam, a feed structure that is disposed on the laser diode element and is electrically conductive, thermally conductive, and elastic, and a second electrode disposed on and in contact with the electrically insulating layer and the feed structure. The second electrode includes an electrode-facing portion having a flat surface in contact with the electrically insulating layer, and a protruding portion having a flat surface in contact with the feed structure, and protruding toward the heat sink with respect to the electrode-facing portion.

公开(公告)号：US20230261433A1

公开(公告)日：2023-08-17

申请号：US17651286

申请日：2022-02-16

Applicant: ACME SOLUTIONS LLC

Inventor： Robert E. Richard ,  Jonathan D. Kemp ,  Emil V. Ardelean

IPC: H01S5/024 ,  H01S5/023

CPC classification number: H01S5/02423 ,  H01S5/023

Abstract: A system includes one or more diodes, a power source, a tank, and a cooling plate. The power source is coupled to the one or more diodes and the tank is operable to store a fluid under pressure. The cooling plate includes one or more channels configured to receive at least some of the fluid stored in the tank and is operable to transfer heat from the one or more diodes to the fluid through the one or more channels.