公开(公告)号：US20090221216A1

公开(公告)日：2009-09-03

申请号：US12322922

申请日：2009-02-09

申请人： Takashi Fujita

发明人： Takashi Fujita

IPC分类号： B24B53/02 ,  B24B53/12

CPC分类号： B24B53/017 ,  B24B53/12

摘要： Elastic member bundled by pencil band is mounted to the lower edge of support part. Elastic member is composed with tungsten wires which are 25 mm in the length and 0.15 mm in diameter bundled with every 30 wires in one bundle. The tip part of each element wire of elastic member contacts polishing pad with the tip end cut round and performs dressing of polishing pad. The wire size of the tip part of each element wire of elastic member is made to be fine and the cutting width on polishing pad is made to be narrow, and at the same time, the rigidity of elastic member is made to be enhanced by bundling each element wire of elastic member with pencil band, and a large pressure is made to be pressed to the fine tip part of each element wire. Therefore, the tip part of elastic member can give an effective incision depth to polishing pad.

摘要翻译： 由铅笔带捆绑的弹性构件安装在支撑部的下边缘。 弹性构件由长度为25mm，直径为0.15mm的钨丝组成，每束30根线捆成束。 弹性构件的每个元件线的尖端部分接触抛光垫，顶端切割圆形，并进行抛光垫的修整。 使弹性构件的每个元件线的顶端部分的线尺寸变细，并且使研磨垫上的切割宽度变窄，同时通过捆扎使弹性构件的刚性提高 弹性构件与铅笔带的每个元件线和大的压力被压到每个元件线的细末端部分。 因此，弹性部件的前端部能够对研磨垫赋予有效的切口深度。

公开(公告)号：US20090137187A1

公开(公告)日：2009-05-28

申请号：US12276189

申请日：2008-11-21

申请人： Chien-Min Sung

发明人： Chien-Min Sung

IPC分类号： B24B49/12 ,  B24B1/00 ,  B24B53/02

CPC分类号： B24B49/12 ,  B24B53/02 ,  B24D7/12

摘要： A system for in-situ monitoring at least one aspect of a chemical mechanical planarization process can include a CMP pad, CMP pad dresser with at least a translucent portion, and an optical sensor. The optical sensor can be configured to optically engage the CMP pad through the translucent portion of the CMP pad dresser. Methods of monitoring chemical mechanical planarization processes can include using such CMP pad dresser to view a performance characteristic through the CMP pad dresser.

摘要翻译： 用于原位监测化学机械平面化处理的至少一个方面的系统可以包括具有至少半透明部分的CMP垫，CMP垫修整器和光学传感器。 光学传感器可以被配置为通过CMP抛光垫修整器的半透明部分光学地接合CMP垫。 监测化学机械平面化处理的方法可以包括使用这种CMP垫修整器来通过CMP抛光垫修整器来观察性能特征。

公开(公告)号：US20090068937A1

公开(公告)日：2009-03-12

申请号：US12168110

申请日：2008-07-05

申请人： Chien-Min Sung ,  Michael Sung

发明人： Chien-Min Sung ,  Michael Sung

IPC分类号： B24B53/12 ,  B24D11/00 ,  B24B53/02

CPC分类号： B24B53/017

摘要： A CMP pad conditioner comprises a plurality of abrasive segments. Each abrasive segment includes a segment blank and an abrasive layer attached to the segment blank, the abrasive layer including a superhard abrasive material. A pad conditioner substrate is also provided. Each of the plurality of abrasive segments is permanently affixed to the pad conditioner substrate in an orientation that enables removal of material from a CMP pad by the abrasive layer as the pad conditioner and the CMP pad are moved relative to one another.

摘要翻译： CMP垫调节器包括多个磨料段。 每个研磨部分包括段坯料和连接到片坯的磨料层，研磨层包括超硬磨料。 还提供了衬垫调节衬底。 多个研磨部分中的每一个永久地固定到衬垫调节器衬底上，其方式是当衬垫调节器和CMP垫相对于彼此移动时，能够通过磨料层从CMP衬垫去除材料。

公开(公告)号：US20080132153A1

公开(公告)日：2008-06-05

申请号：US11946135

申请日：2007-11-28

申请人： Naoki Rikita ,  Kasumi Chida

发明人： Naoki Rikita ,  Kasumi Chida

IPC分类号： B24B53/02

CPC分类号： B24B53/017 ,  B24B53/12

摘要： To provide a CMP conditioner that prevents dissolution of metals in slurry, without the chipping of the abrasive grains and/or decreasing the cutting performance. The CMP apparatus has a polishing pad that faces and contacts conditioning surface of the conditioner body. On this conditioning surface, abrasive grains are distributed and fixed to form abrasive grain layer, thus forming the CMP conditioner. The conditioner body is made of ceramics, the abrasive grains in the abrasive grain layer are held by binding phase made of low temperature co-fired ceramics.

摘要翻译： 提供一种防止金属在浆料中溶解的CMP调节剂，而不会磨损磨料颗粒和/或降低切割性能。 CMP装置具有面向和接触调理器主体的调节表面的抛光垫。 在这种调理表面上，磨粒分布固定以形成磨粒层，从而形成CMP调理剂。 调理体由陶瓷制成，磨粒层中的磨粒由低温共烧陶瓷制成的结合相保持。

公开(公告)号：US07172491B2

公开(公告)日：2007-02-06

申请号：US11208217

申请日：2005-08-18

申请人： Scott E. Moore

发明人： Scott E. Moore

IPC分类号： B24B49/00 ,  B24B51/00 ,  B24B1/00 ,  B24B53/02

CPC分类号： B24B53/017 ,  B24B49/006 ,  B24B49/16 ,  B24B53/12

摘要： A method and apparatus for conditioning and monitoring a planarizing medium used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a conditioning body having a conditioning surface that engages a planarizing surface of the planarizing medium and is movable relative to the planarizing medium. A force sensor is coupled to the conditioning body to detect a frictional force imparted to the conditioning body by the planarizing medium when the conditioning body and the planarizing medium are moved relative to each other. The apparatus can further include a feedback device that controls the motion, position, or force between the conditioning body and the planarizing medium to control the conditioning of the planarizing medium.

摘要翻译： 用于调节和监测用于平坦化微电子衬底的平面化介质的方法和装置。 在一个实施例中，该装置可以包括具有调节表面的调节主体，调节表面接合平坦化介质的平坦化表面并且可相对于平坦化介质移动。 力传感器耦合到调理体，以在调节体和平坦化介质相对于彼此移动时，通过平坦化介质检测施加到调理体的摩擦力。 该装置还可以包括控制调节体和平坦化介质之间的运动，位置或力的反馈装置，以控制平坦化介质的调理。

公开(公告)号：US06905571B2

公开(公告)日：2005-06-14

申请号：US10693952

申请日：2003-10-28

申请人： Noriyuki Sakuma ,  Kinji Tsunenari

发明人： Noriyuki Sakuma ,  Kinji Tsunenari

IPC分类号： B24B53/007 ,  B24B53/017 ,  B24B53/02 ,  H01L21/304 ,  H01L21/306 ,  B24B37/00

CPC分类号： B24B53/017 ,  H01L21/30625

摘要： When honing an abrasive pad for polishing a wafer by rotating while closely contacting the wafer by bringing a conditioner into contact with the abrasive pad, forces applied from the abrasive pad to the conditioner are detected by a plurality of pressure detectors through a conditioner driving unit for holding the conditioner. The pressure detectors are respectively able to detect forces in two directions such as rotational direction and radial direction. A memory stores correlations between detection values and wafer polishing quantities under various conditioning terms. Therefore, it is determined whether the detection values are kept within acceptable limits stored in the memory. When the values are out of the acceptable limits, a controller controls the values so that they fall within the acceptable limits by properly changing conditioning terms.

摘要翻译： 当通过使调理剂与研磨垫接触来碾磨研磨垫用于通过旋转而紧密接触晶片来研磨晶片时，通过多个压力检测器通过调节器驱动单元检测从研磨垫施加到调节器的力， 拿着护发素。 压力检测器分别能够检测诸如旋转方向和径向两个方向的力。 存储器存储在各种条件下检测值和晶片抛光量之间的相关性。 因此，确定检测值是否保持在存储器中存储的可接受限度内。 当值超出可接受限度时，控制器通过适当地改变条件来控制这些值，使其达到可接受的限度内。

公开(公告)号：US06899604B2

公开(公告)日：2005-05-31

申请号：US10204600

申请日：2002-01-17

申请人： Tetsuji Togawa ,  Ikutaro Noji ,  Shunichiro Kojima ,  Nobuyuki Takada

发明人： Tetsuji Togawa ,  Ikutaro Noji ,  Shunichiro Kojima ,  Nobuyuki Takada

IPC分类号： B24B41/047 ,  B24B49/16 ,  B24B53/007 ,  B24B53/017 ,  B24B53/02 ,  B24B53/12 ,  H01L21/304 ,  B24B7/00

CPC分类号： B24B53/017 ,  B24B41/047 ,  B24B49/16 ,  B24B53/02 ,  B24B53/12

摘要： A dressing apparatus dresses a polishing surface of a polishing table used for polishing a workpiece such as a semiconductor wafer in a polishing apparatus. The dressing apparatus comprises a dresser body (31) connected to a dresser drive shaft (23) which is vertically movable, a dresser plate (32) which is vertically movable with respect to the dresser body (31), and a dressing member (22) held by the dresser plate (32) for dressing the polishing surface (1a).

摘要翻译： 修整装置用于抛光抛光装置中用于抛光诸如半导体晶片的工件的抛光台的抛光表面。 该修整装置包括连接到可上下移动的修整器驱动轴（23）的修整器主体（31），相对于修整器主体（31）可垂直移动的修整器板（32）和修整构件（22） ），其由修整器板（32）保持，用于修整抛光表面（1a）。

公开(公告)号：US20050113009A1

公开(公告)日：2005-05-26

申请号：US10985206

申请日：2004-11-10

申请人： Jong-Won Lee ,  Joon-Sang Park ,  Chang-Ki Hong

发明人： Jong-Won Lee ,  Joon-Sang Park ,  Chang-Ki Hong

IPC分类号： B24B53/007 ,  B24B53/02 ,  B24B7/00

CPC分类号： B24B53/017 ,  B24B53/02

摘要： Chemical mechanical apparatuses including a polishing pad conditioning unit for improving a conditioning rate and wear uniformity of a polishing pad are provided. In one aspect, a chemical mechanical polishing apparatus includes a polishing pad conditioner including conditioning disks disposed in a radial direction of a planarizing surface of a circular polishing pad and contacted with the planarizing surface of the circular polishing pad during rotation of the circular polishing pad. The conditioning disks are connected to first drive units supported by an arm disposed over the circular polishing pad and extended in a radial direction of a planarizing surface of the circular polishing pad. The arm is connected to second drive units. The second drive units move the arm horizontally and reciprocally in the radial direction of the planarizing surface of the circular polishing pad. Thus, a conditioning rate and wear uniformity of the polishing pad may be improved.

摘要翻译： 提供了包括用于改善抛光垫的调理率和磨损均匀性的抛光垫调节单元的化学机械设备。 在一个方面，一种化学机械抛光装置包括抛光垫调节器，其包括在圆形抛光垫的平坦化表面的径向方向上设置的调节盘，并且在圆形抛光垫的旋转期间与圆形抛光垫的平坦化表面接触。 调节盘连接到由设置在圆形抛光垫上的臂支撑的第一驱动单元，并且在圆形抛光垫的平坦化表面的径向方向上延伸。 臂连接到第二个驱动单元。 第二驱动单元在圆形抛光垫的平坦化表面的径向水平和往复地移动臂。 因此，可以提高抛光垫的调理率和磨损均匀性。

公开(公告)号：US5975994A

公开(公告)日：1999-11-02

申请号：US873059

申请日：1997-06-11

申请人： Gurtej Singh Sandhu ,  Trung Tri Doan

发明人： Gurtej Singh Sandhu ,  Trung Tri Doan

IPC分类号： B24B49/10 ,  B24B49/18 ,  B24B53/007 ,  B24B53/02 ,  B24B1/00

CPC分类号： B24B53/017 ,  B24B49/10 ,  B24B49/18 ,  B24B53/02

摘要： A method and apparatus for selectively conditioning a planarizing surface of a polishing pad. In one embodiment, a conditioning system has a carrier assembly with an arm that may be positioned over a polishing pad, a conditioning element coupled to the arm, and an actuator coupled to the arm to move the conditioning element into engagement with the planarizing surface of the polishing pad. The conditioning element is an abrasive member, such as an abrasive disk or a brush. The conditioning system may also have a controller operatively coupled to the engagement actuator to control an operating parameter of the conditioning element as a function of the distribution of a surface characteristic across the planarizing surface of the polishing pad.

摘要翻译： 一种用于选择性地调节抛光垫的平坦化表面的方法和装置。 在一个实施例中，调节系统具有支架组件，其具有臂，所述臂可以被定位在抛光垫上方，耦合到所述臂的调节元件以及联接到所述臂的致动器以使所述调节元件与所述调节元件的平坦化表面 抛光垫。 调理元件是磨料构件，例如研磨盘或刷子。 调节系统还可以具有可操作地耦合到接合致动器的控制器，以根据抛光垫的平坦化表面上的表面特性的分布来控制调节元件的操作参数。

公开(公告)号：US5951370A

公开(公告)日：1999-09-14

申请号：US944937

申请日：1997-10-02

申请人： Joseph V. Cesna

发明人： Joseph V. Cesna

IPC分类号： B24B37/04 ,  B24B49/12 ,  B24B53/007 ,  B24B53/02 ,  B24B53/00

CPC分类号： B24B37/042 ,  B24B37/20 ,  B24B49/12 ,  B24B53/017 ,  B24B53/02

摘要： A laser element is mounted above a polishing pad of a workpiece polishing machine to monitor and control flatness of the pad. Actual flatness of the pad is determined by a computer processor which receives thickness measurements from the laser element and compares the thickness at the inner diameter portion of the pad with the thickness at the outer diameter portion of the pad. If the flatness varies substantially from a target flatness, a conditioning device mounted on the machine is moved appropriately relative to the pad to conform its flatness to the target flatness.

摘要翻译： 激光元件安装在工件抛光机的抛光垫上方，以监测和控制焊盘的平整度。 垫的实际平坦度由计算机处理器确定，计算机处理器从激光元件接收厚度测量值，并将垫的内径部分处的厚度与垫的外径部分的厚度进行比较。 如果平坦度从目标平面度变化很大，则安装在机器上的调节装置相对于衬垫适当地移动，以使其平整度达到目标平面度。