公开(公告)号：US20110276308A1

公开(公告)日：2011-11-10

申请号：US13185395

申请日：2011-07-18

申请人： Scott E. Moore ,  Brett Olin

发明人： Scott E. Moore ,  Brett Olin

IPC分类号： G06F15/00 ,  G01B11/14 ,  G06K9/00

CPC分类号： G01B11/254 ,  F42B33/0285 ,  G01B11/002 ,  G01B11/14 ,  G01F23/292 ,  G01F25/0061 ,  G06T7/60

摘要： A non-contacting deviation measurement system projects a first line and a second line upon a surface of an object. The projections of the first line and second line are arranged to overlap at an intersection line oriented at a nominal location such that when the surface is oriented at the nominal location, the intersection line appears on the surface. As the location of the surface deviates from the nominal location, the first line and second line as projected upon the surface move away from one another. The distance between the lines may be used to calculate the deviation from the nominal location. The deviation calculated may be compared to a predetermined maximum allowable deviation.

摘要翻译： 非接触偏差测量系统在物体表面上投射第一条线和第二条线。 第一线和第二线的突起被布置成在以标称位置定向的交叉线处重叠，使得当表面定向在标称位置时，交叉线出现在表面上。 当表面的位置偏离标称位置时，投影在表面上的第一条线和第二条线彼此远离。 线之间的距离可用于计算与标称位置的偏差。 计算的偏差可以与预定的最大允许偏差进行比较。

公开(公告)号：US20100032314A1

公开(公告)日：2010-02-11

申请号：US12580941

申请日：2009-10-16

申请人： Whonchee Lee ,  Scott E. Moore ,  Scott G. Meikle

发明人： Whonchee Lee ,  Scott E. Moore ,  Scott G. Meikle

IPC分类号： C25F3/16

CPC分类号： B24B37/12 ,  B23H3/00 ,  B23H3/02 ,  B23H5/08 ,  B24B37/046 ,  B24B37/30 ,  C25F3/14 ,  C25F7/00

摘要： Methods and apparatuses for selectively removing conductive materials from a microelectronic substrate. A method in accordance with an embodiment of the invention includes positioning the microelectronic substrate proximate to and spaced apart from an electrode pair that includes a first electrode and a second electrode spaced apart from the first electrode. An electrolytic liquid can be directed through a first flow passage to an interface region between the microelectronic substrate and the electrode pair. A varying electrical signal can be passed through the electrode pair and the electrolytic liquid to remove conductive material from the microelectronic substrate. The electrolytic liquid can be removed through a second flow passage proximate to the first flow passage and the electrode pair.

摘要翻译： 用于从微电子衬底选择性去除导电材料的方法和装置。 根据本发明的实施例的方法包括将微电子基板定位在靠近并与电极对间隔开的位置，电极对包括第一电极和与第一电极间隔开的第二电极。 电解液可以通过第一流动通道引导到微电子衬底和电极对之间的界面区域。 可以将变化的电信号通过电极对和电解液体以从微电子衬底去除导电材料。 可以通过靠近第一流动通道和电极对的第二流动通道去除电解液体。

公开(公告)号：US07625495B2

公开(公告)日：2009-12-01

申请号：US11341132

申请日：2006-01-27

申请人： Jim Hofmann ,  Gundu M. Sabde ,  Stephen J. Kramer ,  Scott E. Moore

发明人： Jim Hofmann ,  Gundu M. Sabde ,  Stephen J. Kramer ,  Scott E. Moore

IPC分类号： H01L21/302 ,  B24B49/00

CPC分类号： B24B37/013 ,  B24B21/04 ,  B24B37/042 ,  B24B49/16 ,  H01L21/31053 ,  H01L22/26

摘要： Methods and devices for mechanical and/or chemical-mechanical planarization of semiconductor wafers, field emission displays and other microelectronic substrate assemblies. One method of planarizing a microelectronic substrate assembly in accordance with the invention includes pressing a substrate assembly against a planarizing surface of a polishing pad at a pad/substrate interface defined by a surface area of the substrate assembly contacting the planarizing surface. The method continues by moving the substrate assembly and/or the polishing pad with respect to the other to rub at least one of the substrate assembly and the planarizing surface against the other at a relative velocity. As the substrate assembly and polishing pad rub against each other, a parameter indicative of drag force between the substrate assembly and the polishing pad is measured or sensed at periodic intervals. The drag force parameter, for example, can be lateral displacement or lateral forces between a first component coupled to one of the substrate assembly or the polishing pad and a second component in either a carrier assembly holding the substrate assembly or a table supporting the polishing pad. The drag force parameter can be measured along a lateral axis to produce a waveform having minimum and maximum peaks relative to minimum and maximum peak drag forces between the substrate assembly and the polishing pad along the axis. The maximum peak drag forces or the difference of the minimum and maximum peak drag forces are processed to generate a force-time relationship. The status of a parameter, such as the onset of planarity or the endpoint of the process, is then estimated by analyzing the force-time relationship.

公开(公告)号：US07438632B2

公开(公告)日：2008-10-21

申请号：US11334609

申请日：2006-01-18

申请人： Scott E. Moore ,  Dinesh Chopra

发明人： Scott E. Moore ,  Dinesh Chopra

IPC分类号： B24B5/00 ,  B24B55/02

CPC分类号： B24B53/017 ,  B24B21/04 ,  H01L21/67051

摘要： A method and apparatus for cleaning a web-based chemical-mechanical planarization (CMP) system. Specifically, a fluid spray bar is coupled to a frame assembly which may be mounted on a CMP system. The fluid spray bar will move along the frame assembly. As the fluid spray bar traverses the length of the frame assembly, a cleaning fluid is sprayed onto the web in order to clean the web between planarization cycles.

摘要翻译： 一种用于清洁基于网络的化学 - 机械平面化（CMP）系统的方法和设备。 具体地，流体喷射杆联接到可以安装在CMP系统上的框架组件。 流体喷射杆将沿框架组件移动。 当流体喷射杆穿过框架组件的长度时，将清洁流体喷洒到卷筒纸上，以便在平坦化循环之间清洁卷材。

公开(公告)号：US07294040B2

公开(公告)日：2007-11-13

申请号：US10641473

申请日：2003-08-14

申请人： Scott E. Moore

发明人： Scott E. Moore

IPC分类号： B24B49/00 ,  B24B51/00 ,  B24B7/00

CPC分类号： B24B37/30 ,  B24B41/061 ,  G05B19/00

摘要： A method and apparatus for planarizing a microelectronic substrate. In one embodiment, one surface of the microelectronic substrate is engaged with a planarizing pad and the opposite surface of the microelectronic substrate is positioned proximate to a substrate support. A bearing liquid, such as a planarizing liquid, is directed toward the second surface of the microelectronic substrate to form a liquid bearing between the substrate and substrate support. The microelectronic substrate can precess relative the substrate support as the substrate support moves relative to the planarizing pad. The substrate support can include a sensor to determine a characteristic, such as a thickness, of the liquid bearing. In another embodiment, a portion of the liquid bearing can be removed from the second surface of the microelectronic substrate to control the thickness of the liquid bearing and/or to remove particulate matter from the liquid bearing.

摘要翻译： 一种用于平面化微电子衬底的方法和装置。 在一个实施例中，微电子衬底的一个表面与平坦化焊盘接合，并且微电子衬底的相对表面位于靠近衬底支撑件的位置。 诸如平坦化液体的轴承液体被引向微电子衬底的第二表面，以在衬底和衬底支撑件之间形成液体支承。 当衬底支撑件相对于平坦化垫移动时，微电子衬底可以相对于衬底支撑件进入。 衬底支撑件可以包括用于确定液体轴承的特性（例如厚度）的传感器。 在另一个实施例中，液体轴承的一部分可以从微电子基板的第二表面移除以控制液体轴承的厚度和/或从液体轴承中去除颗粒物质。

公开(公告)号：US07180591B1

公开(公告)日：2007-02-20

申请号：US09521092

申请日：2000-03-07

申请人： Scott E. Moore ,  Scott G. Meikle ,  Magdel Crum

发明人： Scott E. Moore ,  Scott G. Meikle ,  Magdel Crum

IPC分类号： G01N21/05

CPC分类号： B24B37/04 ,  B24B49/10 ,  B24B57/02

摘要： Semiconductor processors, sensors, semiconductor processing systems, semiconductor workpiece processing methods, and turbidity monitoring methods are provided. According to one aspect, a semiconductor processor includes a process chamber configured to receive a semiconductor workpiece for processing; a supply connection in fluid communication with the process chamber and configured to supply slurry to the process chamber; and a sensor configured to monitor the turbidity of the slurry. Another aspect provides a semiconductor workpiece processing method including providing a semiconductor process chamber; supplying slurry to the semiconductor process chamber; and monitoring the turbidity of the slurry using a sensor.

摘要翻译： 提供半导体处理器，传感器，半导体处理系统，半导体工件处理方法和浊度监测方法。 根据一个方面，一种半导体处理器包括：处理室，被配置为接收用于处理的半导体工件; 供应连接，其与所述处理室流体连通并且被配置为将浆料供应到所述处理室; 以及被配置为监测浆料的浊度的传感器。 另一方面提供一种半导体工件处理方法，包括提供半导体处理室; 向半导体处理室供应浆料; 并使用传感器监测浆料的浊度。

公开(公告)号：US07153410B2

公开(公告)日：2006-12-26

申请号：US10090869

申请日：2002-03-04

申请人： Scott E. Moore ,  Whonchee Lee ,  Scott G. Meikle ,  Trung T. Doan

发明人： Scott E. Moore ,  Whonchee Lee ,  Scott G. Meikle ,  Trung T. Doan

IPC分类号： C25F7/00 ,  C25F3/00

CPC分类号： B24B37/042 ,  B23H5/08 ,  B23H5/10 ,  B24B37/04 ,  B24B49/10 ,  C25D5/06 ,  C25D5/18 ,  C25D5/22 ,  C25D7/12 ,  C25D7/123 ,  C25D17/001 ,  C25D17/10 ,  C25D17/14 ,  C25F3/16 ,  C25F7/00 ,  H01L21/32125

摘要： Methods and apparatuses for electrochemical-mechanical processing of microelectronic workpieces. One embodiment of an electrochemical processing apparatus in accordance with the invention comprises a workpiece holder configured to receive a microelectronic workpiece, a workpiece electrode, a first remote electrode, and a second remote electrode. The workpiece electrode is configured to contact a processing side of the workpiece when the workpiece is received in the workpiece holder. The first and second remote electrodes are spaced apart from the workpiece holder. The apparatus can also include an AC power supply, a DC power supply, and a switching assembly. The switching assembly is coupled to the workpiece electrode, the first remote electrode, the second remote electrode, the AC power supply, and the DC power supply. In operation, the switching assembly couples the AC power supply and/or the DC power supply to the workpiece electrode, the first remote electrode, and/or the second remote electrode for plating, deplating and/or mechanically removing material.

公开(公告)号：US07153195B2

公开(公告)日：2006-12-26

申请号：US10230973

申请日：2002-08-29

申请人： Whonchee Lee ,  Scott E. Moore ,  Scott G. Meikle

发明人： Whonchee Lee ,  Scott E. Moore ,  Scott G. Meikle

IPC分类号： B24B1/00

CPC分类号： B24B37/12 ,  B23H3/00 ,  B23H3/02 ,  B23H5/08 ,  B24B37/046 ,  B24B37/30 ,  C25F3/14 ,  C25F7/00

摘要： Methods and apparatuses for selectively removing conductive materials from a microelectronic substrate. A method in accordance with an embodiment of the invention includes positioning the microelectronic substrate proximate to and spaced apart from an electrode pair that includes a first electrode and a second electrode spaced apart from the first electrode. An electrolytic liquid can be directed through a first flow passage to an interface region between the microelectronic substrate and the electrode pair. A varying electrical signal can be passed through the electrode pair and the electrolytic liquid to remove conductive material from the microelectronic substrate. The electrolytic liquid can be removed through a second flow passage proximate to the first flow passage and the electrode pair.

公开(公告)号：US07001251B2

公开(公告)日：2006-02-21

申请号：US09928173

申请日：2001-08-09

申请人： Trung Tri Doan ,  Scott E. Moore

发明人： Trung Tri Doan ,  Scott E. Moore

IPC分类号： B24B1/00

CPC分类号： B24B37/11 ,  B24B37/14 ,  B24D9/085 ,  B25B11/005

摘要： A method and apparatus for releasably attaching a planarizing medium, such as a polishing pad, to the platen of a chemical-mechanical planarization machine. In one embodiment, the apparatus can include several apertures in the upper surface of the platen that are coupled to a vacuum source. When a vacuum is drawn through the apertures in the platen, the polishing pad is drawn tightly against the platen and may therefore be less likely to wrinkle when a semiconductor substrate is engaged with the polishing pad during planarization. When the vacuum is released, the polishing pad can be easily separated from the platen. The apparatus can further include a liquid trap to separate liquid from the fluid drawn by the vacuum source through the apertures, and can also include a releasable stop to prevent the polishing pad from separating from the platen should the vacuum source be deactivated while the platen is in motion. In another embodiment, a signal can be applied to the platen to draw the polishing pad toward the platen via electrostatic or electromagnetic forces. In still another embodiment, the polishing pad can be attached to a pad support and conditioned on a separate jig.

公开(公告)号：US06969297B2

公开(公告)日：2005-11-29

申请号：US09782892

申请日：2001-02-13

申请人： Scott E. Moore

发明人： Scott E. Moore

IPC分类号： B24B53/00 ,  B24B49/00 ,  B24B49/16 ,  B24B53/007 ,  B24B53/017 ,  B24B53/12 ,  H01L21/304 ,  B24B1/00

CPC分类号： B24B53/017 ,  B24B49/006 ,  B24B49/16 ,  B24B53/12

摘要： A method and apparatus for conditioning and monitoring a planarizing medium used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a conditioning body having a conditioning surface that engages a planarizing surface of the planarizing medium and is movable relative to the planarizing medium. A force sensor is coupled to the conditioning body to detect a frictional force imparted to the conditioning body by the planarizing medium when the conditioning body and the planarizing medium are moved relative to each other. The apparatus can further include a feedback device that controls the motion, position, or force between the conditioning body and the planarizing medium to control the conditioning of the planarizing medium.

摘要翻译： 用于调节和监测用于平坦化微电子衬底的平面化介质的方法和装置。 在一个实施例中，该装置可以包括具有调节表面的调节主体，调节表面接合平坦化介质的平坦化表面并且可相对于平坦化介质移动。 力传感器耦合到调理体，以在调节体和平坦化介质相对于彼此移动时，通过平坦化介质检测施加到调理体的摩擦力。 该装置还可以包括控制调节体和平坦化介质之间的运动，位置或力的反馈装置，以控制平坦化介质的调理。