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    Side view type light emitting diode package
    5.
    发明申请
    Side view type light emitting diode package 审中-公开
    侧视型发光二极管封装

    公开(公告)号：US20090189175A1

    公开(公告)日：2009-07-30

    申请号：US12078117

    申请日：2008-03-27

    申请人： Ik-Seong Park ,  Sun-Hong Kim ,  Jin-Won Lee ,  Kyoung-Il Park

    发明人： Ik-Seong Park ,  Sun-Hong Kim ,  Jin-Won Lee ,  Kyoung-Il Park

    IPC分类号： H01L33/00

    CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Disclosed is a side view light emitting diode (LED) package whose light emitting surface has been relatively expanded. The LED package includes a housing and a lead frame extended externally through the housing and bent in a direction of the recessed space. The housing includes a reflecting housing having a cavity and a supporting housing.

    摘要翻译： 公开了一种其发光表面相对膨胀的侧视发光二极管（LED）封装。 LED封装包括壳体和引线框架，引线框架从外部延伸穿过壳体并在凹陷空间的方向上弯曲。 壳体包括具有空腔和支撑壳体的反射壳体。

    Cooling Device for Light Emitting Diode (LED) Module and Method for Fabricating the Same
    7.
    发明申请
    Cooling Device for Light Emitting Diode (LED) Module and Method for Fabricating the Same 审中-公开
    发光二极管（LED）模块的冷却装置及其制造方法

    公开(公告)号：US20080019103A1

    公开(公告)日：2008-01-24

    申请号：US11685819

    申请日：2007-03-14

    申请人： Dong Soo KIM

    发明人： Dong Soo KIM

    IPC分类号： H05K7/20 ,  H05K3/00

    CPC分类号： F21V29/508 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K1/021 ,  H05K1/182 ,  H05K3/0061 ,  H05K2201/10106 ,  Y10T29/49124 ,  H01L2924/00014

    摘要： A cooling device of a light emitting diode module and a method for fabricating the same are disclosed. According to the cooling device for a light emitting diode module of the present invention, the thickness of the whole module is reduced, a thermal resistance is small since a final heat-releasing path from a heat source is shortened, it is easy to release heat, and processing efficiency is high and manufacturing cost is low because a bending process of a lead frame is removed.

    摘要翻译： 公开了一种发光二极管模块的冷却装置及其制造方法。 根据本发明的发光二极管模块的冷却装置，整个模块的厚度减小，热阻小，因为来自热源的最终散热路径被缩短，容易释放热量 ，并且由于引线框架的弯曲处理被去除，处理效率高，制造成本低。

    LIGHT EMITTING DIODE PACKAGE
    9.
    发明申请
    LIGHT EMITTING DIODE PACKAGE 失效
    发光二极管封装

    公开(公告)号：US20090309122A1

    公开(公告)日：2009-12-17

    申请号：US12483560

    申请日：2009-06-12

    申请人： Sun-Hong Kim ,  Jin-Won Lee ,  Kyoung-Il Park

    发明人： Sun-Hong Kim ,  Jin-Won Lee ,  Kyoung-Il Park

    IPC分类号： H01L23/495

    CPC分类号： H01L33/62 ,  H01L23/49537 ,  H01L33/486 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A light emitting diode package is provided including: a lead frame that includes an electrode pad and an electrode lead that are integrally formed to each other; and a housing, wherein the electrode pad is exposed in a first direction through a window formed by inner walls of the housing, and the electrode lead is exposed in a second direction through a through-hole, wherein the housing includes a step jaw prepared by sinking the housing inner walls.

    摘要翻译： 提供了一种发光二极管封装，包括：引线框架，其包括彼此一体形成的电极焊盘和电极引线; 以及壳体，其中所述电极焊盘通过由所述壳体的内壁形成的窗口沿第一方向暴露，并且所述电极引线通过通孔在第二方向上暴露，其中所述壳体包括由 沉没房屋内墙。