摘要:
Methods and apparatuses for non-optical testing of imaging devices having an array of pixels are provided. One or more pixels are tested by setting the photoconversion device and/or a floating diffusion region to a known voltage level that is different from that used to operate the pixel during non-test operation. The pixel is then sampled and compared to an expected value.
摘要:
A method and apparatus are disclosed which provide a color filter array for an imaging device in which the filters of the array are accurately positioned through the use of a patterned mask layer used to form filters for one color of the array. Additionally or alternatively, the color filter array can have a light blocking spacer to block light from being transmitted between color filters and/or to a peripheral circuitry region.
摘要:
An apparatus and method for measuring the breakpoint of a response curve representing the voltage output of an image array having an extended dynamic range. By flooding a light-opaque pixel with a charge and then applying an intermediate reset voltage to the pixel, the signal is read from the pixel and stored. The full reset voltage is applied to the pixel, and then the signal in the pixel is read and stored. The voltage output difference is the difference between the first and second stored signal. The voltage output difference is then used to determine the voltage of the knee point. Further, a conventional saturated pixel can be reset with an intermediate reset just prior to readout. The resulting signal can then be used to determine the voltage of the knee point.
摘要:
A lens system comprising an inner lens structure and an outer lens structure. The inner lens structure comprises an inner positive lens, a first transparent substrate and an inner negative lens. The outer lens structure comprises an outer positive lens, a second transparent substrate and an outer negative lens.
摘要:
A method and apparatus for improving the planarity of a recessed color filter array when the recessed region or trench depth exceeds the thickness of the color filter film. The method includes the steps of coating the entire wafer with an additional coating material after applying the CFA, then planarizing that resist layer using CMP and then using a dry etch to transfer that planar surface down as far as required to achieve a planar color filter with a uniform thickness.
摘要:
Methods and apparatuses for forming optical packages, and intermediate structures resulting from the same are disclosed, which provide an optical element over a device. The optical element is formed by applying a force to lateral portions of a liquid material layer formed below an elastomeric material layer such that the liquid material layer has a radius of curvature sufficient to direct light to a light sensitive portion of the device, after which the liquid material layer is exposed to conditions which maintain the radius of curvature after the lateral force is removed.
摘要:
Techniques are disclosed for enhancing the speed at which pixel levels are read out and sampled for processing. A method of processing pixel levels includes clamping a pixel readout line to a voltage level less than a voltage corresponding to a signal sensed by an n-MOS pixel. Subsequently, the pixel readout line is coupled to an output of an n-MOS source-follower and the pixel signal is read out onto the pixel readout line through the n-MOS source-follower. The pixel signal that was read out is passed through a p-MOS source-follower to a processing circuit. Before passing the pixel signal through the p-MOS source-follower to the processing circuit, a capacitive storage node in the processing circuit is clamped to a voltage greater than a signal at an input to the p-MOS source-follower. Subsequently, an output of the p-MOS source-follower is coupled to the processing circuit, and a signal corresponding to the pixel signal is stored by the processing circuit. Similar techniques are provided for reading out and sampling p-MOS pixels.
摘要:
Methods for manufacturing microelectronic imaging units and microelectronic imaging units that are formed using such methods are disclosed herein. In one embodiment, a method includes providing a plurality of imaging dies on a microfeature workpiece. The individual imaging dies include an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit. The method further includes attaching a plurality of covers to corresponding imaging dies, cutting the microfeature workpiece to singulate the imaging dies, and coupling the singulated dies to a support member. The covers can be attached to the imaging dies before or after the workpiece is cut.
摘要:
A pixel array resolution is doubled by adding a plurality of second photodiodes, but only a single, common transfer control line. By controlling a combination of the single, common transfer control line and a transfer control line unique to controlling first transfer transistors in pixels in a row, first and second photodiodes in a pixel can be separately readout.
摘要:
A CMOS imaging system with increased charge storage capacitance of pixels yet decreased physical size, kTC noise and active area. A capacitor is linked to the transfer gate and provides a storage node for a pixel, allowing for kTC noise reduction prior to readout. The pixel may be operated with the shutter gate on during the integration period to increase the amount of time for charge storage by a pixel.