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公开(公告)号：US11384268B2
公开(公告)日：2022-07-12
申请号：US16619343
申请日：2018-06-19
IPC分类号： C08G77/12 , C09J183/04 , C08G77/08 , C08K3/36 , C08K5/5435
摘要： A curable silicone composition for die bonding use contains at least (A) an organopolysiloxane having at least two alkenyl groups per molecule, (B) an organopolysiloxane having at least two siloxane units each represented by the formula: RHSiO (wherein R represents a monovalent hydrocarbon group having 1 to 12 carbon atoms and having no aliphatic unsaturated bond) per molecule, (C) a platinum-group metal-based catalyst for hydrosilylation reactions, (D) a hydrosilylation reaction inhibitor and (E) an adhesiveness-imparting agent, wherein the scorch time (ts1), which is defined in JIS K 6300-2, at a die bonding temperature is 20 to 60 seconds, and the 90% vulcanization time [tc(90)] with respect to the maximum torque value during the vulcanization time of 600 seconds is 300 to 500 seconds. The curable silicone composition for die bonding use according to the present invention can adhere a semiconductor chip to a support strongly.
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公开(公告)号：US11257992B2
公开(公告)日：2022-02-22
申请号：US16637531
申请日：2018-08-31
发明人： Eiji Kitaura , Masaaki Amako , Steven Swier
摘要： A method for producing a sealed optical semiconductor device includes: placing inner and outermost layer sealing films on a substrate on which an optical semiconductor element is mounted within a pressure reduction chamber, and reducing the pressure; a step in which the outermost film is heated, and at least the periphery of the outermost film is thermally fused to the surface of the substrate; and a step in which the reduction of pressure is released, and the substrate is sealed by the outermost film and the inner film. The temperature T2 of the substrate when the reduction of pressure is released is a temperature at which the outermost film exhibits a tensile strength of 0.02-0.15 MPa and an elongation at break of 200-450%. The inner film exhibits a loss tangent (tan δ) of 1.6 or more at the temperature T2.
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公开(公告)号：US10988580B2
公开(公告)日：2021-04-27
申请号：US16097911
申请日：2017-04-27
发明人： Seiji Hori , Yasue Kanzaki , Hiroko Taniguchi , Mari Wakita
IPC分类号： C08G77/50 , A61K8/891 , A61Q1/12 , A61Q19/00 , A61Q1/02 , A61Q17/04 , C08G77/08 , C08L83/14 , C09D7/65 , C09D7/40
摘要： Silicone particles having excellent dispersibility are provided. A cosmetic material having excellent feeling of use, and a highly functional paint and an electronic material are also provided.
The silicone particles include a siloxane as a component. A content of a hydrogen atom bonded to a silicon atom per unit mass is 300 ppm or less. In addition, the silicon atom in the siloxane as a component for the silicone particles is crosslinked with another silicon atom via an alkylene group having a carbon number of 4 to 20.-
公开(公告)号：US10968375B2
公开(公告)日：2021-04-06
申请号：US16311235
申请日：2017-06-15
发明人： Takayoshi Otomo , Tomoko Tasaki
IPC分类号： C08G77/38 , C08G77/04 , C08G77/12 , C08G77/20 , C08L83/04 , C09J183/10 , C09J11/00 , C09J4/06 , C08J5/12 , C08G77/00
摘要： A silicone rubber composition comprises: (A) an organopolysiloxane having at least two alkenyl groups in a molecule and free of an aryl group; (B) (B-1) an organosiloxane having in a molecule at least one aryl group, at least one silicon-bonded hydrogen atom, and free of an alkenyl group, or a mixture of components (B-1) and (B-2) an organosiloxane having in a molecule at least one aryl group and at least one alkenyl group; (C) an acrylic compound or a methacrylic compound; (D) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule and free of an aryl group and an alkenyl group; and (E) a hydrosilylation reaction catalyst. The silicone rubber composition exhibits excellent adhesive properties with respect to diverse organic resins it comes into contact with during its cure, and at the same time possesses excellent mold-release properties with respect to metal dies used for its molding.
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公开(公告)号：US10927278B2
公开(公告)日：2021-02-23
申请号：US16488291
申请日：2018-02-02
IPC分类号： C09J183/04 , H01L33/48 , H01L23/00
摘要： The present invention pertains to a curable organopolysiloxane composition comprising at least (A) an organopolysiloxane having at least two alkenyl groups per module, (B) an organopolysiloxane resin represented by average unit formula: (R13SiO1/2)a(R12SiO2/2)b(R2SiO3/2)c(SiO4/2)d. In the formula, R1's are the same or different from each other, and represent a hydrogen atom or a monovalent hydrocarbon group not having an aliphatic unsaturated carbon bond but at least two of the R1's per molecule represent hydrogen atoms, R2 represents a monovalent hydrocarbon group not having an aliphatic unsaturated bond, and a, b, and c are numbers satisfying 0
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公开(公告)号：US10336913B2
公开(公告)日：2019-07-02
申请号：US14912739
申请日：2014-08-27
IPC分类号： C09D183/04 , H01L33/56 , C08L83/04 , C09D5/22 , H01L33/50 , C09D7/61 , C08K5/56 , C08L83/00 , C08L83/14 , C08G77/12 , C08G77/20 , C08K5/54 , C08G77/58
摘要： The present invention relates to a curable silicone composition comprising: (A) a diorganopolysiloxane having at least two alkenyl groups in a molecule, (B) at least two types of resinous organopolysiloxanes having different mass average molecular weights, (C) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, and (D) a hydrosilylation reaction catalyst. The curable silicone composition enables the production of an optical semiconductor device in which the marked viscosity elevation of the resulting composition can be inhibited, in which the fluidity and packing properties are outstanding and that has outstanding gas barrier properties when used as a sealant, and in which the device has outstanding initial optical output efficiency even when organopolysiloxane resin is blended in order to form cured product with moderate hardness and strength.
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公开(公告)号：US20190144612A1
公开(公告)日：2019-05-16
申请号：US16097911
申请日：2017-04-27
发明人： Seiji HORI , Yasue KANZAKI , Hiroko TANIGUCHI , Mari WAKITA
摘要： Silicone particles having excellent dispersibility are provided. A cosmetic material having excellent feeling of use, and a highly functional paint and an electronic material are also provided. The silicone particles include a siloxane as a component. A content of a hydrogen atom bonded to a silicon atom per unit mass is 300 ppm or less. In addition, the silicon atom in the siloxane as a component for the silicone particles is crosslinked with another silicon atom via an alkylene group having a carbon number of 4 to 20.
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公开(公告)号：US10174170B2
公开(公告)日：2019-01-08
申请号：US15310255
申请日：2015-04-20
发明人： Hideko Maeshima , Seiki Tamura
IPC分类号： C08G77/34 , A61Q1/02 , A61Q19/00 , A61K8/892 , C08G77/14 , A61Q17/04 , B01D15/00 , B01D29/01 , B01J20/14 , C08G77/38 , A61Q19/08 , C08G77/00
摘要： A production method of a liquid high-purity polyhydric alcohol derivative-modified silicone or a composition thereof is disclosed. The method comprises: a capturing step 1) of bringing into an impurity-containing composition containing a liquid polyhydric alcohol derivative-modified silicone and hydrophilic impurities originating from a polyhydric alcohol derivative, the polyhydric alcohol derivative being a hydrophilic modifier of the polyhydric alcohol derivative-modified silicone, into contact with solid particles capable of capturing the hydrophilic impurities, and then capturing the hydrophilic impurities with the solid particles; and a separating step 2) of separating the polyhydric alcohol derivative-modified silicone and the solid particles. The method is useful for production of the liquid high-purity polyhydric alcohol derivative-modified silicone and the composition thereof on a commercial scale.
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公开(公告)号：US10150902B2
公开(公告)日：2018-12-11
申请号：US15302555
申请日：2015-03-26
发明人： Tomoko Kato , Harumi Kodama , Masayuki Onishi
摘要： Provided are a thermally conductive silicone composition excelling in heat resistance and thermal conductivity, in which thickening in an uncured state is suppressed, and which has excellent handling ease; and an electrical/electronic apparatus in which the thermally conductive silicone composition is used as a member.The thermally conductive silicone composition comprises (A) 100 parts by mass of either i) (a1) an organopolysiloxane having, in each molecule thereof, at least one alkoxysilyl-containing group bonded to a silicon atom and expressed by the general formula: and as generally described herein, or ii) a mixture of component (a1) and (a2) an organopolysiloxane having in each molecule thereof, at least two alkenyl groups but not the alkoxysilyl-containing group. In the mixture, the content of component (a1) is 10 to less than 100 mass %. The thermally conductive silicone composition further comprises (B) 400 to 3,500 parts by mass of a thermally conductive filler.
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公开(公告)号：US10130579B2
公开(公告)日：2018-11-20
申请号：US15303743
申请日：2015-04-08
发明人： Yuichi Kanaya , Jun Miyano , Akihiro Nakano , Yusuke Narita
IPC分类号： A61K8/891 , A61K8/49 , A61K8/29 , A61K8/34 , A61K8/19 , A61Q1/00 , A61K8/36 , A61K8/02 , A61Q17/04
摘要： A cosmetic material comprises (A) a hydrophobic powder; (B) a carboxylic acid modified silicone; (C) a basic compound; and (D) water. The (A) hydrophobic powder is generally dispersed in an aqueous phase of the cosmetic material. The cosmetic material can provide a refreshing sense of feel during use, and can form a cosmetic film with excellent water resistance on the skin.
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