Metamaterial-based IR emitter having modulatable emissivity

    公开(公告)号:US11874218B2

    公开(公告)日:2024-01-16

    申请号:US17310465

    申请日:2020-02-11

    IPC分类号: G01N21/17 G01N33/00

    摘要: The invention relates to a modulatable infrared emitter comprising a heating element, a planar base element, a dielectric interlayer, and a planar cover element which is a structured metamaterial, and an actuator, wherein the actuator is configured for a relative movement of the cover element and the base element between a first and a second position in order to modulate the intensity of the emission of the infrared emitter. The invention further relates to production methods for the infrared emitter, methods for the modulated emission of infrared red radiation by means of the infrared emitter, and preferred uses of the infrared emitter. A system comprising the infrared emitter and a control device for regulating the actuator are also preferably the subject matter of the invention.

    METAMATERIAL-BASED IR EMITTER HAVING MODULATABLE EMISSIVITY

    公开(公告)号:US20220107263A1

    公开(公告)日:2022-04-07

    申请号:US17310465

    申请日:2020-02-11

    IPC分类号: G01N21/17 G01N33/00

    摘要: The invention relates to a modulatable infrared emitter comprising a heating element, a planar base element, a dielectric interlayer, and a planar cover element which is a structured metamaterial, and an actuator, wherein the actuator is configured for a relative movement of the cover element and the base element between a first and a second position in order to modulate the intensity of the emission of the infrared emitter. The invention further relates to production methods for the infrared emitter, methods for the modulated emission of infrared red radiation by means of the infrared emitter, and preferred uses of the infrared emitter. A system comprising the infrared emitter and a control device for regulating the actuator are also preferably the subject matter of the invention.

    STRAIN-MEASURING STRUCTURE HAVING A STRUCTURED CARRIER

    公开(公告)号:US20210389194A1

    公开(公告)日:2021-12-16

    申请号:US17288473

    申请日:2019-10-24

    IPC分类号: G01L1/22 G01B7/16

    摘要: The invention relates to a strain-measuring structure, comprising a carrier, which is divided into regions along the predetermined breaking points only after being joined to the object to be measured. After the separation along the predetermined breaking points, the regions individually joined in the joining zones can be moved freely relative to one another in the event of strain of the object, without the strain-measuring structure applying significant forces to the object to be measured, which could distort the strain measurement. Measuring assemblies for measuring strain lie between the regions. Said measuring assemblies can be based on different principles, depending on the application. The invention further relates to a method for producing the strain-measuring structure, to a method for measuring the strain of objects, and to the use of the structure to measure strain. The invention further preferably relates to a system comprising the strain-measuring structure and a control device for reading out and preferably activating and joining the structure.

    DEVICE FOR MEASURING DEFORMATIONS, STRESSES, FORCES AND/OR TORQUES IN A PLURALITY OF AXES

    公开(公告)号:US20240167896A1

    公开(公告)日:2024-05-23

    申请号:US18548528

    申请日:2022-03-01

    IPC分类号: G01L1/04 G01L1/18 G01L5/162

    CPC分类号: G01L1/04 G01L1/18 G01L5/162

    摘要: The invention preferably relates to an apparatus for measuring deformations, stresses, forces and/or torques of an object comprising a spring body and a sensor chip, which comprises one or more sensor elements for measuring a deformation, stress, force and/or a torque as well as an electronic circuit on a substrate. The spring body comprises a base plate on the front side of which a force conductor, preferably in the form of a pin, is installed, the sensor chip being positioned on the rear side of the base plate below the force conductor. The invention further relates to a system comprising a described apparatus and a data processing unit, wherein the data processing unit is configured for reading out measured data detected by the sensor chip and preferably detects the forces and/or torques acting on the force conductor based thereon.

    INTERPOSER FOR DAMPING MEMS MICROPHONES
    10.
    发明公开

    公开(公告)号:US20240279049A1

    公开(公告)日:2024-08-22

    申请号:US18570858

    申请日:2022-06-17

    IPC分类号: B81B3/00 B81C1/00

    摘要: In a first aspect, the invention relates to a system comprising a MEMS microphone comprising a sound inlet opening, a vibratable microphone membrane and an electronic circuit, wherein when the microphone membrane is excited by sound waves entering through the sound inlet opening, an electrical signal that is dependent on the sound waves is generated by vibrations of the microphone membrane. A damping element for reducing the sound pressure level of the sound waves acting on the microphone membrane is mounted in front of the sound inlet opening, wherein the damping element comprises an elastic and vibratable damping membrane and wherein, in addition to the microphone membrane, the damping element is induced into vibrations by the sound waves such that the sound energy of the sound waves is divided between the damping membrane and the microphone membrane. This makes it possible in particular to extend the measuring range of the MEMS microphone without distortion to high sound pressure levels that could not previously be measured with the MEMS microphones known in the prior art.
    In a further aspect, the invention relates to the use of the system according to the invention for aeroacoustic measurements, preferably for measuring sound pressure waves on surfaces of a vehicle component.