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公开(公告)号：US07796699B2
公开(公告)日：2010-09-14
申请号：US12324421
申请日：2008-11-26
申请人： Raj Kumar Jain , Sim Hak Keong
发明人： Raj Kumar Jain , Sim Hak Keong
IPC分类号： H04K1/10
CPC分类号： H04L27/2628 , H04L27/2633
摘要： A new protocol is proposed for transmission of data through lines such as telephone lines. The tones of a signal are associated into groups 10, 11, and tone ordering, gain selection, and/or bit swapping within the processing system are done within the members of a group 10, 11. This idea is applicable both to tone ordering etc., following the training stage, and also to the dynamic configuration changes subsequently, for example, bit swapping. The computational cost of coding and decoding the data is reduced (compared to treating all the tones of a given direction equivalently), and the invention makes it possible to significantly reduce the memory requirements of the encoder and decoder.
摘要翻译： 提出了一种新的协议，用于通过诸如电话线的线路传输数据。 信号的音调被关联到组10,11中，并且处理系统内的音调排序，增益选择和/或位交换在组10,11的成员内完成。这个想法适用于音调排序等 在训练阶段之后，以及随后的动态配置变化，例如位交换。 数字编码和解码的计算成本降低（与处理给定方向的所有音调相当），本发明可以显着降低编码器和解码器的存储器要求。
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公开(公告)号：US20170010092A1
公开(公告)日：2017-01-12
申请号：US15272285
申请日：2016-09-21
发明人： Thomas Zell , Horst Kittner
IPC分类号： G01B11/27 , H01L23/544 , H01L21/68
CPC分类号： G01B11/272 , G01B11/27 , H01L21/681 , H01L23/544 , H01L2223/54426
摘要： An apparatus for detecting a pre-aligning element at a wafer and a method for pre-aligning a wafer are disclosed. In an embodiment, the apparatus includes a sensor arrangement configured to illuminate subsequent edge portions of the wafer edge and to output a first and a second sensor signal, wherein the first sensor signal is based on the transmitted fractions of the illumination and the second sensor signal is based on the reflected fractions of the illumination; and an evaluation unit configured to evaluate the first sensor signal and to determine a first position information indicating a coarse position of the pre-aligning element, and, after having determined the first position information, to determine a second position information based on the second sensor signal and the first position information, wherein the second position information indicates a fine position of the pre-aligning element.
摘要翻译： 公开了一种用于检测晶片上的预对准元件的装置和用于预定位晶片的方法。 在一个实施例中，该装置包括被配置为照亮晶片边缘的后续边缘部分并输出第一和第二传感器信号的传感器装置，其中第一传感器信号基于照射的传输分数和第二传感器信号 基于照明的反射分数; 以及评估单元，被配置为评估所述第一传感器信号并确定指示所述预对准元件的粗略位置的第一位置信息，并且在确定了所述第一位置信息之后，基于所述第二传感器确定第二位置信息 信号和第一位置信息，其中第二位置信息指示预对准元件的精细位置。
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公开(公告)号：US20230138972A1
公开(公告)日：2023-05-04
申请号：US17512984
申请日：2021-10-28
发明人： Ajayan Vijayakumaran Nair , David Michael Addison , Markus Bichl , Moustafa Samy Abdelkhalek Ahmed Emara , Andre Roger , Dyson Wilkes
IPC分类号： G01S7/35
摘要： In some methods, sampled values based on a reception signal are stored in rows and columns of a memory array. A first 1-dimensional (1D) detector is moved in a first direction over the memory array. The first 1D detector includes a first cell under test and first and second training cells on opposite sides of the first cell under test. The first cell under test and the first and second training cells of the first 1D detector being aligned in the first direction. A second 1D detector is moved over the memory array. The second 1D detector includes a second cell under test and third and fourth training cells on opposite sides of the second cell under test. The second cell under test and the third and fourth training cells of the second 1D detector are aligned in a second direction that is perpendicular to the first direction.
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公开(公告)号：US11640386B2
公开(公告)日：2023-05-02
申请号：US17153404
申请日：2021-01-20
发明人： Ulf Seidel
IPC分类号： G06F16/23
摘要： According to an embodiment, a processing circuit includes: a data acquisition circuit configured to acquire process data and measurement data of a processing arrangement, the process data including a plurality of process event data in accordance with a plurality of process events and the measurement data including a plurality of measurement event data in accordance with a plurality of measurement events; a data merging circuit configured to provide state information, the state information representing a status of the processing arrangement, and accuracy information representing an accuracy of the state information; wherein the data merging circuit is further configured to update the state information based on the acquired process event data, wherein the accuracy of the state information is decreased, and, independently from updating the state information, to downdate the state information based on the acquired measurement event data, wherein the accuracy of the state information is increased.
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公开(公告)号：US11640332B1
公开(公告)日：2023-05-02
申请号：US17502300
申请日：2021-10-15
发明人： Sunanda Manjunath , Jens Rosenbusch
摘要： Systems, methods, and circuitries are provided for checking integrity of code received from an external memory. In one example, a system includes a non-volatile memory and a controller. The non-volatile memory includes a first partition configured to store first data corresponding to program code and a second partition configured to store second data corresponding to a copy of the first data. The controller that includes a processor and comparator circuitry. The comparator circuitry is configured to receive a portion of the first data and a corresponding portion of the second data, compare the portion of the first data to the portion of the second data, when the portion of the first data matches the portion of the second data, provide the portion of the first data to the processor, and when the portion of the first data does not match the portion of the second data, generate an alarm signal.
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公开(公告)号：US11640208B2
公开(公告)日：2023-05-02
申请号：US16691021
申请日：2019-11-21
发明人： Souvik Hazra , Ashutosh Baheti , Avik Santra
摘要： A method for operating a distributed neural network having a plurality of intelligent devices and a server includes: generating, by a first intelligent device of the plurality of intelligent devices, a first output using a first neural network model running on the first intelligent device and using a first input vector to the first neural network model; outputting, by the first intelligent device, the first output; receiving, by the first intelligent device, a gesture feedback on the first output from a user; determining, by the first intelligent device, a user rating of the first output from the gesture feedback; labeling, by the first intelligent device, the first input vector with a first label in accordance with the user rating; and training, by the first intelligent device, the first neural network model using the first input vector and the first label.
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公开(公告)号：US11639983B2
公开(公告)日：2023-05-02
申请号：US17302328
申请日：2021-04-30
发明人： Andre Roger , Markus Bichl , Dian Tresna Nugraha , Romain Ygnace
摘要： A radar sensor is described herein. In accordance with one example embodiment the radar sensor includes a transmitter for transmitting an RF signal and a receiver configured to receive a respective back-scattered signal from at least one radar target and to provide a corresponding digital radar signal. The radar sensor further includes a processor configured to convert the digital radar signal into the frequency do-main thus providing respective frequency domain data and to compress the frequency domain data. A communication interface is configured to transmit the compressed frequency domain data via a communication link operably coupled to the communication interface. Furthermore, respective and related radar methods and systems are described.
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8.发明申请公开(公告)号：US20230125859A1
公开(公告)日：2023-04-27
申请号：US17974592
申请日：2022-10-27
IPC分类号： H01L21/265 , H01L29/06 , H01L21/324
摘要： A method of manufacturing a semiconductor device in a semiconductor body having a first surface and a second surface is proposed. The method includes implanting protons through the second surface into the semiconductor body. The method further includes implanting ions through the second surface into the semiconductor body. The ions are ions of a non-doping element having an atomic number of at least 9. Thereafter, the method further includes processing the semiconductor body by thermal annealing.
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公开(公告)号：US20230125452A1
公开(公告)日：2023-04-27
申请号：US17509746
申请日：2021-10-25
发明人： Ryan Tordillo Comadre , Victor Dela Cruz Del Rosario , Bernie Tabanao Rosales , Subaramaniym Senivasan , Heng Chen Tang
IPC分类号： H01L23/40
摘要： A semiconductor package includes a lead frame that includes a die pad and a plurality of leads, a semiconductor die mounted on a die attach surface of the die pad, an encapsulant body of electrically insulating material that covers semiconductor die and portions of the lead frame, and a fastener receptacle that includes a blind hole in the encapsulant body or the die pad, wherein a rear surface of the die pad is exposed from a first main face of the encapsulant body.
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公开(公告)号：US20230121912A1
公开(公告)日：2023-04-20
申请号：US17451562
申请日：2021-10-20
摘要： A microphone includes an amplifier coupled to an input node of the microphone; a shock detector coupled to the input node of the microphone; and a recovery circuit having an input coupled to an output of the shock detector, and an output coupled to the input of the microphone.
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