摘要:
An optical device includes: an axis member including a plate-shaped attachment portion and an elastic support portion that swingably supports the attachment portion around a predetermined axis; a rigid member attached to one side of the attachment portion; and a light reflecting member attached to the other side of the attachment portion and having an area larger than that of the attachment portion.
摘要:
A light deflecting element includes: a movable plate provided with a light reflecting section having light reflectivity; a support section; a coupling section adapted to couple the movable plate rotatably to the support section; and a magnet disposed on an opposite surface of the movable plate to the light reflecting section, wherein the coupling section has a shape having a width gradually increasing in a direction from a side of the light reflecting section toward a side of the magnet in a cross-sectional view perpendicular to a rotational axis of the movable plate.
摘要:
An image forming apparatus includes: a first projector that scans light on a first display section to thereby display an image; a second projector that scans the light on a second display section, which is set in a position different from a position of the first display section, to thereby display an image; and a switching section that switches plural states including a first state in which the first projector displays the image on the first display section and a second state in which the second projector displays an image on the second display section.
摘要:
A movable structural body formed over a semiconductor substrate is covered with a sacrifice film. The sacrifice film is covered with a silicon oxide film. Further, through holes are defined in the silicon oxide film. The sacrifice film is removed through the through holes to form space between the movable structural body and the silicon oxide film. Aluminum or an aluminum alloy high in flowability is deposited over the silicon oxide film by a sputtering method to seal the through holes.
摘要:
An adhesion layer for causing a plug for electrically connecting a lower wiring and an upper wiring opposite to each other with an interlayer insulating film interposed therebetween to adhere to the interlayer insulating film is formed within a through hole for forming the plug, based on a predetermined aspect ratio represented by a ratio of a depth dimension of the through hole to a diameter dimension of the through hole.
摘要:
A first insulating film, a first wiring layer and a second insulating film are successively formed over a semiconductor substrate. A resist mask is patterned over the second insulating film, and isotropic etching and anisotropic etching are successively carried out to define a plurality of via holes within the second insulating film. The via holes thus have a first portion formed by the isotropic etching and a second portion formed by the anisotropic etching. The resist mask is removed, and a high melting-point metal film is formed over the second insulating film so as to be embedded in the plurality of via holes. The high melting-point metal film and the second insulating film are then polished down to the first portion of each of the via holes such that respective portions of the high melting-point metal film formed within adjacent ones of the plurality of via holes are isolated from each other. A second wiring layer is then formed so as to be electrically connected to the first wiring layer through the portions of the high melting-point metal film formed within the plurality of via holes.
摘要:
A semiconductor device is comprised of a first wire that has a plurality of via holes formed in the vicinity of an end thereof and that is connected to a conductor of a different layer through the via holes, and a plurality of slits that are provided parallel to the direction in which the first wire extends and that split the first wire into a plurality of second wires over a predetermined distance from the end thereof. Another semiconductor device is comprised of a first wire, a second wire that is on a layer different from that of the first wire and that extends in a direction at right angles to the first wire, a connection area where a portion in the vicinity of an end of the first wire intersects with a portion in the vicinity of an end of the second wire, a plurality of first slits that are provided parallel to the direction in which the first wire extends and that divide the first wire into a plurality of third wires over only a predetermined distance from an end of the first wire, and a plurality of second slits that are provided parallel to the direction in which the second wire extends and that divide the second wire into a plurality of fourth wires over only a predetermined distance from an end of the second wire, and a plurality of via holes that are formed in the connection area and that connect the plurality of third wires and the plurality of fourth wires.
摘要:
A semiconductor having multi-layer metalization which has a metal layer between aluminum alloy and metal nitride layers, that prevents failure of interconnects when electromigration causes a discontinuity in the aluminum alloy layer. In a one embodiment, the metal of the metal layer and the metal of the nitride layer are both the same metal, such as titanium. In a method of manufacturing the semiconductor device, an insulating layer is formed on a surface of a semiconductor substrate, and in vacuum chambers, the alloy layer is formed on the insulating layer, a metal layer is formed on the alloy layer, and a metal nitride layer is formed on the metal layer in an nitrogen atmosphere. Sputtering, such as DC magnetron sputtering, RF-bias sputtering, or thermal evaporation deposition, may be used to apply the respective nitride, metal and alloy layers. If the same metal is used for the metal layer and the nitride layer, the same vacuum chamber may be used to apply both layers, by replacing an inert gas atmosphere used during metal layer deposition by a nitrogen gas atmosphere for use during the nitride layer deposition.
摘要:
An actuator includes a mass section; a support section; a coupling section for coupling the mass section rotatably to the support section so as to support the mass section with cantilever structure; and a pair of driving sources including a piezoelectric element for rotating the mass section, wherein the pair of driving sources are provided separately from each other with respect to a central axis of rotation of the mass section, each of the driving sources is provided slidably with respect to the coupling section or the support section, and the actuator is structured such that it causes the pair of piezoelectric elements to expand and contract in phases opposite to each other, so as to rotate at least a part of the coupling section while torsionally deforming the mass section.
摘要:
An optical deflector has: a movable plate having a reflecting surface and a side surface; and a support portion that supports the movable plate in such a manner that the movable plate is able to rotate around a predetermined axis, in which the side surface of the movable plate is recessed toward the axis.