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公开(公告)号：US20130032391A1
公开(公告)日：2013-02-07
申请号：US13196661
申请日：2011-08-02
Applicant: Kengo Morioka , Arne Knudsen , Shingo Satou , Hidekazu Otomaru , Hiroshi Makino , Andrew Thom , Markus Reiterer , Gordon Munns , Thomas Miltich , Joyce Yamamoto
Inventor： Kengo Morioka , Arne Knudsen , Shingo Satou , Hidekazu Otomaru , Hiroshi Makino , Andrew Thom , Markus Reiterer , Gordon Munns , Thomas Miltich , Joyce Yamamoto
CPC classification number: A61N1/375 , A61N1/3754 , Y10T29/49117
Abstract: A hermetic feedthrough for an implantable medical device includes an insulator, a conduit integrated with the insulator, and a pad coupled to an exterior surface of the insulator. The insulator includes a first material and the conduit includes a second material that is electrically conductive. The pad is configured to receive a lead coupled thereto. Further, the pad is electrically conductive and coupled to the conduit. The pad includes a first layer and a second layer overlaying at least a portion of the first layer.
Abstract translation: 用于可植入医疗装置的密封馈通包括绝缘体，与绝缘体一体化的导管以及耦合到绝缘体的外表面的垫。 绝缘体包括第一材料，导管包括导电的第二材料。 垫被配置为接收耦合到其上的引线。 此外，垫是导电的并且连接到导管。 垫包括覆盖第一层的至少一部分的第一层和第二层。
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公开(公告)号：US08670829B2
公开(公告)日：2014-03-11
申请号：US13196695
申请日：2011-08-02
Applicant: Kengo Morioka , Keiichi Fujii , Arne Knudsen , Shingo Satou , Hidekazu Otomaru , Hiroshi Makino , Andrew Thom , Markus Reiterer , Gordon Munns , Thomas Miltich , Joyce Yamamoto
Inventor： Kengo Morioka , Keiichi Fujii , Arne Knudsen , Shingo Satou , Hidekazu Otomaru , Hiroshi Makino , Andrew Thom , Markus Reiterer , Gordon Munns , Thomas Miltich , Joyce Yamamoto
IPC: A61N1/375
CPC classification number: A61N1/3754 , H01B17/30 , H05K1/0306 , H05K1/09 , H05K1/112 , H05K3/0044 , H05K3/4046 , Y10T29/49117
Abstract: A hermetic feedthrough for an implantable medical device includes an insulator, a conduit configured to conduct electricity through the insulator, and a ferrule coupled to the insulator. The insulator is formed from a ceramic material and the conduit and insulator have a co-fired bond therebetween, which hermetically seals the conduit with the insulator. The insulator is elongate and has opposing ends that include flat surfaces and the ferrule includes a frame for receiving the insulator.
Abstract translation: 用于可植入医疗装置的密封馈通包括绝缘体，被配置为通过绝缘体导电的导管以及耦合到绝缘体的套圈。 绝缘体由陶瓷材料形成，并且导管和绝缘体之间具有共烧结合，其间绝缘体密封导管。 绝缘体是细长的并且具有包括平坦表面的相对端，并且套圈包括用于接收绝缘体的框架。
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公开(公告)号：US08588916B2
公开(公告)日：2013-11-19
申请号：US13196661
申请日：2011-08-02
Applicant: Kengo Morioka , Arne Knudsen , Shingo Satou , Hidekazu Otomaru , Hiroshi Makino , Andrew Thom , Markus Reiterer , Gordon Munns , Thomas Miltich , Joyce Yamamoto
Inventor： Kengo Morioka , Arne Knudsen , Shingo Satou , Hidekazu Otomaru , Hiroshi Makino , Andrew Thom , Markus Reiterer , Gordon Munns , Thomas Miltich , Joyce Yamamoto
IPC: A61N1/375
CPC classification number: A61N1/375 , A61N1/3754 , Y10T29/49117
Abstract: A hermetic feedthrough for an implantable medical device includes an insulator, a conduit integrated with the insulator, and a pad coupled to an exterior surface of the insulator. The insulator includes a first material and the conduit includes a second material that is electrically conductive. The pad is configured to receive a lead coupled thereto. Further, the pad is electrically conductive and coupled to the conduit. The pad includes a first layer and a second layer overlaying at least a portion of the first layer.
Abstract translation: 用于可植入医疗装置的密封馈通包括绝缘体，与绝缘体一体化的导管以及耦合到绝缘体的外表面的垫。 绝缘体包括第一材料，导管包括导电的第二材料。 垫被配置为接收耦合到其上的引线。 此外，垫是导电的并且连接到导管。 垫包括覆盖第一层的至少一部分的第一层和第二层。
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公开(公告)号：US20130032378A1
公开(公告)日：2013-02-07
申请号：US13564475
申请日：2012-08-01
Applicant: Kengo Morioka , Arne Knudsen , Shingo Satou , Hidekazu Otomaru , Andrew Thom , Hiroshi Makino , Markus Reiterer , Gordon Munns , Thomas Miltich , Joyce Yamamoto , Takahito Hirata
Inventor： Kengo Morioka , Arne Knudsen , Shingo Satou , Hidekazu Otomaru , Andrew Thom , Hiroshi Makino , Markus Reiterer , Gordon Munns , Thomas Miltich , Joyce Yamamoto , Takahito Hirata
CPC classification number: A61N1/3754
Abstract: A hermetic feedthrough for an implantable medical device includes a sheet having a hole, where the sheet includes a ceramic comprising alumina. The feedthrough also includes a second material substantially filling the hole, where the second material includes a platinum powder mixture and an alumina additive. The platinum powder mixture includes a first platinum powder having a median particle size of between approximately 3 and 10 micrometers and a second platinum powder that is coarser than the first platinum powder and has a median particle size of between approximately 5 and 20 micrometers. The platinum powder mixture includes between approximately 50 and 80 percent by weight of the first platinum powder and between approximately 20 and 50 percent by weight of the second platinum powder. The first and second materials have a co-fired bond therebetween that hermetically seals the hole.
Abstract translation: 用于可植入医疗装置的密封馈通包括具有孔的片，其中片包括包含氧化铝的陶瓷。 馈通还包括基本上填充孔的第二材料，其中第二材料包括铂粉末混合物和氧化铝添加剂。 铂粉末混合物包括中值粒径在约3微米至10微米之间的第一铂粉末和比第一铂粉末粗的第二铂粉末，其中位粒度在约5微米至20微米之间。 铂粉末混合物包含第一铂粉末的约50至80重量％和第二铂粉末的约20至50重量％。 第一和第二材料之间具有共烧结，密封该孔。
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Patent Agency Ranking
公开(公告)号：US08872035B2
公开(公告)日：2014-10-28
申请号：US13564475
申请日：2012-08-01
Applicant: Kengo Morioka , Arne Knudsen , Shingo Satou , Hidekazu Otomaru , Andrew Thom , Hiroshi Makino , Markus Reiterer , Gordon Munns , Thomas Miltich , Joyce Yamamoto , Takahito Hirata
Inventor： Kengo Morioka , Arne Knudsen , Shingo Satou , Hidekazu Otomaru , Andrew Thom , Hiroshi Makino , Markus Reiterer , Gordon Munns , Thomas Miltich , Joyce Yamamoto , Takahito Hirata
CPC classification number: A61N1/3754
Abstract: A hermetic feedthrough for an implantable medical device includes a sheet having a hole, where the sheet includes a ceramic comprising alumina. The feedthrough also includes a second material substantially filling the hole, where the second material includes a platinum powder mixture and an alumina additive. The platinum powder mixture includes a first platinum powder having a median particle size of between approximately 3 and 10 micrometers and a second platinum powder that is coarser than the first platinum powder and has a median particle size of between approximately 5 and 20 micrometers. The platinum powder mixture includes between approximately 50 and 80 percent by weight of the first platinum powder and between approximately 20 and 50 percent by weight of the second platinum powder. The first and second materials have a co-fired bond therebetween that hermetically seals the hole.
Abstract translation: 用于可植入医疗装置的密封馈通包括具有孔的片，其中片包括包含氧化铝的陶瓷。 馈通还包括基本上填充孔的第二材料，其中第二材料包括铂粉末混合物和氧化铝添加剂。 铂粉末混合物包括中值粒径在约3微米至10微米之间的第一铂粉末和比第一铂粉末粗的第二铂粉末，其中位粒度在约5微米至20微米之间。 铂粉末混合物包含第一铂粉末的约50至80重量％和第二铂粉末的约20至50重量％。 第一和第二材料之间具有共烧结，密封该孔。
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公开(公告)号：US08841558B2
公开(公告)日：2014-09-23
申请号：US13196683
申请日：2011-08-02
Applicant: Kengo Morioka , Arne Knudsen , Shingo Satou , Hidekazu Otomaru , Andrew Thom , Hiroshi Makino , Markus Reiterer , Gordon Munns , Thomas Miltich , Joyce Yamamoto
Inventor： Kengo Morioka , Arne Knudsen , Shingo Satou , Hidekazu Otomaru , Andrew Thom , Hiroshi Makino , Markus Reiterer , Gordon Munns , Thomas Miltich , Joyce Yamamoto
CPC classification number: A61N1/3754 , C22C32/0021
Abstract: A feedthrough includes a sheet having a hole, where the sheet includes a first material that is a ceramic comprising alumina. The feedthrough further includes a second material substantially filling the hole. The second material is different than the first material and includes platinum and an additive that includes alumina. The first and second materials have a co-fired bond therebetween that hermetically seals the hole.
Abstract translation: 馈通包括具有孔的片，其中片包括作为包含氧化铝的陶瓷的第一材料。 馈通还包括基本上填充孔的第二材料。 第二种材料与第一种材料不同，并且包括铂和包括氧化铝的添加剂。 第一和第二材料之间具有共烧结，密封该孔。
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公开(公告)号：US20130032392A1
公开(公告)日：2013-02-07
申请号：US13196695
申请日：2011-08-02
Applicant: Kengo Morioka , Keiichi Fujii , Arne Knudsen , Shingo Satou , Hidekazu Otomaru , Hiroshi Makino , Andrew Thom , Markus Reiterer , Gordon Munns , Thomas Miltich , Joyce Yamamoto
Inventor： Kengo Morioka , Keiichi Fujii , Arne Knudsen , Shingo Satou , Hidekazu Otomaru , Hiroshi Makino , Andrew Thom , Markus Reiterer , Gordon Munns , Thomas Miltich , Joyce Yamamoto
CPC classification number: A61N1/3754 , H01B17/30 , H05K1/0306 , H05K1/09 , H05K1/112 , H05K3/0044 , H05K3/4046 , Y10T29/49117
Abstract: A hermetic feedthrough for an implantable medical device includes an insulator, a conduit configured to conduct electricity through the insulator, and a ferrule coupled to the insulator. The insulator is formed from a ceramic material and the conduit and insulator have a co-fired bond therebetween, which hermetically seals the conduit with the insulator. The insulator is elongate and has opposing ends that include flat surfaces and the ferrule includes a frame for receiving the insulator.
Abstract translation: 用于可植入医疗装置的密封馈通包括绝缘体，被配置为通过绝缘体导电的导管以及耦合到绝缘体的套圈。 绝缘体由陶瓷材料形成，并且导管和绝缘体之间具有共烧结合，其间绝缘体密封导管。 绝缘体是细长的并且具有包括平坦表面的相对端，并且套圈包括用于接收绝缘体的框架。
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公开(公告)号：US20130032382A1
公开(公告)日：2013-02-07
申请号：US13196683
申请日：2011-08-02
Applicant: Kengo Morioka , Arne Knudsen , Shingo Satou , Hidekazu Otomaru , Andrew Thom , Hiroshi Makino , Markus Reiterer , Gordon Munns , Thomas Miltich , Joyce Yamamoto
Inventor： Kengo Morioka , Arne Knudsen , Shingo Satou , Hidekazu Otomaru , Andrew Thom , Hiroshi Makino , Markus Reiterer , Gordon Munns , Thomas Miltich , Joyce Yamamoto
CPC classification number: A61N1/3754 , C22C32/0021
Abstract: A feedthrough includes a sheet having a hole, where the sheet includes a first material that is a ceramic comprising alumina. The feedthrough further includes a second material substantially filling the hole. The second material is different than the first material and includes platinum and an additive that includes alumina. The first and second materials have a co-fired bond therebetween that hermetically seals the hole.
Abstract translation: 馈通包括具有孔的片，其中片包括作为包含氧化铝的陶瓷的第一材料。 馈通还包括基本上填充孔的第二材料。 第二种材料与第一种材料不同，并且包括铂和包括氧化铝的添加剂。 第一和第二材料之间具有共烧结，密封该孔。
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9.发明申请公开(公告)号：US20110048770A1
公开(公告)日：2011-03-03
申请号：US12693772
申请日：2010-01-26
Applicant: Markus Reiterer , Brad C. Tischendorf , Andrew Thom
Inventor： Markus Reiterer , Brad C. Tischendorf , Andrew Thom
CPC classification number: H01B19/00 , A61N1/3754 , B22F3/225 , B22F5/10 , B22F7/062 , B22F7/08 , C04B37/021 , C04B2237/343 , C04B2237/348 , C04B2237/365 , C04B2237/368 , C04B2237/403 , C04B2237/405 , C04B2237/406 , C04B2237/408 , C04B2237/62 , C22C14/00 , C22C19/007 , C22C19/03
Abstract: Feedthrough assemblies and methods of manufacturing feedthrough assemblies are provided. Methods include molding a ferrule comprising titanium using metal injection molding and positioning the ferrule about at least a portion of an insulator, the insulator comprising alumina. Methods also include overmolding a ferrule about at least a portion of an insulator using metal injection molding, the ferrule comprising titanium and the insulator comprising alumina. Sintering densifies the ferrule and provides a hermetic seal between the ferrule and insulator. The insulator may be fired or unfired prior to sintering of the ferrule.
Abstract translation: 提供馈通组件和制造馈通组件的方法。 方法包括使用金属注射成型模制包含钛的套圈，并且将套圈围绕绝缘体的至少一部分定位，所述绝缘体包括氧化铝。 方法还包括使用金属注射成型将套圈围绕绝缘体的至少一部分进行包覆模制，所述套圈包括钛，绝缘体包括氧化铝。 烧结使套圈密实，并在套圈和绝缘体之间提供密封。 绝缘体可以在烧结之前被烧制或未烧结。
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