公开(公告)号：US06284998B1

公开(公告)日：2001-09-04

申请号：US09452241

申请日：1999-12-01

申请人： Peter Joseph Sinkunas ,  Andrew Zachary Glovatsky ,  Bernard Allen Meyer ,  Zhong-You Joe Shi ,  Myron Lemecha ,  Rexanne M. Coyner

发明人： Peter Joseph Sinkunas ,  Andrew Zachary Glovatsky ,  Bernard Allen Meyer ,  Zhong-You Joe Shi ,  Myron Lemecha ,  Rexanne M. Coyner

IPC分类号： B23K2620

CPC分类号： B23K26/20 ,  B23K1/0056 ,  B23K2101/40 ,  H01L2224/75253 ,  H01L2224/81224 ,  H01L2924/01087 ,  H01L2924/01322 ,  H05K3/3494 ,  H05K2201/0108 ,  H05K2203/107

摘要： There is disclosed herein a method for laser soldering, comprising the steps of: (a) providing an electronic component 10 having at least two terminations thereon; a dielectric substrate 14 having a first surface 16 on a first side thereof, a second surface on a second side thereof, and at least two mounting pads 24 arranged on the first surface 16 in matched relation with the terminations of the electronic component 10; and a diode laser 50; (b) depositing solder paste atop the mounting pads 24; (c) placing the electronic component 10 atop the substrate 14 such that each termination rests generally atop its respective mounting pad 24; and (d) directing laser energy 70 from the diode laser 50 to at least one of the mounting pads 24 from the second side of the substrate 14 for a predetermined time, such that the solder paste atop the at least one of the mounting pads 24 is melted.

摘要翻译： 这里公开了一种用于激光焊接的方法，包括以下步骤：（a）提供其上具有至少两个终端的电子部件10; 电介质基板14，其第一面上具有第一表面16，在其第二侧上具有第二表面，以及至少两个安装焊盘24，其布置在第一表面16上，与电子部件10的端接部相配合; 和二极管激光器50; （b）在安装焊盘24的上方沉积焊膏; （c）将电子部件10放置在基板14的顶部，使得每个端子大致位于其相应的安装焊盘24的顶部; 以及（d）将来自二极管激光器50的激光能量70从衬底14的第二侧引导到至少一个安装焊盘24预定的时间，使得焊膏位于至少一个安装焊盘24的顶部 被融化

公开(公告)号：US5917704A

公开(公告)日：1999-06-29

申请号：US944700

申请日：1997-10-06

申请人： John Trublowski ,  Andrew Z. Glovatsky ,  Richard Keith McMillan, II ,  Bernard Allen Meyer

发明人： John Trublowski ,  Andrew Z. Glovatsky ,  Richard Keith McMillan, II ,  Bernard Allen Meyer

IPC分类号： H01L23/31 ,  H01L23/433 ,  H05K1/02 ,  H05K3/34 ,  H05K7/20

CPC分类号： H01L23/4334 ,  H01L23/3121 ,  H05K3/341 ,  H01L2224/48247 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/0206 ,  H05K2201/0112 ,  H05K2201/09909 ,  H05K2201/10166 ,  H05K2201/10969 ,  H05K2203/107 ,  H05K3/3452 ,  H05K3/3494 ,  Y02P70/613

摘要： There is disclosed herein an electronic component 10 having an integral heat spreader 16 specially designed to assist in laser soldering of the heat spreader to a solder pad 22 on a substrate 20. The component 10 has a top surface 30, a bottom surface 32 generally parallel to the top surface, and at least one perimeter outer surface 34 generally orthogonal to and between the top and bottom surfaces. The component 10 comprises: a circuit portion 12; at least one termination 14 connected to the circuit portion 12 and extending outward therefrom; a heat spreader 16 portion situated generally beneath and in thermal contact with the circuit portion 12; and a body portion 18 enclosing at least a top surface of the circuit portion 12 and a part of each termination 14 proximate the circuit portion 12. The heat spreader 16 defines at least part of the bottom surface 32 of the electronic component 10 and at least part of the at least one perimeter outer surface 34 of the electronic component 10.

摘要翻译： 这里公开了一种具有整体散热器16的电子部件10，其特别设计用于辅助将散热器激光焊接到衬底20上的焊盘22上。部件10具有顶表面30，大体平行的底表面32 至少一个周边外表面34，大体上垂直于顶表面和底表面之间。 部件10包括：电路部分12; 连接到电路部分12并从其向外延伸的至少一个终端14; 位于通常在电路部分12下方并与电路部分12热接触的散热器16部分; 以及封闭电路部分12的至少顶表面的主体部分18和靠近电路部分12的每个端接件14的一部分。散热器16限定电子部件10的至少一部分底表面32，并且至少 电子部件10的至少一个周边外表面34的一部分。