公开(公告)号：US5917704A

公开(公告)日：1999-06-29

申请号：US944700

申请日：1997-10-06

申请人： John Trublowski ,  Andrew Z. Glovatsky ,  Richard Keith McMillan, II ,  Bernard Allen Meyer

发明人： John Trublowski ,  Andrew Z. Glovatsky ,  Richard Keith McMillan, II ,  Bernard Allen Meyer

IPC分类号： H01L23/31 ,  H01L23/433 ,  H05K1/02 ,  H05K3/34 ,  H05K7/20

CPC分类号： H01L23/4334 ,  H01L23/3121 ,  H05K3/341 ,  H01L2224/48247 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/0206 ,  H05K2201/0112 ,  H05K2201/09909 ,  H05K2201/10166 ,  H05K2201/10969 ,  H05K2203/107 ,  H05K3/3452 ,  H05K3/3494 ,  Y02P70/613

摘要： There is disclosed herein an electronic component 10 having an integral heat spreader 16 specially designed to assist in laser soldering of the heat spreader to a solder pad 22 on a substrate 20. The component 10 has a top surface 30, a bottom surface 32 generally parallel to the top surface, and at least one perimeter outer surface 34 generally orthogonal to and between the top and bottom surfaces. The component 10 comprises: a circuit portion 12; at least one termination 14 connected to the circuit portion 12 and extending outward therefrom; a heat spreader 16 portion situated generally beneath and in thermal contact with the circuit portion 12; and a body portion 18 enclosing at least a top surface of the circuit portion 12 and a part of each termination 14 proximate the circuit portion 12. The heat spreader 16 defines at least part of the bottom surface 32 of the electronic component 10 and at least part of the at least one perimeter outer surface 34 of the electronic component 10.

摘要翻译： 这里公开了一种具有整体散热器16的电子部件10，其特别设计用于辅助将散热器激光焊接到衬底20上的焊盘22上。部件10具有顶表面30，大体平行的底表面32 至少一个周边外表面34，大体上垂直于顶表面和底表面之间。 部件10包括：电路部分12; 连接到电路部分12并从其向外延伸的至少一个终端14; 位于通常在电路部分12下方并与电路部分12热接触的散热器16部分; 以及封闭电路部分12的至少顶表面的主体部分18和靠近电路部分12的每个端接件14的一部分。散热器16限定电子部件10的至少一部分底表面32，并且至少 电子部件10的至少一个周边外表面34的一部分。

公开(公告)号：US5979043A

公开(公告)日：1999-11-09

申请号：US892463

申请日：1997-07-14

申请人： Jay DeAvis Baker ,  Robert Edward Belke, Jr. ,  Daniel Phillip Dailey ,  Andrew Z. Glovatsky ,  Richard Keith McMillan, II

发明人： Jay DeAvis Baker ,  Robert Edward Belke, Jr. ,  Daniel Phillip Dailey ,  Andrew Z. Glovatsky ,  Richard Keith McMillan, II

IPC分类号： B29C45/14 ,  H05K1/00 ,  H05K3/00 ,  H05K3/46 ,  H05K3/36

CPC分类号： H05K3/4635 ,  B29C45/14467 ,  B29C45/14778 ,  H05K3/0014 ,  H05K3/0058 ,  H05K3/462 ,  B29K2995/0005 ,  B29L2031/3493 ,  H05K1/0393 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/1327 ,  H05K3/4623 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49146 ,  Y10T29/49158

摘要： A method of manufacturing an electronic circuit assembly that includes a number of electrically interconnected flexible films, each flexible film having a flexible electrical wiring circuit. The electrical wiring circuits are interconnected between film layers and the film layers are adhered to a molded backing structure. A first flexible film is formed with a pattern of flexible electrical wiring circuits created on at least one surface thereof. The first flexible film has a passage that provides an electrical connection through the flexible film. A second flexible film is formed with a pattern of flexible electrical wiring circuits created on a least one surface thereof. The second flexible film has an electrical interconnect feature that connects with the electrical passage on the first film and electrically connects the first film with the second film. The first flexible film is overlaid juxtaposed the second flexible film so that the passage is aligned adjacent the electrical interconnect feature. The first and second flexible films are placed within an open mold. The mold is closed and a plastic material is injected within the mold adjacent at least one surface of the first and second flexible films. The molten plastic adheres to the first and second flexible films and forms an integral backing structure. The backing structure and first and second flexible films together form the circuit assembly.

摘要翻译： 一种制造包括多个电互连柔性膜的电子电路组件的方法，每个柔性膜具有柔性电布线电路。 电气布线电路在膜层之间相互连接，并且膜层粘附到模制背衬结构上。 第一柔性膜形成有在其至少一个表面上形成的柔性电布线的图案。 第一柔性膜具有通过柔性膜提供电连接的通路。 第二柔性膜形成有在其至少一个表面上形成的柔性电布线的图案。 第二柔性膜具有与第一膜上的电通路连接并将第一膜与第二膜电连接的电互连特征。 第一柔性膜叠置在第二柔性膜上，使得通道对准邻近电互连特征。 第一和第二柔性膜被放置在开放模具内。 模具关闭，并且塑料材料在模具内相邻于第一和第二柔性膜的至少一个表面注入。 熔融的塑料粘附到第一和第二柔性膜上并形成整体的背衬结构。 背衬结构和第一和第二柔性膜一起形成电路组件。

公开(公告)号：US20120127696A1

公开(公告)日：2012-05-24

申请号：US12951645

申请日：2010-11-22

申请人： Andrew Z. Glovatsky

发明人： Andrew Z. Glovatsky

IPC分类号： F25D27/00

CPC分类号： F25D27/00 ,  D06F58/20 ,  D06F2058/2883 ,  F21S43/237 ,  F25D23/028 ,  F25D2327/001 ,  G02B6/001

摘要： A signature lighting system for an appliance includes a carrier, a light guide disposed adjacent the carrier, a light source disposed adjacent the light guide and in electrical communication with a source of electrical energy to selectively energize the light source, wherein the light source emits light into the light guide, and a light housing received in the carrier and substantially enclosing the light source, wherein at least one of the light housing and the carrier militates against a relative motion between the light guide and the carrier.

摘要翻译： 用于器具的签名照明系统包括载体，邻近载体设置的光导，邻近光导设置并与电能源电连通的光源，以选择性地激励光源，其中光源发光 以及容纳在所述载体中并且基本上包围所述光源的灯壳体，其中所述灯壳体和所述载体中的至少一个能够抵抗所述光导和所述载体之间的相对运动。

公开(公告)号：US07510400B2

公开(公告)日：2009-03-31

申请号：US11686101

申请日：2007-03-14

申请人： Andrew Z. Glovatsky ,  Jeff C. Lin

发明人： Andrew Z. Glovatsky ,  Jeff C. Lin

IPC分类号： H01R12/00

CPC分类号： F21V19/004 ,  F21S41/141 ,  F21V19/0025 ,  H01L2224/48091 ,  H01R13/24 ,  Y10S362/80 ,  H01L2924/00014

摘要： An LED interconnect spring clip assembly includes a housing having a center cavity and a plurality of contact features. Each contact feature has a portion retained by the housing and another portion that is operable to contact a terminal of an LED package disposed within the center cavity of the housing. The LED interconnect spring clip assembly retains the LED package when mounted to a substrate.

摘要翻译： LED互连弹簧夹组件包括具有中心腔和多个接触特征的壳体。 每个接触特征具有由壳体保持的部分和可操作以接触设置在壳体的中心空腔内的LED封装的端子的部分。 LED连接弹簧夹组件在安装到基板上时保持LED封装。

公开(公告)号：US06449839B1

公开(公告)日：2002-09-17

申请号：US09655986

申请日：2000-09-06

申请人： Andrew Z. Glovatsky ,  Thomas Krautheim ,  Robert E. Belke, Jr. ,  Vivek Amir Jairazbhoy ,  Cuong V. Pham

发明人： Andrew Z. Glovatsky ,  Thomas Krautheim ,  Robert E. Belke, Jr. ,  Vivek Amir Jairazbhoy ,  Cuong V. Pham

IPC分类号： H05K302

CPC分类号： H05K3/4084 ,  H05K1/056 ,  H05K3/062 ,  H05K3/4092 ,  H05K3/44 ,  H05K3/445 ,  H05K2201/0305 ,  H05K2201/0361 ,  H05K2201/0379 ,  H05K2201/0397 ,  H05K2201/09554 ,  H05K2203/0195 ,  H05K2203/063 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49156

摘要： A method for forming connections within a multi-layer electronic circuit board 10. In one non-limiting embodiment, the method includes selectively forming air bridges over portions of the circuit board 10 and selectively collapsing the air bridges with a metallurgical bonding tool, effective to interconnect layers of the circuit board 10.

摘要翻译： 一种用于在多层电子电路板10内形成连接的方法。在一个非限制性实施例中，该方法包括在电路板10的部分上选择性地形成空气桥，并用冶金接合工具选择性地折叠气桥， 电路板10的互连层。

公开(公告)号：US06279527B1

公开(公告)日：2001-08-28

申请号：US09690969

申请日：2000-10-17

申请人： Andrew Z. Glovatsky ,  Myron Lemecha ,  Mark Miller ,  Jay DeAvis Baker

发明人： Andrew Z. Glovatsky ,  Myron Lemecha ,  Mark Miller ,  Jay DeAvis Baker

IPC分类号： F02P2300

CPC分类号： F02M35/10249 ,  B60R16/0215 ,  F02D41/3005 ,  F02D2400/18 ,  F02D2400/21 ,  F02D2400/22 ,  F02M35/10216 ,  F02M35/10288 ,  F02M35/10301 ,  F02M35/10347 ,  F02M35/112 ,  F02M35/116 ,  F02M35/161 ,  F02M51/005 ,  H05K1/118

摘要： There is disclosed herein an apparatus for routing electrical signals in an engine having n cylinders and an intake manifold, one embodiment of which comprises: (1) a generally rigid housing generally conforming in shape with and being removably attachable to a top surface of the intake manifold; (2) at least n carrier members attached to the housing and extending outward therefrom, wherein each carrier member is arranged in general proximity with a respective cylinder; (3) a plurality of conductive circuit traces arranged on or within an underside or other surface of the housing and on or within each carrier member; and (4) at least one input/output connector for connection to at least one of an external signal source, an external power source, an external signal destination, and an external power destination, wherein each input/output connector is attached to the housing and is electrically connected to at least one of the circuit traces. Each circuit trace carried by each carrier member terminates in a termination electrically connectable with an electrical engine element, such as an ignition coil, an electronic fuel injector, a spark plug, and/or a glow plug.

公开(公告)号：US5994648A

公开(公告)日：1999-11-30

申请号：US826461

申请日：1997-03-27

申请人： Andrew Z. Glovatsky ,  Michael G. Todd ,  Cuong Van Pham

发明人： Andrew Z. Glovatsky ,  Michael G. Todd ,  Cuong Van Pham

IPC分类号： H05K1/00 ,  H05K1/11 ,  H05K1/18 ,  H05K3/28 ,  H05K3/32

CPC分类号： H05K3/326 ,  H05K1/119 ,  H05K1/183 ,  H05K1/184 ,  H05K1/0284 ,  H05K2201/09118 ,  H05K2201/09181 ,  H05K2201/09472 ,  H05K2201/09845 ,  H05K2201/1059 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10689 ,  H05K3/284 ,  Y02P70/611

摘要： An electrical circuit assembly which requires no solder processing, including an electronic component having terminations arranged on at least one of its surfaces, and a molded curviplanar substrate having circuit traces thereon and a cavity formed therein, wherein the cavity substantially conforms in shape with the electronic component. Proximate the cavity is a plurality of electrical contacts, arranged in matched relation with the respective terminations of the electronic component, with at least one of the electrical contacts being connected to at least one of the circuit traces on the substrate. The cavity and electrical contacts are dimensioned such that an interference fit is provided between the component's terminations and the electrical contacts, such that the component is held within the cavity when the component is placed therein. The component is disposed in the cavity such that its terminations are in physical and electrical connection with their respective electrical contacts.

摘要翻译： 不需要焊接处理的电路组件，包括具有布置在其表面中的至少一个上的终端的电子部件，以及在其上形成有电路迹线的模制曲面平面基板和形成在其中的空腔，其中，空腔基本上符合电子形状 零件。 近似空腔是与电子部件的各个端子匹配的多个电触点，其中至少一个电触点连接到基板上的至少一个电路迹线。 空腔和电触头的尺寸使得在部件的端子和电触点之间提供过盈配合，使得当部件放置在其中时，部件保持在腔内。 组件设置在空腔中，使得其端子与其相应的电触点物理和电连接。

公开(公告)号：US5754398A

公开(公告)日：1998-05-19

申请号：US654489

申请日：1996-05-28

申请人： Andrew Z. Glovatsky ,  Alice Zitzmann

发明人： Andrew Z. Glovatsky ,  Alice Zitzmann

IPC分类号： B29C45/14 ,  H05K1/02 ,  H05K3/00 ,  H05K7/20

CPC分类号： B29C45/14344 ,  B29C45/14754 ,  H05K3/0058 ,  B29C45/14311 ,  H05K1/0271 ,  H05K2201/09036 ,  H05K2203/1327 ,  Y10T29/49172

摘要： A circuit-carrying automotive component and a method of manufacturing the same are provided. In a preferred embodiment of the invention, the component includes a substrate made from a polymer that is molten at a predetermined elevated temperature. The component further includes a circuit board which defines an aperture therethrough adapted to receive the molten polymer at the elevated temperature and a fastener formed from the molten polymer through the aperture. The fastener is integral with the substrate and mechanically secures the circuit board to the substrate. The circuit board is made from a material that is resistant to fusing with the molten polymer at the elevated temperature.

摘要翻译： 提供一种承载电路的汽车部件及其制造方法。 在本发明的优选实施方案中，组分包括由在预定高温下熔融的聚合物制成的基材。 该部件还包括电路板，该电路板限定穿过其中的孔，其适于在升高的温度下接收熔融聚合物，以及由熔融聚合物通过该孔形成的紧固件。 紧固件与基板成一体，并将电路板机械地固定到基板上。 电路板由耐高温熔融聚合物熔化的材料制成。

公开(公告)号：US5752851A

公开(公告)日：1998-05-19

申请号：US596841

申请日：1996-02-05

申请人： Victor V. Zaderej ,  Michael G. Todd ,  Andrew Z. Glovatsky ,  Peter J. Sinkunas

发明人： Victor V. Zaderej ,  Michael G. Todd ,  Andrew Z. Glovatsky ,  Peter J. Sinkunas

IPC分类号： H01R4/48 ,  H01R12/62 ,  H05K1/14 ,  H05K3/32 ,  H05K3/36 ,  H01R9/07

CPC分类号： H01R12/62

摘要： A clip connector includes an elongated main body, attachment arms extending from the main body, and protrusions for applying pressure extending from the main body. The main body is substantially elongated and the attachment arms are at one at each end. Intermediate the attachment arms are a plurality of protrusions for creating pressure points having spaces there between and adapted to be aligned with electrical conductors so that pressure is applied to the electrical conductors and electrical connections can be made.

摘要翻译： 夹子连接器包括细长主体，从主体延伸的附接臂和用于施加从主体延伸的压力的突起。 主体基本上是细长的，连接臂在每一端处一个。 中间连接臂是多个突起，用于产生在其间具有空间并且适于与电导体对准的压力点，使得能够对电导体施加压力并且可以进行电连接。

公开(公告)号：US5600181A

公开(公告)日：1997-02-04

申请号：US449591

申请日：1995-05-24

申请人： Patrick M. Scott ,  Andrew Z. Glovatsky ,  Michael A. Mele

发明人： Patrick M. Scott ,  Andrew Z. Glovatsky ,  Michael A. Mele

IPC分类号： H01L23/31 ,  H01L25/065 ,  H01L23/34

CPC分类号： H01L23/31 ,  H01L23/3135 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/181

摘要： An on-board chip package has a hermetically sealed connector mechanically secured to a printed wiring board and electrically connected to input/output pads on the board. Chip dies are mechanically bonded to the board and then individually encapsulated with a suitable potting material. The entire assembly is coated with an encapsulating polymer, which partially overlaps the inboard side of the hermetic connector housing and which provides a relatively smooth, crevice-free outer surface. The entire assembly is then covered, in the preferred embodiment, with a metal layer, to hermetically seal the entire chip-on-board assembly.

摘要翻译： 机载芯片封装具有机械固定在印刷电路板上并与电路板上的输入/输出焊盘电连接的气密密封连接器。 将芯片机械地结合到板上，然后用合适的灌封材料单独封装。 整个组件涂覆有密封聚合物，其与气密连接器壳体的内侧部分重叠并且提供相对平滑的无缝隙的外表面。 在优选实施例中，整个组件被覆盖有金属层，以密封整个芯片上的组件。