公开(公告)号：US07883290B1

公开(公告)日：2011-02-08

申请号：US12102399

申请日：2008-04-14

申请人： Brenda Ross ,  David Ross

发明人： Brenda Ross ,  David Ross

IPC分类号： E02D29/14 ,  E03F5/08

CPC分类号： E02D29/1427

摘要： A manhole barrier system configured to prevent unauthorized access or dumping or removal of materials into manholes is provided. The manhole barrier system includes a substantially hollow sub-ring configured to be secured to the inside wall of the manhole, preferably using a layer of adhesive, and to receive a pan configured to serve as a barrier therein. The pan may be secured to the sub-ring by way of circumferentially spaced locking assemblies. The locking assemblies are further configured to allow for a limited amount of play between the pan and the sub-ring such that water trapped in the manhole may be allowed to flow upwardly out of the manhole.

摘要翻译： 提供了一种配置用于防止未经授权的访问或将材料倾倒或移走到人孔中的人孔屏障系统。 井眼阻挡系统包括基本上中空的子环，其构造成固定到人孔的内壁，优选地使用一层粘合剂，并且接收构造成用作其中的屏障的平底锅。 盘可以通过周向间隔开的锁定组件固定到子环上。 锁定组件进一步构造成允许盘和子环之间的有限量的游隙使得被困在人孔中的水可能被向上流出人孔。

公开(公告)号：US20070006894A1

公开(公告)日：2007-01-11

申请号：US11519476

申请日：2006-09-12

申请人： Peng Zhang ,  Brenda Ross

发明人： Peng Zhang ,  Brenda Ross

IPC分类号： C23G1/00 ,  B08B3/00

CPC分类号： H01L21/02074 ,  C11D1/08 ,  C11D1/40 ,  C11D1/72 ,  C11D3/164 ,  C11D11/0047 ,  Y10S134/902

摘要： Process solutions comprising one or more surfactants are used to reduce the number of defects in the manufacture of semiconductor devices. In certain preferred embodiments, the process solution of the present invention may reduce defects when employed as a rinse solution either during or after the development of the CMP processing. Also disclosed is a method for reducing the number of defects on a plurality of post-CMP processed substrates employing the process solution of the present invention.

公开(公告)号：US20050176605A1

公开(公告)日：2005-08-11

申请号：US11048576

申请日：2005-02-01

申请人： Kevin Lassila ,  Paula Uhrin ,  Peng Zhang ,  Danielle King Curzi ,  Eugene Karwacki ,  Leslie Barber ,  Brenda Ross

发明人： Kevin Lassila ,  Paula Uhrin ,  Peng Zhang ,  Danielle King Curzi ,  Eugene Karwacki ,  Leslie Barber ,  Brenda Ross

IPC分类号： C08G65/26 ,  C11D1/08 ,  C11D1/40 ,  C11D1/72 ,  C11D1/722 ,  C11D3/16 ,  C11D11/00 ,  G03F7/004 ,  G03F7/09 ,  G03F7/16 ,  G03F7/30 ,  G03F7/32 ,  G03F7/38 ,  G03F7/40 ,  G03F7/42 ,  H01L21/02 ,  H01L21/321 ,  C11D1/00 ,  C07C43/20

CPC分类号： H01L21/02052 ,  C08G65/2609 ,  C08G2650/60 ,  C11D1/08 ,  C11D1/40 ,  C11D1/72 ,  C11D1/722 ,  C11D3/164 ,  C11D11/0047 ,  G03F7/0048 ,  G03F7/091 ,  G03F7/16 ,  G03F7/168 ,  G03F7/3021 ,  G03F7/32 ,  G03F7/322 ,  G03F7/38 ,  G03F7/40 ,  G03F7/425 ,  H01L21/02074

摘要： Disclosed herein are process solutions, which may be aqueous-based, non-aqueous-based, and combinations thereof, that contain at least one alkoxylated acetylenic diol surfactant. In one aspect, the process solution comprises water and an alkoxylated acetylenic diol surfactant having the formula A: where r and t are 1 or 2, (n+m) is 1 to 30 and (p+q) is 1 to 30.

摘要翻译： 本文公开了含有至少一种烷氧基化炔二醇表面活性剂的工艺溶液，其可以是基于水性的，非水性的及其组合。 一方面，该方法包括水和具有式A的烷氧基化炔二醇表面活性剂：其中r和t为1或2，（n + m）为1〜30，（p + q）为1〜30。

公开(公告)号：US20050081885A1

公开(公告)日：2005-04-21

申请号：US10689402

申请日：2003-10-20

申请人： Peng Zhang ,  Brenda Ross

发明人： Peng Zhang ,  Brenda Ross

IPC分类号： C11D1/56 ,  C09G1/04 ,  C11D1/08 ,  C11D1/40 ,  C11D1/68 ,  C11D1/72 ,  C11D3/16 ,  C11D11/00 ,  C11D17/00 ,  H01L21/02 ,  H01L21/304 ,  H01L21/321 ,  C03C23/00

CPC分类号： H01L21/02074 ,  C11D1/08 ,  C11D1/40 ,  C11D1/72 ,  C11D3/164 ,  C11D11/0047 ,  Y10S134/902

摘要： Process solutions comprising one or more surfactants are used to reduce the number of defects in the manufacture of semiconductor devices. In certain preferred embodiments, the process solution of the present invention may reduce defects when employed as a rinse solution either during or after the development of the CMP processing. Also disclosed is a method for reducing the number of defects on a plurality of post-CMP processed substrates employing the process solution of the present invention.

摘要翻译： 使用包含一种或多种表面活性剂的工艺溶液来减少半导体器件制造中的缺陷数量。 在某些优选的实施方案中，本发明的方法溶液可以在CMP处理过程中或之后用作冲洗溶液时减少缺陷。 还公开了使用本发明的处理溶液来减少多个后CMP处理基板上的缺陷数量的方法。